TWI471400B - 黏著片及半導體晶圓之背面研磨方法 - Google Patents
黏著片及半導體晶圓之背面研磨方法 Download PDFInfo
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- TWI471400B TWI471400B TW099118038A TW99118038A TWI471400B TW I471400 B TWI471400 B TW I471400B TW 099118038 A TW099118038 A TW 099118038A TW 99118038 A TW99118038 A TW 99118038A TW I471400 B TWI471400 B TW I471400B
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- meth
- adhesive sheet
- acrylate
- mass
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims description 65
- 230000001070 adhesive effect Effects 0.000 title claims description 65
- 239000004065 semiconductor Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 15
- 239000000178 monomer Substances 0.000 claims description 48
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 46
- -1 isocyanate compound Chemical class 0.000 claims description 41
- 125000000524 functional group Chemical group 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 24
- 229920001577 copolymer Polymers 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000003431 cross linking reagent Substances 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 239000012948 isocyanate Substances 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 8
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 8
- 125000003277 amino group Chemical group 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
- 229920002098 polyfluorene Polymers 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 63
- 238000005498 polishing Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 11
- 229920002554 vinyl polymer Polymers 0.000 description 11
- 239000003292 glue Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229930016911 cinnamic acid Natural products 0.000 description 2
- 235000013985 cinnamic acid Nutrition 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- ICCVOKMKWYGITK-UHFFFAOYSA-N 1-(2-methylprop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C(C)=C ICCVOKMKWYGITK-UHFFFAOYSA-N 0.000 description 1
- PZSWSROIKOZCKA-UHFFFAOYSA-N 1-but-1-enoxy-2-hydroxypropane-1-sulfonic acid Chemical compound CCC=COC(C(C)O)S(=O)(=O)O PZSWSROIKOZCKA-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- KTIBRDNFZLYLNA-UHFFFAOYSA-N 2-(2-hydroxyethenoxy)ethenol Chemical compound OC=COC=CO KTIBRDNFZLYLNA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QENRKQYUEGJNNZ-UHFFFAOYSA-N 2-methyl-1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CC(C)C(S(O)(=O)=O)NC(=O)C=C QENRKQYUEGJNNZ-UHFFFAOYSA-N 0.000 description 1
- LNCCBHFAHILMCT-UHFFFAOYSA-N 2-n,4-n,6-n-triethyl-1,3,5-triazine-2,4,6-triamine Chemical compound CCNC1=NC(NCC)=NC(NCC)=N1 LNCCBHFAHILMCT-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- MINMAJVBIZUEOK-UHFFFAOYSA-N C(C=C)(=O)O.CC(C(=O)O)CCCCCCCCCCCCCCCC Chemical compound C(C=C)(=O)O.CC(C(=O)O)CCCCCCCCCCCCCCCC MINMAJVBIZUEOK-UHFFFAOYSA-N 0.000 description 1
- OIOLIWWGOCSQEB-UHFFFAOYSA-N CC(CC)(S(=O)(=O)O)OC=CC Chemical compound CC(CC)(S(=O)(=O)O)OC=CC OIOLIWWGOCSQEB-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- LRXWQUHMRCYGRU-UHFFFAOYSA-N bis[2-(2-methylprop-2-enoyloxy)ethyl]sulfamic acid Chemical compound CC(=C)C(=O)OCCN(S(O)(=O)=O)CCOC(=O)C(C)=C LRXWQUHMRCYGRU-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- QLJYSYOCKIEHRV-UHFFFAOYSA-N methanesulfonic acid;styrene Chemical compound CS(O)(=O)=O.C=CC1=CC=CC=C1 QLJYSYOCKIEHRV-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MUMVIYLVHVCYGI-UHFFFAOYSA-N n,n,n',n',n",n"-hexamethylmethanetriamine Chemical compound CN(C)C(N(C)C)N(C)C MUMVIYLVHVCYGI-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
