WO2013001959A1 - 粘着シート - Google Patents
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- WO2013001959A1 WO2013001959A1 PCT/JP2012/063629 JP2012063629W WO2013001959A1 WO 2013001959 A1 WO2013001959 A1 WO 2013001959A1 JP 2012063629 W JP2012063629 W JP 2012063629W WO 2013001959 A1 WO2013001959 A1 WO 2013001959A1
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- Prior art keywords
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- mass
- adhesive sheet
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- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 47
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 47
- 239000000178 monomer Substances 0.000 claims abstract description 33
- 125000000524 functional group Chemical group 0.000 claims abstract description 25
- 239000004014 plasticizer Substances 0.000 claims abstract description 25
- 229920000728 polyester Polymers 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 22
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- 239000003431 cross linking reagent Substances 0.000 claims abstract description 10
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 39
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- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 abstract description 3
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L33/04—Homopolymers or copolymers of esters
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- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Definitions
- the present invention relates to an adhesive sheet. More specifically, the present invention relates to a pressure-sensitive adhesive sheet for dicing and / or conveyance used in the manufacturing process of electronic components.
- the adhesive sheet is usually bonded after the circuit is formed, and then cut into element pieces (dicing), washed, dried, stretched (expanded) the adhesive sheet, and peeled off the element pieces from the adhesive sheet. (Pickup), mounting and other processes.
- dicing and / or conveying pressure-sensitive adhesive sheet used in these steps Patent Document 1 describes an example in which polyvinyl chloride is used as a base material.
- Patent Document 2 discloses a composition using two kinds of (meth) acrylic acid ester copolymers having different weight average molecular weights as an adhesive composition.
- Patent Document 3 describes a technique of using a polyester plasticizer in an adhesive sheet for skin application in order to prevent loss of adhesive strength over time.
- the present invention has been made in view of such circumstances, and a main object thereof is to provide a pressure-sensitive adhesive sheet that does not cause deterioration over time in chip retainability in the dicing process and chip peelability in the pickup process.
- a pressure-sensitive adhesive sheet for dicing and / or transporting in which a pressure-sensitive adhesive composition is laminated on a substrate containing polyvinyl chloride and a polyester plasticizer,
- the pressure-sensitive adhesive composition has a weight average molecular weight of less than 350,000 and a (meth) acrylic acid ester copolymer component (A) having a functional group-containing monomer unit, a weight average molecular weight of 35 to 2 million and a functional group.
- the crosslinking agent that reacts with the functional group is 0.5 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B)
- 10 to 95% by mass of the monomer units constituting the component (A) is 2-ethylhexyl acrylate
- 10 to 95% by mass of the monomer units constituting the component (B) is butyl.
- An adhesive sheet for dicing and / or conveyance which is an acrylate is provided.
- the present inventors first considered the use of a polyester plasticizer as described in Patent Document 3 in place of the conventionally used dioctyl phthalate, and evaluated the increase in adhesive strength over time. It was. However, even when a polyester plasticizer is used, the adhesive force increases with time, and satisfactory results cannot be obtained in at least one of the chip holding property and the pickup property.
- the polyester plasticizer is an adhesive composition in which two types of (meth) acrylic acid ester copolymers having the above specific composition and molecular weight are blended in a specific ratio.
- the polyester plasticizer and such an adhesive composition does not cause deterioration over time in chip retention in the dicing process and chip peeling in the pickup process. It was found that an adhesive sheet was obtained, and the present invention was completed.
- the compounding amount of the polyester plasticizer in the substrate is 20 to 50 parts by mass with respect to 100 parts by mass of polyvinyl chloride.
- the polyester plasticizer is an adipic acid polyester.
- the glass transition temperature of the said component (A) and the said component (B) is 0 degrees C or less.
- an adhesive sheet that does not cause deterioration over time in chip retention in the dicing process and chip peeling in the pickup process.
- the monomer unit means a structural unit derived from a monomer. “Parts” and “%” are based on mass unless otherwise specified. “(Meth) acrylate” is used as a general term for acrylate and methacrylate. Similarly, a compound containing (meth) such as “(meth) acrylic acid” is also used as a general term for a compound having “meth” and a compound not having it.
