JP6506744B2 - 半導体検査用の耐熱性粘着シート、及び半導体検査方法 - Google Patents
半導体検査用の耐熱性粘着シート、及び半導体検査方法 Download PDFInfo
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- JP6506744B2 JP6506744B2 JP2016519248A JP2016519248A JP6506744B2 JP 6506744 B2 JP6506744 B2 JP 6506744B2 JP 2016519248 A JP2016519248 A JP 2016519248A JP 2016519248 A JP2016519248 A JP 2016519248A JP 6506744 B2 JP6506744 B2 JP 6506744B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
- C08G18/673—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen containing two or more acrylate or alkylacrylate ester groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
- C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
- C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
- C08G18/8029—Masked aromatic polyisocyanates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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Description
・半導体ウエハのダイシング
・性能検査(常温)
・パッケージング
・性能検査(高温および常温)
上記の工程では、高温状態で異常があるチップは、パッケージング後の性能検査まで判別することができない。そのため、高温状態で異常があるチップも全てパッケージングしなければならず、パッケージングコストの増大につながっていた。
この知見に基づき、上記範囲の熱収縮率を有する基材上に上記組成の粘着剤層が設けられた粘着シートを用いることによって、半導体ウエハを加温した状態で検査することが可能になることを見出し、本発明の完成に到った。
好ましくは、前記基材が、二軸延伸されたフィルムであることを特徴とする。
好ましくは、前記粘着シートの粘着剤層が、剥離付与剤を含む。
好ましくは、前記剥離付与剤は、シリコーン系グラフト共重合体からなる。
好ましくは、前記剥離付与剤の添加量は、(メタ)アクリル酸エステル共重合体100質量部に対して0.1〜20質量部である。
好ましくは、前記多官能イソシアネート硬化剤が、イソシアネート基を3個以上有する。
好ましくは、前記光重合開始剤が、23℃から10℃/分の昇温速度で昇温したときの質量減少率10%となる温度が250℃以上である。
好ましくは、前記吸着工程の前に、粘着シートを半導体ウエハに貼り付ける貼付工程と、前記半導体ウエハをダイシングして前記半導体チップにするダイシング工程をさらに備える。
(1)基材
(2)光硬化型粘着剤
(2−1)粘着付与樹脂を実質的に含まない。
(2−2)(メタ)アクリル酸エステル共重合体
(2−3)光重合性化合物
(2−4)多官能イソシアネート硬化剤
(2−5)光重合開始剤
(1)貼付工程
(2)ダイシング工程
(3)吸着工程
(4)検査工程
(5)活性光線照射工程
(6)ピックアップ工程
本発明に係る粘着シートは、熱収縮性のある基材に光硬化型粘着剤層(以下、単に「粘着剤層」とも称する)を積層してなり、粘着剤層に粘着付与樹脂を実質的に含まないことを特徴とする。本発明に係る粘着シートは、加温された場合にも変形することがない。また、本発明に係る粘着シートは、粘着付与樹脂の軟化に起因した粘着剤層の軟化がほとんど又は全く生じないため、半導体ウエハに過度に密着することがない。従って、本発明に係る粘着シートでは、粘着シートの変形による検査時間の長期化や半導体チップの破損などを防止できる。更に、紫外線等の照射により粘着剤層の十分な接着力の低下が得られ、ピックアップ不良や糊残りを防止できる。
基材の材料としては、120℃で15分加熱したときの熱収縮率が1.0%〜5.0%であり、1.5%〜4.0%であることが好ましい。熱収縮率が1.0%より小さいと、加温した時の基材の収縮が小さく、基材の熱膨張などによって粘着シートが変形するおそれがある。また、熱収縮率が5.0%より大きいと、加温した時の基材の収縮が大きすぎて、リングフレームから粘着シートが剥がれたり、基材が破断したりするおそれがある。ここで熱収縮率とは以下の式で求める値である。