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Description
本發明係關於黏著片及使用黏著片的半導體晶圓的研磨方法。
就使用於半導體晶圓的背面研磨的黏著薄膜而言,專利文獻1、2有相關記載。
一般而言,半導體積體電路係藉由下述方法製造:將高純度矽單結晶等切割(slicing)製成晶圓後,在一表面組裝積體電路(以下,將該表面稱為「電路形成表面」),然後在晶圓的未形成電路的表面(以下,稱為晶圓的「背面」)藉由磨薄(grinding)、拋光等進行研磨,將晶圓厚度削薄至約50~500μm後,再切削(dicing)進行個片化。
專利文獻1:日本特開平10-189504號公報
專利文獻2:日本特開2008-311514號公報
為防止此等步驟中,將半導體晶圓背面研磨加工時半導體晶圓的破損、污染,使用在半導體晶圓的電路形成表面貼附具有感壓接著黏著劑層的背面研磨用黏著片的方法。
黏著片的黏著劑,在貼合於半導體晶圓後,隨著時間經過濡溼擴展,而與半導體晶圓的密著性變高。因此,將黏著片從研磨的半導體晶圓剝離時,半導體晶圓破損。此種現象在半導體晶圓薄時有容易發生的傾向。
若依照本發明,可提供一種黏著片,其具備基材以及設置於該基材上的黏著劑層;該基材係由乙烯-醋酸乙烯酯共聚物所形成,其中醋酸乙烯酯含量為10質量%以下;該黏著劑層含有100質量份的(甲基)丙烯酸酯共聚物、1~10質量份的交聯劑、0.05~5質量份的聚矽氧化合物,其中該(甲基)丙烯酸酯共聚物係(甲基)丙烯酸酯單體與含有官能基的單體聚合而成的共聚物。
使用該黏著片進行半導體晶圓的背面研磨時,可得到「(1)洗淨水侵入黏著片所貼合的半導體晶圓的電路形成表面不易發生,(2)研磨過的半導體晶圓的面內厚度差異小,(3)黏著力的經時上升率小,(4)黏著片剝離後在半導體晶圓的電路形成表面的殘膠少」的優點。藉由此等優點,即使經研磨的半導體晶圓的厚度薄的情況,當黏著片剝離時亦難以引起半導體晶圓的破損,並且在半導體晶圓的電路形成表面不易產生污染。
上述含有官能基的單體,以具有羥基及羧基中的一者或兩者為較佳。
上述交聯劑以異氰酸酯化合物為較佳,上述聚矽氧化合物以具有化學式(I)所示的構造為較佳。
式中,R、R’具有碳數1~6的烷基;X具有環氧基、羧基、羥基、甲醇基、胺基、(甲基)丙烯醯基、乙烯基的任一者;Y為聚醚、烷基、芳烷基的任一者的單元;附加字k、l、m、n的合計為1~80的整數;聚矽氧化合物中附有附加字k、l、m、n的各單體單元的順序,並不限定於化學式(I)所示的順序。
從另外的觀點而言,本發明為一種半導體晶圓的背面研磨方法,其係在半導體晶圓的電路形成表面貼合上述黏著片後,研磨半導體晶圓的背面,研磨終了後,剝離該黏著片。
若依照本發明的黏著片及半導體晶圓的研磨方法,可得到「即使研磨的半導體晶圓的厚度薄的情況,當黏著片剝離時亦難以引起半導體晶圓的破損,並且難以產生半導體晶圓的電路形成表面的污染」的效果。
本發明中,單體單元意指從單體而來的構造單元。本說明書中的份及%,若無特別記載限定,係以質量為基準。本說明書中,(甲基)丙烯酸酯意指丙烯酸酯及甲基丙烯酸酯的總稱。同樣地,(甲基)丙烯酸等的含有(甲基)的化合物,亦為具有[甲基]的化合物與不具有[甲基]的化合物的總稱。
本發明的一實施態樣的黏著片具備基材及在上述基材上設置的黏著劑層,上述基材係由乙烯-醋酸乙烯酯共聚物形成,其中醋酸乙烯酯含量為10質量%以下;上述黏著劑層含有100質量份的(甲基)丙烯酸酯共聚物、1~10質量份的交聯劑、0.05~5質量份的聚矽氧化合物,其中上述(甲基)丙烯酸酯共聚物係由將(甲基)丙烯酸酯單體與含有官能基的單體聚合而成的共聚物。
以下,針對本實施態樣的黏著片的各構成要素加以詳述。
本實施態樣中的基材為乙烯-醋酸乙烯酯共聚物所製成者,其形狀有薄膜狀、片狀。基材的醋酸乙烯酯含量,必須在10質量%以下的範圍。因為若基材的醋酸乙烯酯含量多於10質量%,晶圓的研磨性會降低。基材的醋酸乙烯酯含量係以8質量%以下為較佳。基材的醋酸乙烯酯含量若過少,則由於無法充分追隨半導體晶圓表面所形成的凹凸,故以1質量%以上為較佳,以3質量%以上為更佳,以5質量%以上為進一步更佳。