- Adhesive Sheet (1) Substrate
- the dicing and / or conveying adhesive sheet according to the present invention (hereinafter also simply referred to as “adhesive sheet”) is a group comprising polyvinyl chloride and a polyester plasticizer.
- a pressure-sensitive adhesive composition is laminated on a material.
- the base material conventionally used polyvinyl chloride can be adopted as the base material of the pressure-sensitive adhesive sheet.
- a calendar molding method, a T-die extrusion method, an inflation method, or a casting method can be employed as the base material molding method.
- the thickness of the base film is not particularly limited, but is, for example, 40 to 250 ⁇ m, preferably 50 to 200 ⁇ m, and more preferably 60 to 150 ⁇ m.
- Polyvinyl chloride is mixed with polyester as a plasticizer.
- the polyester plasticizer include dicarboxylic acids such as aliphatic dicarboxylic acids having 2 to 10 carbon atoms such as adipic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and / or aromatic dicarboxylic acids.
- dicarboxylic acids such as aliphatic dicarboxylic acids having 2 to 10 carbon atoms such as adipic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and / or aromatic dicarboxylic acids.
- polyesters obtained by polycondensation of an acid and a glycol having 2 to 10 carbon atoms such as ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol, hexanediol and the like.
- dicarboxylic acid aliphatic dicarboxylic acids such as adipic acid and sebacic acid are preferable, and adipic acid is particularly preferable in terms of versatility, cost, and stability over time.
- glycol either linear or side chain can be used, and it is appropriately selected according to need.
- the glycol preferably has 2 to 6 carbon atoms.
- the number average molecular weight of the polyester plasticizer is not particularly limited, but usually about 500 to 4000 is used.
- the blending amount of the polyester plasticizer in the substrate is preferably 20 to 50 parts by mass, more preferably 25 to 45 parts by mass, and more preferably 30 to 40 parts by mass with respect to 100 parts by mass of polyvinyl chloride.
- the above polyester as a plasticizer for polyvinyl chloride and using it together with an adhesive composition having a specific composition to be described later, it is possible to suppress the plasticizer in the base material from moving to the adhesive layer, which is sufficient in the dicing process.
- the chip can be imparted with excellent chip retention and good chip release in the pickup process.
- the base film may contain various additives such as antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, flame retardants, and coloring agents such as dyes and pigments, if necessary.
- additives such as antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, flame retardants, and coloring agents such as dyes and pigments, if necessary.
- the addition amount of these additives is not particularly limited, and can be set as appropriate.
- the antioxidant is not particularly limited as long as it is conventionally known as an antioxidant in a resin or resin composition.
- examples of the antioxidant include phenol-based (monophenol-based, bisphenol-based, polymer-based phenol-based), sulfur-based and phosphorus-based antioxidants.
- Examples of the ultraviolet absorber include salicylate-based, benzophenone-based, benzotriazole-based, and cyanoacrylate-based ultraviolet absorbers. From the viewpoint of ultraviolet absorption effect, benzophenone ultraviolet absorbers and benzotriazole ultraviolet absorbers are preferred, and benzotriazole ultraviolet absorbers are particularly preferred.
- a light stabilizer such as a hindered amine or hindered phenol can be used.
- the antistatic agent examples include quaternary amine salt monomers.
- the quaternary amine salt monomer examples include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p- Examples thereof include dimethylaminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride, and dimethylaminoethyl methacrylate quaternary chloride is preferably used.
- the antistatic treatment of the base material can be performed by applying an antistatic agent to the surface of the base material.
- flame retardants include brominated flame retardants, inorganic flame retardants such as aluminum hydroxide, magnesium hydroxide, and antimony trioxide, triazine ring-containing compounds including melamine cyanurate, urea, melamine derivatives, and aromatic polyphosphines.
- examples include organic flame retardants such as phosphates such as fats.
- colorant known or well-known colorants such as organic pigments, inorganic pigments, dyes, and carbon black can be used.