(L0−L1)/L0×100 (%)
L0:加熱前の基材の長さ(10cm)
L1:120℃で15分加熱し、室温まで冷却した後の基材の長さ
また、基材は二軸延伸されていることが好ましい。二軸延伸されていることで、加熱時に基材が収縮しやすくなる。このような基材としては、ポリエチレンやポリプロピレンなどのポリオレフィン、ポリスチレン、ポリ塩化ビニルなどが挙げられる。基材の形成方法は特に限定されないが、例えば、Tダイから押出した樹脂を延伸してシート状に成形するする方法が挙げられる。また、性能を損なわない範囲であれば、これらの基材に酸化防止剤や帯電防止剤、滑剤、ブロッキング防止剤、充填剤などの添加剤が含まれていてもよい。
本発明に係る粘着シートの粘着剤層を形成する光硬化型粘着剤は、(メタ)アクリル酸エステル共重合体と光重合性化合物と多官能イソシアネート硬化剤と光重合開始剤とを含み、粘着付与樹脂を実質的に含まない。
加熱による粘着剤層の軟化の原因となる粘着付与樹脂は、アクリル系接着剤の粘着性を高めるために従来配合されている樹脂であって、特に限定されないが、ロジン系樹脂、テルペン系樹脂、脂肪族石油樹脂、芳香族石油樹脂、水添石油樹脂、クロマン・インデン樹脂、スチレン系樹脂、キシレン樹脂およびこれらの樹脂の混合物が挙げられる。
(メタ)アクリル酸エステル共重合体は、(メタ)アクリル酸エステル単量体のみの重合体、又は、(メタ)アクリル酸エステル単量体とビニル化合物単量体との共重合体である。なお、(メタ)アクリレートとはアクリレートおよびメタアクリレートの総称である。(メタ)アクリル酸等の(メタ)を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。
エポキシ基を有する単量体としては、例えば、アリルグリシジルエーテルおよび(メタ)アクリル酸グリシジルエーテルがある。
アミド基を有する単量体としては、例えば、(メタ)アクリルアミドがある。
アミノ基を有する単量体としては、例えば、N,N−ジメチルアミノエチル(メタ)アクリレートがある。
メチロール基を有する単量体としては、例えば、N−メチロールアクリルアミドがある。
光重合性化合物としては、例えば、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、1,4−ブチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、シアヌル酸トリエチルアクリレート、市販のオリゴエステルアクリレートなどが用いられる。
多官能イソシアネート硬化剤は、イソシアネート基を2個以上有するものであり、例えば芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環族ポリイソシアネート、これらの二量体や三量体、アダクト体などが用いられる。
光重合開始剤には、ベンゾイン、ベンゾインアルキルエーテル類、アセトフェノン類、アントラキノン類、チオキサントン類、ケタール類、ベンゾフェノン類またはキサントン類などが用いられる。
アセトフェノン類としては、例えばベンゾインアルキルエーテル類、アセトフェノン、2,2−ジメトキシ−2−アセトフェノン、2,2―ジエトキシ−2−アセトフェノン、1,1−ジクロロアセトフェノンなどがある。
アントラキノン類としては、2−メチルアントラキノン、2−エチルアントラキノン、2−ターシャリブチルアントラキノン、1−クロロアントラキノンなどがある。
チオキサントン類としては、例えば2,4−ジメチルチオキサントン、2,4−ジイソプロピルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントンなどがある。
ケタール類としては、例えばアセトフェノンジメチルケータル、ベンジルジメチルケタール、ベンジルジフェニルサルファイド、テトラメチルチウラムモノサルファイド、アゾビスイソブチロニトリル、ジベンジル、ジアセチル、β−クロールアンスラキノンなどがある。
以下、本発明に係る半導体検査方法の具体的な工程を順に説明する。以下に示す半導体検査方法は、半導体装置の製造工程の一部である。
まず、貼付工程において、粘着シートを半導体ウエハとリングフレームに貼り付ける。半導体ウエハは、シリコンウエハおよびガリウムナイトライドウエハ、炭化ケイ素ウエハ、サファイアウエハなどの従来汎用のウエハであってよい。本願明細書において、「半導体ウエハ」は、樹脂封子されたパッケージ基板やLED基板、ガラス基板などの半導体基板を含む。
ダイシング工程では、半導体ウエハをダイシングして半導体チップにする。本願明細書において、「半導体チップ」は、MEMS(Micro Electro Mechanical Systems)やトランジスタ、ダイオード、LEDなどの半導体部品を含む。
