TWI526514B - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- TWI526514B TWI526514B TW101120708A TW101120708A TWI526514B TW I526514 B TWI526514 B TW I526514B TW 101120708 A TW101120708 A TW 101120708A TW 101120708 A TW101120708 A TW 101120708A TW I526514 B TWI526514 B TW I526514B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- meth
- mass
- adhesive sheet
- acrylate
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims description 47
- 230000001070 adhesive effect Effects 0.000 title claims description 47
- 239000000178 monomer Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 239000004014 plasticizer Substances 0.000 claims description 25
- 229920000728 polyester Polymers 0.000 claims description 25
- 125000000524 functional group Chemical group 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 18
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid group Chemical group C(CCCCC(=O)O)(=O)O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 13
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 12
- 239000004800 polyvinyl chloride Substances 0.000 claims description 12
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 239000001361 adipic acid Substances 0.000 claims description 8
- 235000011037 adipic acid Nutrition 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical group CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
- 238000013329 compounding Methods 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 40
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 29
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 26
- 238000000034 method Methods 0.000 description 26
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000012790 adhesive layer Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 239000012948 isocyanate Substances 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 7
- 230000003078 antioxidant effect Effects 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 230000014759 maintenance of location Effects 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- DWUGCBCOJIUIDJ-UHFFFAOYSA-N C=CC(O)=O.Cl.Cl.Cl.Cl Chemical compound C=CC(O)=O.Cl.Cl.Cl.Cl DWUGCBCOJIUIDJ-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000019241 carbon black Nutrition 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 150000003304 ruthenium compounds Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WGFZZGXKRATULP-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)aniline Chemical compound NC1=CC=CC=C1OCC1OC1 WGFZZGXKRATULP-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- FWWFOUONTAAXQS-UHFFFAOYSA-N CC(C(OCCN(C)C)=O)=C.Cl.Cl.Cl.Cl Chemical compound CC(C(OCCN(C)C)=O)=C.Cl.Cl.Cl.Cl FWWFOUONTAAXQS-UHFFFAOYSA-N 0.000 description 1
- MZKHCHPOUQUCEG-UHFFFAOYSA-N CCN(CC)C1=CC=C(C=C)C=C1.Cl.Cl.Cl.Cl Chemical compound CCN(CC)C1=CC=C(C=C)C=C1.Cl.Cl.Cl.Cl MZKHCHPOUQUCEG-UHFFFAOYSA-N 0.000 description 1
- WQMPEQXPQCXUEW-UHFFFAOYSA-N CN(C)C1=CC=C(C=C)C=C1.Cl.Cl.Cl.Cl Chemical compound CN(C)C1=CC=C(C=C)C=C1.Cl.Cl.Cl.Cl WQMPEQXPQCXUEW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- AUNAPVYQLLNFOI-UHFFFAOYSA-L [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O Chemical compound [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O AUNAPVYQLLNFOI-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000008425 anthrones Chemical class 0.000 description 1
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 1
- KPTLPIAOSCGETM-UHFFFAOYSA-N benzene 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O.c1ccccc1 KPTLPIAOSCGETM-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940044949 eucalyptus oil Drugs 0.000 description 1