- the color is arbitrary, and can be, for example, white, ivory, black, red, blue, yellow, green, and the like.
- a colorant may be added to all layers, or a colorant may be added to only a part of the layers.
- the pigment examples include phthalocyanine, azo, condensed azo, azo lake, anthraquinone, perylene / perinone, indigo / thioindigo, isoindolinone, azomethine azo, dioxazine, quinacridone, aniline black , Organic pigments such as triphenylmethane and carbon black, titanium oxide, iron oxide, iron hydroxide, chromium oxide, spinel firing, chromic acid, chrome vermilion, bitumen, aluminum powder Pigments such as bronze and bronze powders. These pigments may be subjected to various dispersion treatments by a known method.
- a sliding agent can be applied to the surface of the base material or kneaded into the resin.
- the slip agent is not particularly limited as long as it can reduce the friction between the pressure-sensitive adhesive sheet and the expanding device.
- silicone compounds such as silicone resin and (modified) silicone oil, fluororesin, hexagonal boron nitride, carbon black Molybdenum disulfide can be used. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin.
- a copolymer having a silicone macromonomer unit is particularly preferable because it has good compatibility with an antistatic agent and can achieve both antistatic properties and expandability.
- the adhesive layer described below is laminated on one side of the substrate, but the other side may be embossed.
- the embossing is preferably performed so that the average surface roughness (Ra) of the substrate surface is 0.3 to 1.5 ⁇ m.
- the pressure-sensitive adhesive layer includes two (meth) acrylic acid ester copolymers each having a functional group-containing monomer unit and having different weight average molecular weights in a predetermined ratio, and is a cross-linked that reacts with the functional group It is formed with the adhesive composition containing an agent.
- the pressure-sensitive adhesive composition comprises a (meth) acrylic acid ester copolymer component (A) having a weight average molecular weight of less than 350,000 and having a functional group-containing monomer unit, and a weight average molecular weight of 35 to 200. And (meth) acrylic acid ester copolymer component (B) having a functional group-containing monomer unit in a mass ratio of 10:90 to 90:10.
- the “weight average molecular weight” is a value measured as an average molecular weight in terms of polystyrene by gel permeation chromatography (GPC).
- the weight average molecular weight of the component (A) exceeds 350,000, the wettability with respect to the adherend becomes insufficient, and the chip retainability in the dicing process becomes insufficient.
- the weight average molecular weight of the component (B) is less than 350,000, the adhesive strength becomes excessive with time after being applied to the adherend, and the chip peelability in the pick-up process deteriorates.
- the weight average molecular weight of a component (B) exceeds 2 million, the wettability with respect to a to-be-adhered body will become inadequate, and the chip
- the weight average molecular weight of the component (A) is, for example, 50,000, 100,000, 150,000, 200,000, 250,000, 300,000, 340,000, and within the range between any two of the numerical values exemplified here. There may be.
- the weight average molecular weight of the component (B) is 350,000, 400,000, 500,000, 600,000, 700,000, 800,000, 900,000, 1,000,000, 1.1 million, 1.2 million, 1.3 million, 1.4 million, 1.5 million. 1.6 million, 1.7 million, 1.8 million, 1.9 million, 2 million, and may be within the range between any two of the numerical values exemplified here.
- the mass ratio of the component (A) to the component (B) is, for example, 10:90, 20:80, 30:70, 40:60, 50:50, 60:40, 70:30, 80:20, 90: It may be within a range between any two of the numerical values exemplified here.
- Examples of the functional group-containing monomer constituting component (A) and component (B) include hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group, and (sub)
- a vinyl compound monomer having one or more functional groups selected from a functional group consisting of phosphate ester groups can be used.
- Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxyvinyl ether.
- Examples of the functional group-containing monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide-N-glycolic acid and cinnamic acid.
- Examples of the functional group-containing monomer having an epoxy group include glycidyl (meth) acrylate.
- Examples of the functional group-containing monomer having an amide group include (meth) acrylamide.
- Examples of the functional group-containing monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate and Nt-butylaminoethyl (meth) acrylate.