基材的厚度係以30~300μm為較佳,以50~250μm為更佳。
本實施態樣中的黏著劑層含有100質量份的(甲基)丙烯酸酯共聚物、1~10質量份的交聯劑、0.05~5質量份的聚矽氧化合物。於形成此種黏著劑層的黏著劑中,在不阻害本發明的效果的範圍內,亦可添加其他物質。其例有賦黏劑、可塑劑。
本實施態樣中的(甲基)丙烯酸酯共聚物,為將(甲基)丙烯酸酯單體與含有官能基的單體聚合而成的共聚物。(甲基)丙烯酸酯共聚物亦可具有來自(甲基)丙烯酸酯單體以外的乙烯系化合物的單體單元。
(甲基)丙烯酸酯共聚物的重量平均分子量(Mw),為例如20萬~250萬。具體而言,該重量平均分子量為例如20萬、40萬、60萬、80萬、100萬、150萬、200萬、250萬,亦可在其中所例示的任何2個數值的範圍內。
相對於(甲基)丙烯酸酯共聚物的總質量,含有官能基的單體單元的質量比例,為例如2~20質量%。具體而言,為例如2、4、6、8、12、14、16、18、20質量%,亦可在其中所例示數值的任何2個之間的範圍內。
相對於(甲基)丙烯酸酯共聚物的總質量,丙烯酸酯單體以外的乙烯系化合物的質量比例,為例如0~10質量%。具體而言,該比例為例如0、0.1、0.5、1、2、3、4、5、6、7、8、9、10質量%,亦可在其中所例示數值的任何2個之間的範圍內。
(甲基)丙烯酸酯的單體,例如有(甲基)丙烯酸丁酯、(甲基)丙烯酸2-丁酯、(甲基)丙烯酸第三-丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸十三烷酯、(甲基)丙烯酸肉豆蔻酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸二環芬太尼(pentanyl)酯、(甲基)丙烯酸苯甲酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基甲酯、及(甲基)丙烯酸乙氧基-正-丙酯。(甲基)丙烯酸酯共聚物的製造中所使用的(甲基)丙烯酸酯的單體可為1種或2種以上。
就含有官能基的單體的官能基而言,有羥基、羧基、環氧基、醯胺基、胺基、羥甲基、磺酸基、磺胺酸基、或(亞)磷酸酯基。就含有官能基的單體而言,有具有1種以上此等官能基的含有官能基的單體。又,含有官能基的單體,以具有羥基及羧基中的一者或兩者為較佳,以具有羥基的(甲基)丙烯酸酯為更佳。
具體而言,含有官能基的單體的實例有以下所示者。
具有羥基的含有官能基的單體,例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、或2-羥基乙烯基醚。具有羧基的含有官能基的單體,例如有(甲基)丙烯酸、巴豆酸、馬來酸、馬來酸酐、衣康酸、富馬酸、丙烯醯胺N-甘醇酸、或桂皮酸。
就具有環氧基的含有官能基的單體而言,例如有(甲基)丙烯酸縮水甘油酯。具有醯胺基的含有官能基的單體,例如有(甲基)丙烯醯胺。具有胺基的含有官能基的單體,例如有(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N-第三-丁基胺基乙酯。具有羥甲基的含有官能基的單體,例如有N-羥甲基(甲基)丙烯醯胺。
就具有磺酸基的含有官能基的單體而言,例如有(甲基)丙烯醯基磺酸、(甲基)烯丙基磺酸、乙烯基苯甲磺酸、苯乙烯磺酸、2-(甲基)丙烯醯基乙磺酸、2-(甲基)丙烯醯基丙磺酸、(甲基)丙烯醯氧基甲磺酸、(甲基)丙烯醯氧基乙磺酸、(甲基)丙烯醯氧基丙磺酸、3-甲基丙烯醯氧基-2-羥基丙磺酸、2-(甲基)丙烯醯胺基-2-甲基乙磺酸、2-(甲基)丙烯醯胺基-2-甲基丙磺酸、2-(甲基)丙烯醯胺基-2-甲基丁磺酸。
具有磺胺酸基的含有官能基的單體,可列舉例如羥基乙基-N-[2-丙烯醯氧基乙基]磺胺酸、N,N-雙[2-丙烯醯氧基乙基]磺胺酸、丙烯醯基異氰酸酯與N,N-二(2-羥基乙基)磺胺酸的加成物、羥基乙基-N-[2-甲基丙烯醯氧基乙基]磺胺酸、N,N-雙[2-甲基丙烯醯氧基乙基]磺胺酸、甲基丙烯醯氧基異氰酸酯與N,N-二(2-羥基乙基)磺胺酸的加成物等。