- 239000010642 eucalyptus oil Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 229920002554 vinyl polymer Polymers 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2427/00—Presence of halogenated polymer
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
本發明涉及黏合片。更詳細而言,涉及電子部件的製造製程中使用的切割用和/或輸送用黏合片。
通常,半導體晶片在形成電路後貼合黏合片,然後配送至切斷(切割)為元件小片、清洗、乾燥、黏合片的延伸(擴展)、從黏合片將元件小片剝離(拾取)以及貼裝等各製程。作為這些製程中所使用的切割用和/或輸送用黏合片,專利文獻1記載了在基材中使用聚氯乙烯的示例。
此外,作為與本發明相關聯的技術,在專利文獻2中,作為黏合劑組成物,公開了一種使用重量平均分子量不同的兩種(甲基)丙烯酸酯共聚物的組成物。
此外,在專利文獻3中,記載了在皮膚黏貼用黏合片中,為了防止黏合力隨時間推移而喪失,使用聚酯類增塑劑的技術。
[專利文獻1]日本特開平6-61346號公報
[專利文獻2]日本特開2001-89731號公報
[專利文獻3]日本特開2001-106990號公報
現有的聚氯乙烯作為基材的黏合片存在如下問題:即,會發生增塑劑隨著時間從基材向黏合劑層移動的問題,並且,會發生切割製程中的晶片保持性和拾取製程中的晶片的剝離性(拾取性)的問題。
本發明鑒於這種情況而完成,其主要目的在於,提供一種切割製程中的晶片保持性和拾取(pick up)製程中的晶片的剝離性不發生隨著時間而劣化的黏合片。
根據本發明,提供一種切割用和/或輸送用黏合片,在含有聚氯乙烯和聚酯類增塑劑而成的基材上層疊有黏合劑組成物,
所述黏合劑組成物以質量比10:90~90:10的比例含有重量平均分子量小於35萬且具有含官能團單體單位的(甲基)丙烯酸酯共聚物成分(A)、和重量平均分子量為35~200萬且具有含官能團單體單位的(甲
基)丙烯酸酯共聚物成分(B),並且,與所述成分(A)和所述成分(B)的官能團發生反應的交聯劑的配合量相對于成分(A)和成分(B)的總計100質量份為0.5~20質量份,
構成所述成分(A)的單體單位中10~95質量%為丙烯酸-2-乙基己酯(2-ethylhexylacrylate),構成所述成分(B)的單體單位中10~95質量%為丙烯酸丁酯(butyl acrylate)。
本案發明人最初考慮利用如專利文獻3中記載的聚酯類增塑劑來代替一直以來所使用的鄰苯二甲酸二辛酯,並進行了隨時間推移所導致的黏合力上升的評價。但是,即使在使用聚酯類增塑劑的情況下,仍會發生黏合力隨時間推移而上升,在晶片保持性和拾取性的至少一個方面無法得到令人滿意的結果。
因此,本案發明人進一步研究後發現,聚酯類增塑劑在以特定比例配合了具有上述特定的組成和分子量的兩種(甲基)丙烯酸酯共聚物的黏合劑組成物中,特別難以發生移動,並且發現藉由聚酯類增塑劑與這種黏合劑組成物間的組合,能夠得到切割製程中的晶片保持性和拾取製程中的晶片的剝離性皆不會隨著時間而發生劣化的黏合片,從而完成了本發明。
所述基材中的所述聚酯類增塑劑的配合量相對於聚氯乙烯100質量份為20~50質量份為佳。
聚酯類增塑劑為己二酸類聚酯為佳。
所述成分(A)和所述成分(B)的玻璃化轉變溫度為0℃以下為佳。
根據本發明,提供一種切割製程中的晶片保持性和拾取製程中的晶片的剝離性皆不會隨著時間而發生劣化的黏合片。
以下,對於用於實施本發明的優選方式進行說明。需要說明的是,以下進行說明的實施方式表示本技術的代表性實施方式的一例,並不能由此對本發明的範圍進行縮小解釋。
需要說明的是,本說明書中,單體單位係指來源於單體的結構單位。“份”和“%”,只要沒有特殊說明,以質量為標準。“(甲基)丙烯酸酯”為丙烯酸酯以及甲基丙烯酸酯的總稱。同樣,“(甲基)丙烯酸”等含有(甲基)的化合物係指具有“甲基”的化合物和不具有“甲基”的化合物的總稱。