- Examples of the functional group-containing monomer having a methylol group include N-methylol (meth) acrylamide.
- Examples of the (meth) acrylic acid ester monomer constituting the component (A) and the component (B) and copolymerizable with the functional group-containing monomer include, for example, butyl (meth) acrylate, 2-butyl (meta ) Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (Meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (
- 10 to 95% by mass of monomer units constituting component (A) is 2-ethylhexyl acrylate, and a single amount constituting component (B) It is preferable that 10 to 95% by mass of the body unit is butyl acrylate.
- the proportions of 2-ethylhexyl acrylate and butyl acrylate are 10, 20, 30, 40, 50, 60, 70, 80, 90, and 95% by mass, respectively, between any two of the numerical values exemplified here. May be within the range of
- the glass transition temperature of component (A) and component (B) is preferably 0 ° C. or lower.
- the “glass transition temperature” is a value derived from the following “GORDON-TAILOR equation”.
- W / Tg W 1 / Tg 1 + W 2 / Tg 2 + W n / Tg n Tg: Glass transition temperature (° C.) of (meth) acrylic acid ester copolymer
- Tg n Glass transition temperature of homopolymer of monomer n (° C.)
- W n mass fraction of monomer n (%)
- a crosslinking agent will not be specifically limited if it reacts with the functional group of the functional group containing monomer which comprises a component (A) and a component (B),
- it can be an isocyanate compound, an epoxy compound, an imine compound, etc. These compounds may be used alone or in combination of two or more.
- the isocyanate compound for example, a compound having a plurality of isocyanate groups such as aromatic isocyanate, alicyclic isocyanate and aliphatic isocyanate is used.
- aromatic isocyanate include tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.
- alicyclic isocyanate include isophorone diisocyanate and methylenebis (4-cyclohexyl isocyanate).
- the aliphatic isocyanate include hexamethylene diisocyanate and trimethylhexamethylene diisocyanate. These isocyanate compounds may be dimers or trimers, or may be adducts obtained by reacting polyol compounds.
- epoxy compound examples include bisphenol A type epoxy compound, bisphenol F type epoxy compound, N, N-glycidyl aniline, N, N-glycidyl toluidine, mN, N-glycidylaminophenyl glycidyl ether, pN, N Glycidylaminophenyl glycidyl ether, triglycidyl isocyanurate, N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine and N, N, N ′, N ′, N ′′ -pentaglycidyldiethylenetriamine and the like are used.
- imine compound examples include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylolmethane-tri- ⁇ .
- imine compound examples include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylolmethane-tri- ⁇ .
- -Aziridinylpropionate and N, N'-toluene-2,4-bis- (1-aziridinecarboxamide) triethylenemelamine can be used.
- the blending amount of the crosslinking agent is in the range of 0.5 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B).
- the blending amount of the crosslinking agent is, for example, 0.5, 1, 2, 4, 6, 8, 10, 12, 14, 16, 18 with respect to 100 parts by mass in total of the component (A) and the component (B). 20 parts by mass, and may be within a range between any two of the numerical values exemplified here.
- tackifiers such as tackifiers, polymerization initiators, curing agents, softeners, anti-aging agents, fillers, UV absorbers, light stabilizers, photopolymerizable compounds and photoinitiators are added to the adhesive layer May be.
- the tackifier include rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, fat Aromatic aromatic copolymer petroleum resins, alicyclic hydrocarbon resins, modified products, derivatives or hydrogenated products thereof are used.
- the compounding amount of the tackifier is not particularly limited, and is 200 parts by mass or less, preferably 30 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester polymer.
- the pressure-sensitive adhesive sheet according to the present invention can be produced by laminating a pressure-sensitive adhesive composition on a substrate using a known method.
- a method of forming the pressure-sensitive adhesive layer on the substrate for example, a method of directly applying the pressure-sensitive adhesive composition on the substrate using a gravure coater, comma coater, bar coater, knife coater or roll coater, or a release film
- a pressure-sensitive adhesive composition is applied and dried and then bonded to a substrate.