具有(亞)磷酸酯基的含有官能基的單體,例如有(甲基)丙烯酸磷酸根基乙酯(acidphosphooxyethyl(meth)acrylate)、(甲基)丙烯酸磷酸根基丙酯、(甲基)丙烯酸3-氯-2-磷酸根基丙酯、聚氧伸乙基二醇單磷酸酯單(甲基)丙烯酸酯、聚氧伸丙基二醇單磷酸酯單(甲基)丙烯酸酯。
如上述,(甲基)丙烯酸酯共聚物亦可具有從(甲基)丙烯酸酯單體以外的乙烯系化合物而來的單體單元。以下將形成此種單體單元的單體稱為「乙烯系化合物單體」。
就乙烯系化合物單體而言,適合使用具有選自羥基、羧基、環氧基、醯胺基、胺基、羥甲基、磺酸基、磺胺酸基、及(亞)磷酸酯基所構成之官能基群中之一種以上者。
具有羥基的乙烯系化合物單體例如為乙烯醇。具有羧基的乙烯系化合物單體例如為(甲基)丙烯酸、巴豆酸、馬來酸、馬來酸酐、衣康酸、富馬酸、丙烯醯胺N-甘醇酸及桂皮酸。具有環氧基的乙烯系化合物單體例如為烯丙基縮水甘油基醚及(甲基)丙烯酸縮水甘油醚。具有醯胺基的乙烯系化合物單體例如為(甲基)丙烯醯胺。具有胺基的乙烯系化合物單體例如為(甲基)丙烯酸N,N-二甲基胺基乙酯。具有羥甲基的乙烯系化合物單體例如為N-羥甲基丙烯醯胺。
使用於本實施態樣的交聯劑,只要為能與被共聚合的含官能基單體的官能基反應者,可為任何種類,例如異氰酸酯化合物、環氧化合物、亞胺化合物、胺基化合物、鹵素化合物、胺化合物、羧酸,其中以異氰酸酯化合物為較佳。
作為交聯劑的異氰酸酯化合物可為具有複數個異氰酸酯基的化合物。具有複數個異氰酸酯基的化合物例如為芳香族系異氰酸酯、脂環族系異氰酸酯、或脂肪族系異氰酸酯。芳香族系二異氰酸酯例如為甲苯二異氰酸酯、4,4-二苯基甲烷二異氰酸酯、二甲苯二異氰酸酯。脂環族系二異氰酸酯例如為異佛爾酮二異氰酸酯、亞甲基雙(4-環己基異氰酸酯)。脂肪族系二異氰酸酯例如為六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯。此等異氰酸酯化合物亦可為二聚體或三聚體,又亦可為使其與多元醇化合物反應得到的加合物(adduct);該加合物例如為2,4-甲苯二異氰酸酯與三羥甲基丙烷的加合物、2,6-甲苯二異氰酸酯與三羥甲基丙烷的加合物、六亞甲基二異氰酸酯與三羥甲基丙烷的加合物、異佛爾酮二異氰酸酯與三羥甲基丙烷的加合物。
作為交聯劑的環氧化合物例如為雙酚A型環氧化合物、雙酚F型環氧化合物、N,N-縮水甘油基苯胺、N,N-縮水甘油基甲苯胺、間-N,N-縮水甘油基胺基苯基縮水甘油基醚、對-N,N-縮水甘油基胺基苯基縮水甘油基醚、異氰尿酸三縮水甘油酯、N,N,N’,N’-四縮水甘油基二胺基二苯基甲烷、N,N,N’,N’-四縮水甘油基-間-二甲苯二胺、N,N,N’,N’,N”-五縮水甘油基二伸乙基三胺等。
作為交聯劑的亞胺化合物例如為N,N’-二苯基甲烷-4,4’-雙(1-吖羧醯胺)、三羥甲基丙烷-三-β-吖基丙酸酯、四羥甲基甲烷-三-β-吖基丙酸酯、N,N’-甲苯-2,4-雙(1-吖羧醯胺)三伸乙基三聚氰胺。
此等交聯劑可單獨使用,亦可將二種以上組合使用。
交聯劑的添加量,相對於(甲基)丙烯酸酯共聚物100質量份,在1~10質量份的範圍。由於未達1質量份時,會發生殘膠或隨著時間經過黏著膠帶變得剝離不良,而超過10質量份時,黏著力會變低,於晶圓背面研磨加工時冷卻水或研磨屑會進入晶圓表面與黏著片之間,所以必須在該範圍內。
使用於本實施態樣的聚矽氧化合物為在基本骨架具有矽氧(-SiO-)鍵結的化合物,例如,具有矽氧鍵結的油或樹脂。聚矽氧化合物以具有化學式(I)所示的構造為較佳。
式中,R、R’具有碳數1~6的烷基;X具有環氧基、羧基、羥基、甲醇基、胺基、(甲基)丙烯醯基、乙烯基的任一者;Y為聚醚、烷基、芳烷基的任一者的單元;附加字k、l、m、n的合計為1~80的整數;聚矽氧化合物中附有附加字k、l、m、n的各單體單元的順序,並不限定於化學式(I)所示的順序。
化學式(I)中的X以具有環氧基、胺基、(甲基)丙烯醯基、羧基的任一者的官能基為特佳。