1.黏合片
(1)基材
本發明的切割用和/或輸送用黏合片(以下,僅記載為“黏合片”)在含有聚氯乙烯和聚酯類增塑劑而成的基材上層疊有黏合劑組成物。
作為基材的材料,可以採用以往作為黏合片的基材材料通用的聚氯乙烯。對於基材的成型方法,可以採用例如壓延成形法、T模擠出法、吹脹法(inflation method)或鑄造法等。
基材膜的厚度沒有特別限制,例如為40~250μm,優選為50~200μm,進一步優選為60~150μm。
聚氯乙烯中配合有作為增塑劑的聚酯。作為聚酯類增塑劑,可以列舉例如:己二酸、壬二酸、癸二酸、鄰苯二甲酸、間苯二甲酸、對苯二甲酸等碳原子數2~10的脂肪族二羧酸和/或芳香族二羧酸等二羧酸、與乙二醇、丙二醇、丁二醇、新戊二醇、己二醇等碳原子數2~10的二醇發生縮聚而生成的聚酯。
作為二羧酸,優選己二酸、癸二酸(Sebacic acid)等脂肪族二羧酸,特別是在通用性、價格、歷經時間的穩定性的方面,優選己二酸。作為二醇,可以使用
直鏈狀或支鏈狀中的任意一種,可以根據需要適當選擇。二醇优选碳原子数为2~6。
聚酯類增塑劑的數均分子量沒有特別限制,通常使用約500~約4000的聚酯類增塑劑。
基材中的聚酯類增塑劑的配合量,相對於聚氯乙烯100質量份優選為20~50質量份,更加優選為25~45質量份,進一步優選為30~40質量份。
作為聚氯乙烯的增塑劑配合上述聚酯,並且與後述特定組成的黏合劑組成物一同使用,由此,基材中的增塑劑向黏合劑層的移動得以抑制,從而能夠賦予黏合片切割製程中的充分的晶片保持性和拾取製程中的良好的晶片的剝離性。
基材膜中,根據需要還可以配合抗氧化劑、紫外線吸收劑、光穩定劑、抗靜電劑、阻燃劑、染料或顏料等著色劑等各種添加劑。這些添加材料的添加量沒有特別限制,可以適當設定。
對於抗氧化劑而言,只要是以往樹脂或樹脂組成物中作為抗氧化劑而公知的抗氧化劑則可以任意使用,沒有特別限制。作為抗氧化劑,可以列舉例如:酚類(單酚類、雙酚類、高分子型酚類)、硫類、磷類等抗氧化劑。
作為紫外線吸收劑,可以列舉例如:水楊酸酯類、二苯甲酮類、苯並三唑類、氰基丙烯酸酯類等紫外線吸收劑。從紫外線吸收効果的觀點出發,優選二苯甲酮類紫外線吸收劑和苯並三唑類紫外線吸收劑,特別優選苯並三唑類紫外線吸收劑。
作為光穩定劑,可以使用例如:受阻胺類、受阻酚類等光穩定劑。
作為抗靜電劑,可以列舉四級銨鹽(Quaternary amine salt)單體等。作為四級銨鹽單體,可以列舉例如:(甲基)丙烯酸二甲氨基乙酯四級氯化物,(甲基)丙烯酸二乙氨基乙酯四級氯化物,(甲基)丙烯酸甲基乙氨基乙酯四級氯化物,對二甲氨基苯乙烯四級氯化物和對二乙氨基苯乙烯四級氯化物等,優選使用甲基丙烯酸二甲氨基乙酯四級氯化物。此外,基材的抗靜電處理也可以藉由在基材表面塗布抗靜電劑來進行。
作為阻燃劑,可以列舉例如:溴類阻燃劑、氫氧化鋁、氫氧化鎂、三氧化銻等無機類阻燃劑;包括氰尿酸三聚氰胺、尿素、三聚氰胺衍生物等含三嗪環化合物;芳香族聚磷酸酯等磷酸酯等有機類阻燃劑。
作為著色劑,可以使用有機類顏料、無機類顏料、染料、炭黑等公知或周知的著色劑。顏色任意,例如,可以為白色、象牙色、黑色、紅色、綠色、黃色和綠色等。在使膜基材為多層結構的情況下,可以在所有層中加入著色劑,也可以僅在一部分層中加入著色劑。作為顏料,可以列舉例如:酞菁類、偶氮類、縮合偶氮類、偶氮色澱類、蒽醌類、二萘嵌苯和芘酮類、靛族和硫靛類、異吲哚酮類、偶氮甲堿偶氮類、二惡嗪類、喹吖酮類、苯胺黑類、三苯甲烷類、炭黑類等有機顏料;氧化鈦類、氧化鐵類、氫氧化鐵類、氧化鉻類、尖晶石型燒成類、鉻酸類、鉻朱紅類、普魯士藍類、鋁粉末類、青銅粉末類等顏料。對於這些顏料而言,可以是藉由公知的方法實施各種分散處理後的顏料。
對于基材而言,為了提高擴展工序(Expanding step)中的延伸性,可以在表面涂布潤滑劑,或者將增滑劑揉入樹脂中。潤滑劑只要是能夠降低黏合片與擴展裝置的摩擦的物質則沒有特別限定,可以使用例如:有機矽樹脂和(改質)有機矽油等有機矽化合物,含氟樹脂、六方晶氮化硼、炭黑、二硫化鉬等。由於電子部件的製造在無塵室內進行,因此優選使用有機