吸着工程では、半導体チップが粘着シートに貼り付けられた状態で、100〜150℃のステージ上に前記粘着シートが前記ステージに接するように載せて吸着固定する。この吸着工程は、ダイシング工程で得られた半導体チップを粘着シートから取り外さずに、ダイシング工程で用いた粘着シートをそのままステージに吸着させることによって行ってもよく、ダイシング工程で得られた半導体チップを粘着シートから取り外した後に、半導体チップを別の粘着シートに貼り付け、この粘着シートをステージに吸着させることによって行ってもよい。
検査工程では、半導体チップに形成された回路の試験を行うために、吸着工程後に、前記ステージを100〜150℃に加熱しながら前記半導体チップの性能を検査する。加温時間は、例えば15分〜5時間である。
光照射工程では、基材側から光硬化型粘着剤層に紫外線等の活性光線を照射する。紫外線の光源としては、低圧水銀灯、高圧水銀灯、超高圧水銀灯、メタルハライドランプ、ブラックライト等を用いることができる。
ピックアップ工程では、粘着シートの粘着剤層から半導体チップを剥離する。この際、本発明に係る粘着シートでは紫外線等の照射により十分な接着力の低下が得られているため、チップ又は部品と粘着剤層との間の剥離が容易となり、良好なピックアップ性が得られ、糊残りなどの不良が生じることもない。ピックアップの方法としては、別の粘着シートに半導体チップを転写する方法や、粘着シートの裏側からスキージして剥離する方法、あるいはニードルピン等で突き上げる方法が挙げられる。また、必要に応じて、ピックアップ工程の前にエキスパンド工程を設けても良い。エキスパンド工程では、粘着シートを引き伸ばして半導体チップ同士の間隔を広げ、ピックアップしやすくさせる。
「表1」に示す配合に従って光硬化型粘着剤を調製した。光硬化型粘着剤をポリエチレンテレフタレート製のセパレーターフィルム上に塗布し、乾燥後の粘着層の厚みが10μmとなるように塗工した。この粘着層を基材に積層し、40℃で7日間熟成し、粘着シートを得た。基材(K−1)には、厚さ30μmの二軸延伸ポリプロピレンフィルム(王子エフテックス社製、FC−201)を用いた。
K−1:二軸延伸ポリプロピレン(王子エフテックス社製FC−201、厚さ:30μm);120℃の熱収縮率2.0%。
K−2:二軸延伸ポリプロピレン(王子エフテックス社製E−201F、厚さ:40μm);120℃の熱収縮率1.5%。
K−3:二軸延伸ポリプロピレン(東洋紡社製パイレンフィルム−OT P2111、厚さ:30μm);120℃の熱収縮率3.3%。
K−4:二軸延伸ポリプロピレン(合成品、厚さ:30μm);120℃の熱収縮率1.1%。
K−5:二軸延伸ポリプロピレン(合成品、厚さ:30μm);120℃の熱収縮率4.8%。
〔(メタ)アクリル酸エステル共重合体〕
A−1:日本ゼオン社製アクリルゴムAR53L;エチルアクリレート54%、ブチルアクリレート19%、メトキシエチルアクリレート24%の共重合体、乳化重合により得られる。
A−2:綜研化学社製SKダイン1496;2−エチルヘキシルアクリレート96%、2−ヒドロキシエチルアクリレート4%の共重合体、溶液重合により得られる。
〔光重合性化合物〕
B−1:根上工業社製UN−905;イソホロンジイソシアネートの三量体にジペタエリスリトールペンタアクリレートを主成分とするアクリレートを反応させたものであり、ビニル基の数が15個。
B−2:新中村化学社製A−TMPT;トリメチロールプロパントリアクリレート、ビニル基の数が3個。
〔多官能イソシアネート硬化剤〕
C−1:日本ポリウレタン社製コロネートL−45E;2,4−トリレンジイソシアネートのトリメチロールプロパンアダクト体。
C−2:トリメチレンジイソシアネート
〔光重合開始剤〕
D−1:BASFジャパン社製IRGACURE127;2−ヒドロキシ−1−{4−[4−(2−ヒドロキシ−2−メチル−プロピオニル)−ベンジル]−フェニル}−2−メチル−プロパン−1−オン、質量減少率が10%の際の温度275℃。
D−2:BASFジャパン社製IRGACURE OXE02;エタノン,1−[9−エチル−6−(2−メチルベンゾイル)−9H−カルバゾール−3−イル]−,1−(O−アセチルオキシム)、質量減少率が10%の際の温度320℃。
D−3:BASFジャパン社製LUCIRIN TPO;2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド、質量減少率が10%の際の温度270℃。
D−4:BASFジャパン社製IRGACURE651;ベンジルジメチルケタール、質量減少率が10%の際の温度185℃。
〔シリコーン系グラフト共重合体〕
E−1:綜研化学社製UTMM−LS2;シリコーン分子鎖の末端に(メタ)アクリロイル基を有するシリコーン系オリゴマ系単位、及びメチルメタアクリレート等からなるアクリルビニル単位を重合してなるシリコーン系グラフト共重合体。
〔粘着付与樹脂〕
F−1:ヤスハラケミカル製YSポリスターS145;テルペンフェノール系粘着付与樹脂、軟化点145℃。
ダイシング装置:DISCO社製DAD341
ダイシングブレード:DISCO社製NBC−ZH205O−27HEEE
ダイシングブレード形状:外径55.56mm、刃幅35μm、内径19.05mm