聚矽氧化合物的配入量,相對於(甲基)丙烯酸酯共聚物100質量份,在0.05~5質量份的範圍,而以在0.1~4質量份的範圍為較佳。於未達0.05份時,藉由貼合於晶圓的黏著片的經時濡溼擴展,與半導體構件的密著性變高,因此從研磨過的晶圓剝離黏著片時的黏著力提高,從而在晶圓特別薄的情況會發生晶圓破損。若超過5質量份,則凝聚力降低,無法呈現本發明優良安定的黏著力。
黏著劑層的厚度以1~100μm為較佳,以5~60μm為更佳。若黏著劑層薄,則黏著力降低,於晶圓背面研磨加工時,有時水會侵入周緣。若黏著劑層厚,則黏著力高,有時會發生殘膠或剝離不良。
就黏著片的製造方法而言,有將黏著劑層積層在基材上形成黏著片的方法、塗布黏著劑的方法、印刷的方法。就塗布黏著劑的方法而言,例如有用凹面塗布機(gravure coater)、缺角輪塗布機(comma coater)、棒塗機、刀塗機、模頭塗布機或輥塗機等塗布機,將黏著劑直接或間接塗布於基材上的方法。印刷的方法則有凸版印刷、凹版印刷、平版印刷、柔版印刷(flexo printing)、平凸印刷(offset printing)或網版印刷。又,黏著片亦可藉由在剝離性薄膜上塗布黏著劑,使其乾燥後,轉印至基材或積層於基材等而製造。當製造黏著片時,適宜使用剝離性薄膜。
本實施態樣的半導體晶圓的背面研磨方法具有:將上述黏著片貼合於半導體晶圓的電路形成表面的貼合步驟,於貼合步驟後,將半導體晶圓背面研磨的研磨步驟,及於研磨步驟後,將黏著片剝離的剝離步驟。
使用上述黏著片進行半導體晶圓的背面研磨時,可得到「(1)洗淨水侵入黏著片所貼合的半導體晶圓的電路形成表面不易發生,(2)研磨過的半導體晶圓的面內厚度差異小,(3)黏著力的經時上升率小,(4)黏著片剝離後在半導體晶圓的電路形成表面的殘膠少」的優點。藉由此等優點,即使在研磨過的半導體晶圓的厚度為薄的情況,當黏著片剝離時亦難以引起半導體晶圓的破損,並且不易發生半導體晶圓的電路形成表面污染。
以下詳細地說明根據本發明的實施例及半導體晶圓的背面研磨方法。
實施例、比較例的黏著片係依照以下的處方製造。主要的配方及各實驗例的結果示於表1中。
乙烯-醋酸乙烯酯共聚物,厚度120μm,醋酸乙烯酯含量:1%、5%、9%、12%
丙烯酸丁酯80質量%、甲基丙烯酸甲酯11質量%、甲基丙烯酸2-羥基乙酯8質量%、丙烯酸1質量%的共聚物,重量平均分子量72萬者。
2,4-甲苯二異氰酸酯-三羥甲基丙烷的加合物。
S1:含有環氧基的聚矽氧化合物
S2:含有羧基的聚矽氧化合物
S3:含有甲醇基的聚矽氧化合物
S4:聚矽氧油
實施例1的黏著劑為(甲基)丙烯酸酯共聚物成分100質量份、交聯劑(硬化劑)3.5質量份及聚矽氧化合物(S1)2質量份的混合物。其他黏著劑的添加,除表1所示的點以外,以與實施例1同樣的處方進行製作。
將上述黏著劑塗布於聚對苯二甲酸乙二酯製剝離薄膜上,以乾燥後黏著劑層厚度成為40μm的方式塗布,得到積層於120μm的基材上的黏著片。
將實施例及比較例的黏著片貼合於直徑6英吋,厚度625μm的矽晶圓上,使用研磨裝置,於澆水下研磨矽晶圓的背面,使厚度成為150μm。
研磨裝置係使用Disco公司製的DFG-850。研磨輪於第1軸使用GF01-SD360-VS-100,於第2軸使用GF01-SD2000-BK09-100(均為Disco公司製),在下列條件下進行研磨試驗。
第1軸:檯旋轉數:200rpm,輪旋轉數:4800rpm,輸送速度:8μm/秒。
第2軸:檯旋轉數:300rpm,輪旋轉數:4500rpm,輸送速度:0.8μm/秒。
切削水溫度:25℃
切削水(冷卻水)量:2.5公升/分鐘
觀察研磨後的晶圓有無水侵入周緣(水侵入貼附黏著片的面)。
優:水未侵入周緣。
良:水侵入周緣,然而只發生在距晶圓外周部平坦部分邊緣向內1mm以內。
不可:水侵入周緣且超過在晶圓外周部平坦部分邊緣向內1mm處。
使用ADE公司製晶圓平整性測定機Ultra-Gauge型9500A,測定研磨的晶圓的面內厚度差異。
以由上述方法所評價的晶圓面內厚度的最大值與最小值的差值(TTV:Total Thickness Variation)進行判定。
優:TTV為3μm以下
良:TTV超過3μm~4.5μm以下
不可:TTV超過4.5μm