矽化合物或含氟樹脂。有機矽化合物中,由於具有有機矽大分子單體單位的共聚物與抗靜電劑的相容性良好,能夠兼顧抗靜電性和擴展性,因此特別優選。
在基材的一個表面層疊有如下說明的黏合劑層,也可以在另一個表面實施壓花加工(emboss processing)。壓花加工優選以使基材表面的平均表面粗糙度(Ra)為0.3~1.5μm的方式實施。藉由將黏合片的壓花加工面設置於擴展裝置的機械台(table)側,由此,擴張製程中的基材的延伸變容易。
(2)黏合劑層
將黏合劑層層疊在基材的一個表面。黏合劑層由黏合劑組成物形成,所述黏合劑組成物含有分別以預定比率而具有含官能團單體單位且重量平均分子量相互不同的兩種(甲基)丙烯酸酯共聚物,並且所述黏合劑組成物含有與所述官能團發生反應的交聯劑。
具體而言,黏合劑組成物以質量比10:90~90:10的比例含有重量平均分子量小於35萬且具有含官能團單體單位的(甲基)丙烯酸酯共聚物成分(A),和重量平均分子量為35~200萬且具有含官能團單體單位的(甲基)丙烯酸酯共聚物成分(B)。需要說明的是,
“重量平均分子量”係以凝膠滲透色譜法(GPC)作為聚苯乙烯換算的平均分子量而測定的值。
在成分(A)的重量平均分子量超過35萬的情況下,對於被黏物的潤濕性變得不充分,切割製程中的晶片保持性變得不充分。如果成分(B)的重量平均分子量小於35萬,則黏貼到被黏物上後,黏合力隨時間推移過度增大,拾取製程中的晶片剝離性變差。此外,如果成分(B)的重量平均分子量超過200萬則對於被黏物的潤濕性變得不充分,切割製程中的晶片保持性變得不充分。
成分(A)的重量平均分子量為例如5萬、10萬、15萬、20萬、25萬、30萬、34萬,也可以為在此處例示的任意兩個數值之間的範圍內。此外,成分(B)的重量平均分子量為35萬、40萬、50萬、60萬、70萬、80萬、90萬、100萬、110萬、120萬、130萬、140萬、150萬、160萬、170萬、180萬、190萬、200萬,也可以為在此處例示的任意兩個數值之間的範圍內。成分(A)和成分(B)的質量比為例如10:90、20:80、30:70、40:60、50:50、60:40、70:30、80:20、90:10,也可以為在此處例示的任意兩個數值之間的範圍內。
對於成分(A)和成分(B)的含有比例而言,無論成分(A)過少或是過多都無法抑制隨時間推移所導致的向被黏物的潤濕擴大。
作為構成成分(A)和成分(B)的含官能團單體,可以使用乙烯化合物單體,所述乙烯化合物單體具有選自由羥基、羧基、環氧基、醯胺基、氨基、羥甲基、磺酸基、氨基磺酸基和(亞)磷酸酯基組成的官能團組的一種以上的官能團。
作為具有羥基的含官能團單體,可以列舉:例如,(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸-2-羥基丁酯及2-羥基乙烯基醚等。
作為具有羧基的含官能團單體,可以列舉:例如,(甲基)丙烯酸、巴豆酸、馬來酸、馬來酸酐、衣康酸、富馬酸、丙烯醯胺-N-乙醇酸及肉桂酸。
作為具有環氧基的含官能團單體,可以列舉:例如,(甲基)丙烯酸縮水甘油酯。
作為具有醯胺基的含官能團單體,可以列舉:例如,(甲基)丙烯醯胺。
作為具有氨基的含官能團單體,可以列舉:例如,(甲基)丙烯酸-N,N-二甲基氨基乙酯、(甲基)丙烯
酸-N-叔丁基氨基乙酯。作為含有羥甲基的含官能團單體,可以列舉:例如,N-羥甲基(甲基)丙烯醯胺。
作為構成成分(A)和成分(B),且能夠與上述含官能團單體共聚的(甲基)丙烯酸酯單體,可以採用:例如,(甲基)丙烯酸丁酯、(甲基)丙烯酸-2-丁酯、(甲基)丙烯酸叔丁酯(t-butyl(meth)acrylate)、(甲基)丙烯酸戊酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基甲酯及(甲基)丙烯酸乙氧基正丙酯(Ethoxy-n-propyl(meth)acrylate)等。
為了抑制隨時間推移所導致的向被黏物的潤濕擴大,優選使構成成分(A)的單體單位中的10~95質量%為丙烯酸-2-乙基己酯,使構成成分(B)的單體單