ダイシングブレード回転数:40,000rpm
ダイシングブレード送り速度:50mm/秒
ダイシングサイズ:10mm角
粘着シートへの切り込み量:15μm
切削水温度:25℃
切削水量:1.0リットル/分
紫外線照射:高圧水銀灯で照射量150mJ/cm2
ダイシングしたウエハの上に、転写用粘着シート(シリコンウエハへの粘着力:6.25N/25mm)を貼付したのち、転写用粘着シートを剥離してチップを転写。
(1)粘着シートの変形
120℃で1時間加温した後の粘着シートを観察し、以下の基準により評価した。
◎(優) :加温後も粘着シートに"たわみ"や"剥がれ"が発生しない。
○(良) :加温によって粘着シートに"たわみ"や"剥がれ"がわずかに発生する。
×(不可):加温によって粘着シートに"たわみ"や"剥がれ"が発生する。
(1)チップ保持性
チップ保持性は、ダイシング工程後において、半導体チップが粘着シートに保持されている半導体チップの残存率に基づき、以下の基準により評価した。
◎(優) :チップ飛びが5%未満
○(良) :チップ飛びが5%以上10%未満
×(不可):チップ飛びが10%以上
ピックアップ性は、ピックアップ工程において、転写用粘着シートを用いて半導体チップを転写させ、転写成功率(ピックアップ成功率)に基づき、以下の基準により評価した。
◎(優) :チップのピックアップ成功率が95%以上
○(良) :チップのピックアップ成功率が80%以上95%未満
×(不可):チップのピックアップ成功率が80%未満
基材の材料、(メタ)アクリル酸エステル共重合体および光重合性化合物、多官能イソシアネート硬化剤、光重合開始剤、シリコーン系グラフト共重合体の種類あるいは添加有無を「表1」に示すように変更した以外は実施例1と同様にして粘着シートを製造し、評価を行った。結果を表に示す。
基材として、以下の基材を用いた以外は実施例1と同様にして粘着シートを製造し、評価を行った。結果を表2に示す。
K−6:ポリエチレンテレフタレート(ユニチカ社製エンブレットPET、厚さ:25μm);120℃の熱収縮率0.5%
K−7:環状オレフィンコポリマー(グンゼ社製Fフィルム、厚さ:100μm);120℃の熱収縮率0.1%
K−8:二軸延伸ポリプロピレン(合成品、厚さ:30μm);120℃の熱収縮率6.0%
シリコーン系グラフト共重合体を添加せず、粘着付与樹脂を添加した以外は実施例1と同様にして粘着シートを製造し、評価を行った。結果を表に示す。
Claims (9)
- 半導体チップを加熱しながら性能検査する工程で使用される粘着シートであって、該粘着シートは基材の上に粘着剤層が設けられた粘着シートであり、該基材が、120℃で15分加熱した時の熱収縮率が1.0%〜5.0%であり、該粘着剤層が、
光重合可能な不飽和結合を有しない(メタ)アクリル酸エステル共重合体100質量部と
光重合可能な不飽和結合を有し且つ(メタ)アクリル酸エステル共重合体とは異なる光重合性化合物5〜200質量部と
多官能イソシアネート硬化剤0.5〜20質量部と
光重合開始剤0.1〜20質量部と
粘着付与樹脂0〜2質量部を含む
ことを特徴とする、半導体検査用の耐熱性粘着シート。 - 前記基材が、二軸延伸されたフィルムであることを特徴とする、請求項1に記載の半導体検査用の耐熱性粘着シート。
- 前記粘着シートの粘着剤層が、剥離付与剤を含む、請求項1又は請求項2に記載の半導体検査用の耐熱性粘着シート。
- 前記剥離付与剤は、シリコーン系グラフト共重合体からなる請求項3に記載の半導体検査用の耐熱性粘着シート。
- 前記剥離付与剤の添加量は、(メタ)アクリル酸エステル共重合体100質量部に対して0.1〜20質量部である、請求項3又は請求項4に記載の半導体検査用の耐熱性粘着シート。
- 前記多官能イソシアネート硬化剤が、イソシアネート基を3個以上有する、請求項1乃至請求項5のいずれかの一項に記載の半導体検査用の耐熱性粘着シート。
- 前記光重合開始剤が、23℃から10℃/分の昇温速度で昇温したときの質量減少率10%となる温度が250℃以上である、請求項1乃至請求項6のいずれか一項に記載の半導体検査用の耐熱性粘着シート。
- 半導体チップが粘着シートに貼り付けられた状態で、100〜150℃のステージ上に前記粘着シートが前記ステージに接するように載せて吸着固定する吸着工程と、
前記ステージを100〜150℃に加熱しながら前記半導体チップの性能を検査する検査工程と、
前記粘着シートに活性光線を照射する活性光線照射工程と、
前記粘着シートから前記半導体チップをピックアップするピックアップ工程
を含み、
前記粘着シートは、請求項1〜請求項7のいずれか一項に記載の粘着シートである、半導体検査方法。 - 前記吸着工程の前に、粘着シートを半導体ウエハに貼り付ける貼付工程と、
前記半導体ウエハをダイシングして前記半導体チップにするダイシング工程をさらに備える、請求項8に記載の半導体検査方法。
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