使黏著片貼合於聚矽氧晶圓鏡面,藉由2kg輥往返壓合,放置20分鐘後,在180°剝離、拉伸速度300mm/分鐘的條件下測定黏著片。再者,製作以該條件壓合後貼合放置時間為20分鐘的試驗體及放置時間為7日的試驗體,分別測定放置20分鐘的試驗體的黏著力A,及放置7日的試驗體的黏著力B,以藉由下列計算式求得的上升率進行評價。
上升率=(100×(B-A))/A
優:上升率未達5%。
良:上升率為5%以上未達10%。
不可:上升率為10%以上。
在經粒子管控的5英吋大小的晶圓上貼合黏著片,放置20分鐘後,使用晶圓表面檢査裝置WM-7S(Topcon公司製),依據粒度0.28μm以上的粒子數評價除去黏著片後附著於晶圓表面的殘渣。
優:顆粒50個以下
良:顆粒超過50個~100個以下
不可:顆粒超過100個
依照上述基準進行的評價結果示於表1中。如表1所示,使用實施例1至12的黏著片進行半導體晶圓的背面研磨時,水侵入周緣性、研磨性、黏著力的經時變化及殘膠中的任一項均得到良好的結果。另一方面,使用比較例1至5的黏著片進行半導體晶圓的背面研磨時,如表1所示,水侵入周緣性、研磨性、黏著力的經時變化及殘膠中的任一項,評價結果均不佳,由此可知比較例1至5的黏著片無法採用。
Claims (5)
- 一種半導體晶圓背面研磨用之黏著片,其具備基材以及設置於該基材上的黏著劑層;該基材係由乙烯-醋酸乙烯酯共聚物所形成,其中醋酸乙烯酯含量為10質量%以下;該黏著劑層含有100質量份的(甲基)丙烯酸酯共聚物、1~10質量份的交聯劑、0.05~5質量份的聚矽氧化合物,其中該(甲基)丙烯酸酯共聚物係(甲基)丙烯酸酯單體與含有官能基的單體聚合而成的共聚物。
- 如申請專利範圍第1項之黏著片,其中該含有官能基的單體具有羥基及羧基中的一者或兩者。
- 如申請專利範圍第2項之黏著片,其中該交聯劑為異氰酸酯化合物。
- 如申請專利範圍第1項之黏著片,其中該聚矽氧化合物具有化學式(I)所示的構造:
- 一種半導體晶圓的背面研磨方法,其具有:在半導體晶 圓的電路形成表面貼合如申請專利範圍第1項之黏著片的貼合步驟;於該貼合步驟後,研磨該半導體晶圓的背面的研磨步驟;於該研磨步驟後,剝離該黏著片的剝離步驟。
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JP6193813B2 (ja) * | 2014-06-10 | 2017-09-06 | 信越化学工業株式会社 | ウエハ加工用仮接着材料、ウエハ加工体及びこれらを使用する薄型ウエハの製造方法 |
JP6127088B2 (ja) * | 2015-03-26 | 2017-05-10 | 政廣 遠藤 | 接着剤及び基板の製造方法 |
JP6525726B2 (ja) * | 2015-05-21 | 2019-06-05 | リンテック株式会社 | 粘着シートおよび表示体 |
JP7011420B2 (ja) * | 2017-08-08 | 2022-01-26 | 積水化学工業株式会社 | 再剥離性粘着剤組成物及び粘着テープ |
JP7337015B2 (ja) | 2020-03-23 | 2023-09-01 | 日本カーバイド工業株式会社 | 光学部材保護フィルム用粘着剤組成物及び光学部材保護フィルム |
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CN102449090B (zh) | 2014-01-01 |
US9267059B2 (en) | 2016-02-23 |
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US20120052772A1 (en) | 2012-03-01 |
JP5622727B2 (ja) | 2014-11-12 |
KR101333626B1 (ko) | 2013-11-27 |
KR20120023749A (ko) | 2012-03-13 |
CN102449090A (zh) | 2012-05-09 |
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