位中的10~95質量%為丙烯酸丁酯。丙烯酸-2-乙基己酯和丙烯酸丁酯的比例分別為10、20、30、40、50、60、70、80、90、95質量%,也可以在此處例示的任意兩個數值之間的範圍內。
優選成分(A)和成分(B)的玻璃化轉變溫度為0℃以下。另外,“玻璃化轉變溫度”係以下述的“GORDON-TAILOR公式”導出的值。
W/Tg=W1/Tg1+W2/Tg2+WN/TgN
Tg:(甲基)丙烯酸酯共聚物的玻璃化轉變溫度(℃)
TgN:單體N的均聚物的玻璃化轉變溫度(℃)
WN:單體N的質量比率(%)
交聯劑只要是與構成成分(A)和成分(B)的含官能團單體的官能團發生反應的物質則不受特別限定,例如,可以是異氰酸酯化合物,環氧化合物,亞胺化合物等。這些化合物可以單獨使用,也可以將兩種以上組合來使用。
作為異氰酸酯化合物,可以使用:例如,芳香族類異氰酸酯、脂環族類異氰酸酯及脂肪族類異氰酸酯等具有多個異氰酸酯基的化合物。
作為芳香族類異氰酸酯,可以列舉:例如,甲苯二異氰酸酯、4,4-二苯基甲烷二異氰酸酯、苯二亞甲基二異氰酸酯。
作為脂肪族類異氰酸酯,可以列舉:例如,異佛爾酮二異氰酸酯、亞甲基雙(4-環己基異氰酸酯)。
作為脂肪族異氰酸酯,可以列舉:例如,六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯。
這些異氰酸酯化合物,可以是二聚物或三聚物,此外也可以是與多元醇化合物反應而得到的加合物。
作為環氧化合物,使用例如:雙酚A型環氧化合物、雙酚F型環氧化合物、N,N-縮水甘油基苯胺、N,N-縮水甘油基甲苯胺、間N,N-縮水甘油基氨基苯基縮水甘油醚、對N,N-縮水甘油基氨基苯基縮水甘油醚、三縮水甘油基異氰酸酯、N,N,N’,N’-四縮水甘油基二氨基二苯甲烷、N,N,N’,N’-四縮水甘油基間苯二胺及N,N,N’,N’,N’’-五縮水甘油基二乙烯三胺等。
作為亞胺化合物,可以使用例如,N,N’-二苯基甲烷-4,4’-雙(1-氮丙啶甲醯胺)、三羥甲基丙烷-三-β-氮丙啶基丙酸酯、四羥甲基甲烷-三-β-氮丙啶基丙酸酯及N,N’-甲苯-2,4-雙-(1-氮丙啶甲醯胺)三亞乙基密胺等。
交聯劑的配合量相對于成分(A)和成分(B)的總計100質量份在0.5~20質量份的範圍內。在交聯劑的配合量小於0.5質量份的情況下,黏合力變得過大,拾取製程中的晶片剝離性變差,如果超過20質量份則黏合力變得過小,切割製程中的晶片保持性降低。相對于成分(A)和成分(B)的總計100質量份,交聯劑的配合量為例如0.5、1、2、4、6、8、10、12、14、16、18、20質量份,也可以在此處例示的任意兩個數值之間的範圍內。
還可以在黏合劑層中添加增黏劑、聚合引發劑、固化劑、軟化劑、抗老劑、填充劑、紫外線吸收劑、光穩定劑、光聚合性化合物及光引發劑等各種添加劑。對於增黏劑,可以使用例如:松香樹脂、松香酯樹脂、萜烯樹脂、萜烯酚樹脂、苯酚樹脂、二甲苯樹脂、香豆酮樹脂、香豆酮茚樹脂、苯乙烯樹脂、脂肪族石油樹脂、芳香族石油樹脂、脂肪族芳香族共重合石油樹脂、脂環族烴樹脂及它們的改質物、衍生物或氫加成物等。
增黏劑的配合量不受特別限定,相對於(甲基)丙烯酸酯重合體100質量份為200質量份以下,優選為30質量份以下。
2.黏合片的製造方法
本發明的黏合片可以藉由使用公知的方法將黏合劑組成物層疊在基材上來進行製造。
作為在基材上形成黏合劑層的方法,可以為例如使用凹版塗布機、逗號塗布機(comma coater)、棒式塗布機、刮刀塗布機或輥式塗布機在基材上直接塗布黏合劑組成物的方法,或者在將黏合劑組成物塗布到剝離膜上並使其乾燥後,再貼合在基材上的方法。此外,還可以藉由凸板印刷、凹板印刷、平板印刷、柔性版印刷、膠版印刷或絲網印刷等將黏合劑層印刷到基材上。
黏合劑層的厚度不受特別限定,優選以乾燥後的厚度計為約1~100μm,更優選為5~40μm。如果黏合劑層過薄則黏合力降低,切割時的晶片保持性降低,或者易於發生從環形框架的剝離。另一方面,如果黏合劑層過厚則黏合力較高,拾取製程中的晶片剝離性惡化。
藉由密閉式混煉機將聚氯乙烯樹脂、增塑劑、穩定劑、顏料、填充劑混煉後,藉由壓延加工形成70μm的厚度,得到基材。增塑劑的種類和配合量如表1~表