- the thickness of the pressure-sensitive adhesive layer is not particularly limited, but the thickness after drying is preferably about 1 to 100 ⁇ m, more preferably 5 to 40 ⁇ m. If the pressure-sensitive adhesive layer is too thin, the pressure-sensitive adhesive strength is reduced, chip retention during dicing is reduced, and peeling from the ring frame is likely to occur. On the other hand, when the pressure-sensitive adhesive layer is too thick, the pressure-sensitive adhesive force is high, and the chip peelability in the pickup process is deteriorated.
- a polyvinyl chloride resin, a plasticizer, a stabilizer, a pigment, and a filler were kneaded with a Banbury mixer and then formed into a thickness of 70 ⁇ m by calendering to obtain a substrate.
- the types and blending amounts of plasticizers are as shown in Tables 1 and 2.
- Polysizer W2310 (Dainippon Ink Chemical Co., Ltd., number average molecular weight 2300) was used as the adipic acid-based polyester.
- a (meth) acrylic acid ester copolymer having the composition and molecular weight shown in Table 3 is prepared, and the component (A), the component (B) and the crosslinking agent are mixed according to Tables 1 and 2, and an adhesive composition was prepared.
- the release film made of PET coated with the pressure-sensitive adhesive composition so as to have a thickness of the pressure-sensitive adhesive layer after drying was laminated on the substrate to obtain a pressure-sensitive adhesive sheet.
- Crosslinking agent Trimethylolpropane adduct of 2,4-tolylene diisocyanate (manufactured by Nippon Polyurethane Industry, Coronate L-45E).
- Adhesive strength An adhesive sheet was bonded to the mirror surface of a silicon wafer, and the adhesive strength was measured under the conditions of 180 ° peeling and a pulling speed of 300 mm / min after pressing with one reciprocation of a 2 kg roller and leaving for 20 minutes.
- As the silicon wafer a 725 ⁇ m thick wafer (6 inches) was used.
- Chip retention When the silicon wafer with the adhesive sheet attached was diced, the number of chips held on the adhesive sheet was counted.
- the following apparatus was used for dicing. The amount of cut into the adhesive sheet was 30 ⁇ m, and the chip size was 3 mm square. Apparatus: DISCO DAD341 Dicing blade: DISCO G1A851SD400R13B01 Dicing blade rotation speed: 40,000 rpm Dicing blade feed rate: 40 mm / sec Cutting water temperature: 25 ° C. Cutting water amount: 1.0 L / min.
- the chip retention was evaluated from the number of chips according to the following criteria.
- the pick-up property was evaluated according to the following criteria from the number of chips that could be picked up. A: More than 90% of chips could be picked up. B: More than 80% of chips could be picked up. C: Chips of less than 80% could be picked up.
- the pressure-sensitive adhesive sheet according to the present invention is suitable for manufacturing electronic components as a pressure-sensitive adhesive sheet for dicing and / or transporting because it has excellent chip retention in the dicing process and peelability of the chip in the pick-up process.
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Abstract
Description
前記粘着剤組成物が重量平均分子量35万未満であり且つ官能基含有単量体単位を有する(メタ)アクリル酸エステル共重合体成分(A)と、重量平均分子量35~200万であり且つ官能基含有単量体単位を有する(メタ)アクリル酸エステル共重合体成分(B)とを、質量比10:90~90:10の割合で含み、かつ、前記成分(A)及び前記成分(B)の官能基と反応する架橋剤の配合量が、成分(A)と成分(B)の合計100質量部に対して0.5~20質量部であり、
前記成分(A)を構成する単量体単位のうち10~95質量%が2-エチルへキシルアクリレートであり、前記成分(B)を構成する単量体単位のうち10~95質量%がブチルアクリレートであるダイシング用及び/又は搬送用の粘着シートが提供される。
好ましくは、ポリエステル系可塑剤がアジピン酸系ポリエステルである。
好ましくは、前記成分(A)及び前記成分(B)のガラス転移温度が0℃以下である。
(1)基材
本発明に係るダイシング用及び/又は搬送用の粘着シート(以下、単に「粘着シート」とも記載する)は、ポリ塩化ビニルとポリエステル系可塑剤とを含有してなる基材上に粘着剤組成物が積層されたものである。
基材の片面には粘着剤層が積層される。粘着剤層は、それぞれが官能基含有単量体単位を有し且つ重量平均分子量が互いに異なる2種の(メタ)アクリル酸エステル共重合体を所定比率で含み、かつ前記官能基と反応する架橋剤を含有する粘着剤組成物によって形成される。
カルボキシル基を有する官能基含有単量体としては、例えば、(メタ)アクリル酸、クロトン酸、マレイン酸、無水マレイン酸、イタコン酸、フマール酸、アクリルアミド-N-グリコール酸およびケイ皮酸が挙げられる。
エポキシ基を有する官能基含有単量体としては、例えば、グリシジル(メタ)アクリレートが挙げられる。
アミド基を有する官能基含有単量体としては、例えば、(メタ)アクリルアミドが挙げられる。
アミノ基を有する官能基含有単量体としては、例えば、N,N-ジメチルアミノエチル(メタ)アクリレート、N-t-ブチルアミノエチル(メタ)アクリレートがある。メチロール基を有する官能基含有単量体としては、例えば、N-メチロール(メタ)アクリルアミドが挙げられる。
W/Tg=W1/Tg1+W2/Tg2+Wn/Tgn
Tg:(メタ)アクリル酸エステル共重合体のガラス転移温度(℃)
Tgn:モノマnのホモポリマのガラス転移温度(℃)
Wn:モノマnの質量分率(%)
芳香族系イソシアネートとしては、例えば、トリレンジイソシアネート、4,4-ジフェニルメタンジイソシアネート、キシリレンジイソシアネートが挙げられる。
脂環族系イソシアネートとしては、例えば、イソホロンジイソシアネート、メチレンビス(4-シクロヘキシルイソシアネート)が挙げられる。
脂肪族イソシアネートとしては、例えば、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネートが挙げられる。
これらのイソシアネート化合物は、二量体や三量体であってもよく、またポリオール化合物を反応させて得られるアダクト体であってもよい。
本発明に係る粘着シートは、公知の手法を用いて基材上に粘着剤組成物を積層することにより製造できる。
架橋剤:2,4-トリレンジイソシアネートのトリメチロールプロパンアダクト体(日本ポリウレタン工業製、コロネートL-45E)。
シリコンウエハ鏡面に粘着シートを貼り合わせ、2kgロ-ラの1往復で圧着し20分放置後に、180°ピ-ル、引張り速度300mm/分の条件で粘着力を測定した。シリコンウエハには、725μm厚のウエハ(6インチ)を用いた。
上述の条件にて圧着後20分放置の試験体と7日放置の試験体を作成し、それぞれの粘着力を測定した。20分放置の試験体の粘着力(X)および7日放置の試験体の粘着力(Y)から次の式に従って上昇率を求めた。
上昇率=(100×(Y-X))/X
A:上昇率が5%未満。
B:上昇率が5%以上10%未満。
C:上昇率が10%以上。
粘着シートを貼付したシリコンウエハをダイシングした際に、粘着シートに保持されているチップの数を数えた。ダイシングには以下の装置を用いた。粘着シートへの切り込み量は30μmとし、チップサイズは3mm角とした。
装置:DISCO社 DAD341
ダイシングブレード:DISCO社 G1A851SD400R13B01
ダイシングブレード回転数:40,000rpm
ダイシングブレード送り速度:40mm/秒
切削水温度:25℃
切削水量:1.0L/分。
A:粘着シートに保持されているチップが95%以上。
B:粘着シートに保持されているチップが80%以上。
C:粘着シートに保持されているチップが80%未満。
シリコンウエハを上述の条件にてダイシング後、以下の条件でピックアップを行い、ピックアップできたチップの数を数えた。
ピックアップ装置:キヤノンマシナリー社製CAP-300II
エキスパンド量:5mm
ニードルピン形状:150μmR
ニードルピン数:4本
ニードルピン突き上げ高さ:0.3mm
A:90%以上のチップがピックアップできた。
B:80%以上のチップがピックアップできた。
C:80%未満のチップがピックアップできた。