2所示。己二酸類聚酯使用POLYCIZER W2310(大日本油墨化學工業株式會社,數均分子量2300)。
接下來,準備具有表3所示組成和分子量的(甲基)丙烯酸酯共聚物,按照表1~表2將成分(A),成分(B)及交聯劑混合製備出黏合劑組成物。將塗布了黏合劑組成物的PET製剝離膜層疊在基材上以使乾燥後的黏合劑層的厚度達到10μm,得到黏合片。
交聯劑:2,4-甲苯二異氰酸酯的三羥甲基丙烷加合物(日本聚氨酯工業公司製,CORONATE L-45E)。
對所得黏合片進行以下的評價。將其結果示於表1~表2。
(1)黏合力
將黏合片貼合到矽晶片鏡面上,使用2kg的輥往復壓合一次並放置20分鐘後,在180°剝離、拉伸速度300mm/分鐘的條件下測定黏合力。矽晶片使用725μm厚度的晶片(6英寸)。
(2)隨時間推移所導致的黏合力上升
製成在上述的條件下壓合後並放置了20分鐘的試驗體和放置了7天的試驗體,測定各試驗體的黏合力。根據下式由放置了20分鐘的試驗體的黏合力(X)和放置了7天的試驗體的黏合力(Y)求出上升率。
上升率=(100×(Y-X))/X
根據算出的上升率,按照以下的基準,對隨時間推移所導致的黏合力上升進行評價。
A:上升率小於5%。
B:上升率為5%以上且小於10%。
C:上升率為10%以上。
(3)晶片保持性
在對黏貼有黏合片的矽晶片進行切割時,計算黏合片上保持的晶片的數量。切割使用以下的裝置。向
黏合片的切削深度設為30μm,晶片尺寸設為3mm見方。
裝置:DISCO公司 DAD341
切割刀片:DISCO公司 G1A851SD 400R13B01
切割刀片旋轉數:40,000rpm
切割刀片進給速度:40mm/秒
切削水溫度:25℃
切削水量:1.0L/分鐘。
根據晶片數量,按照以下的基準對晶片保持性進行評價。
A:保持在黏合片上的晶片為95%以上。
B:保持在黏合片上的晶片為80%以上。
C:保持在黏合片上的晶片小於80%。
(4)拾取性
在上述條件下將矽晶片切割後,在以下的條件下進行拾取,計算能夠拾取的晶片的數量。
拾取裝置:佳能機械公司製CAP-300II
擴展量:5mm
頂針形狀:150μmR
頂針數量:4根
頂針頂推(Push up)高度:0.3mm
根據能夠拾取的晶片數量,按照以下的基準對拾取性進行評價。
A:90%以上的晶片能夠拾取。
B:80%以上的晶片能夠拾取。
C:小於80%的晶片能夠拾取。
在使用己二酸類聚酯作為增塑劑的全部實施例中,隨時間推移所導致的黏合力上升較小,晶片保持性和拾取性優良。在使用對苯二甲酸類聚酯作為增塑劑的實施例6中,雖然發生了隨時間推移所導致的黏合力上升,但與使用鄰苯二甲酸二辛酯的情況(比較例1)相比,仍能夠獲得良好的結果。
在比較例2~10中,無論是否使用己二酸類聚酯作為增塑劑,由於構成黏合劑層的共聚物成分或交聯劑的物性和配合量不合適,因此無法獲得良好的結果。
本發明所涉及的黏合片,由於切割製程中的晶片保持性和拾取製程中的晶片的剝離性優良,因此作為切割用和/或輸送用的黏合片而適用於電子部件的製造。
Claims (4)
- 一種切割用和/或輸送用黏合片,在含有聚氯乙烯和聚酯類增塑劑而成的基材上層疊有黏合劑組成物,其中,所述黏合劑組成物以質量比10:90~90:10的比例含有重量平均分子量小於35萬且具有含官能團單體單位的(甲基)丙烯酸酯共聚物成分(A)、和重量平均分子量為35~200萬且具有含官能團單體單位的(甲基)丙烯酸酯共聚物成分(B),並且,與所述成分(A)和所述成分(B)的官能團發生反應的交聯劑的配合量相對于成分(A)和成分(B)的總計100質量份為0.5~20質量份,構成所述成分(A)的單體單位中10~95質量%為丙烯酸-2-乙基己酯,構成所述成分(B)的單體單位中10~95質量%為丙烯酸丁酯。
- 如申請專利範圍1所述的黏合片,其中,所述基材中的所述聚酯類增塑劑的配合量相對於聚氯乙烯100質量份為20~50質量份。
- 如申請專利範圍第1項所述的黏合片,其中,聚酯類增塑劑為己二酸類聚酯。
- 如申請專利範圍第1項~第3項中任一項所述的黏合片,其中,所述成分(A)和所述成分(B)的玻璃化轉變溫度為0℃以下。
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