可塑剤としてアジピン酸系ポリエステルを用いた全ての実施例では、経時による粘着力上昇が小さく、チップ保持性及びピックアップ性が優れていた。可塑剤としてテレフタル酸系ポリエステルを用いた実施例6では、経時による粘着力上昇が起こってしまったが、フタル酸ジオクチルを用いた場合(比較例1)よりは良好な結果が得られた。
比較例2~10では、可塑剤としてアジピン酸系ポリエステルを用いているにも関わらず、粘着剤層を構成する共重合体成分又は架橋剤の物性や配合量が適正でないため、良好な結果が得られなかった。
Claims (4)
- ポリ塩化ビニルとポリエステル系可塑剤とを含有してなる基材上に粘着剤組成物が積層されたダイシング用及び/又は搬送用の粘着シートであって、
前記粘着剤組成物は、重量平均分子量35万未満であり且つ官能基含有単量体単位を有する(メタ)アクリル酸エステル共重合体成分(A)と、重量平均分子量35~200万であり且つ官能基含有単量体単位を有する(メタ)アクリル酸エステル共重合体成分(B)とを、質量比10:90~90:10の割合で含み、かつ、前記成分(A)及び前記成分(B)の官能基と反応する架橋剤の配合量が、成分(A)と成分(B)の合計100質量部に対して0.5~20質量部であり、
前記成分(A)を構成する単量体単位のうち10~95質量%が2-エチルへキシルアクリレートであり、前記成分(B)を構成する単量体単位のうち10~95質量%がブチルアクリレートであるダイシング用及び/又は搬送用の粘着シート。 - 前記基材中の前記ポリエステル系可塑剤の配合量が、ポリ塩化ビニル100質量部に対して、20~50質量部である請求項1記載の粘着シート。
- ポリエステル系可塑剤がアジピン酸系ポリエステルである請求項1又は2記載の粘着シート。
- 前記成分(A)及び前記成分(B)のガラス転移温度が0℃以下である請求項1~3のいずれか一項に記載の粘着シート。
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US14/128,493 US9422462B2 (en) | 2011-06-27 | 2012-05-28 | Adhesive sheet |
JP2013522540A JP6000949B2 (ja) | 2011-06-27 | 2012-05-28 | 粘着シート |
CN201280030235.4A CN103608902B (zh) | 2011-06-27 | 2012-05-28 | 粘合片 |
KR1020137033975A KR101908936B1 (ko) | 2011-06-27 | 2012-05-28 | 점착 시트 |
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JP (1) | JP6000949B2 (ja) |
KR (1) | KR101908936B1 (ja) |
CN (1) | CN103608902B (ja) |
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WO2019069577A1 (ja) * | 2017-10-05 | 2019-04-11 | デンカ株式会社 | 粘着性シート、保護材及びワイヤーハーネス |
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WO2015152158A1 (ja) * | 2014-03-31 | 2015-10-08 | 株式会社Joled | 積層体および積層体の剥離方法ならびに可撓性デバイスの製造方法 |
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KR102184481B1 (ko) * | 2017-04-18 | 2020-11-30 | (주)엘지하우시스 | 장식 시트 |
CN108587501A (zh) * | 2018-04-17 | 2018-09-28 | 东莞市航达电子有限公司 | 一种晶元切割扩张保护膜及其制作方法 |
TWI692516B (zh) * | 2018-11-30 | 2020-05-01 | 財團法人中華民國紡織業拓展會 | 無二異氰酸酯之感壓膠複合材料 |
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TWI526514B (zh) | 2016-03-21 |
JPWO2013001959A1 (ja) | 2015-02-23 |
KR101908936B1 (ko) | 2018-10-17 |
KR20140045432A (ko) | 2014-04-16 |
US9422462B2 (en) | 2016-08-23 |
JP6000949B2 (ja) | 2016-10-05 |
US20140134431A1 (en) | 2014-05-15 |
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TW201305308A (zh) | 2013-02-01 |
MY164532A (en) | 2017-12-29 |
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