TWI526381B - Transport car - Google Patents

Transport car Download PDF

Info

Publication number
TWI526381B
TWI526381B TW101124729A TW101124729A TWI526381B TW I526381 B TWI526381 B TW I526381B TW 101124729 A TW101124729 A TW 101124729A TW 101124729 A TW101124729 A TW 101124729A TW I526381 B TWI526381 B TW I526381B
Authority
TW
Taiwan
Prior art keywords
image sensor
storage case
transported
conveyed
transport vehicle
Prior art date
Application number
TW101124729A
Other languages
English (en)
Chinese (zh)
Other versions
TW201305032A (zh
Inventor
Hiroshi Tanaka
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of TW201305032A publication Critical patent/TW201305032A/zh
Application granted granted Critical
Publication of TWI526381B publication Critical patent/TWI526381B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0407—Storage devices mechanical using stacker cranes
    • B65G1/0414—Storage devices mechanical using stacker cranes provided with satellite cars adapted to travel in storage racks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
TW101124729A 2011-07-12 2012-07-10 Transport car TWI526381B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011153883A JP5927791B2 (ja) 2011-07-12 2011-07-12 搬送車

Publications (2)

Publication Number Publication Date
TW201305032A TW201305032A (zh) 2013-02-01
TWI526381B true TWI526381B (zh) 2016-03-21

Family

ID=47476100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101124729A TWI526381B (zh) 2011-07-12 2012-07-10 Transport car

Country Status (4)

Country Link
JP (1) JP5927791B2 (ja)
KR (1) KR101526436B1 (ja)
CN (1) CN102874530B (ja)
TW (1) TWI526381B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101421573B1 (ko) * 2013-02-15 2014-07-22 주식회사 신성에프에이 카세트 크레인의 맵핑 모듈
CN104952776B (zh) * 2015-04-24 2019-04-26 沈阳拓荆科技有限公司 一款加热盘检验及拆装时存放专用车

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271951A (ja) * 1987-04-28 1988-11-09 Nippon Signal Co Ltd:The ウエ−ハ搬送装置
JPH042036U (ja) * 1990-04-19 1992-01-09
JP2931922B2 (ja) * 1990-09-03 1999-08-09 東京エレクトロン株式会社 熱処理工程におけるアンローディング方法及び熱処理装置
JP3959778B2 (ja) * 1997-04-14 2007-08-15 神鋼電機株式会社 無人搬送台車
KR100563456B1 (ko) * 1997-04-14 2006-05-25 아시스트 신꼬, 인코포레이티드 무인반송대차 및 그 장치
JP2000238904A (ja) * 1999-02-18 2000-09-05 Sumitomo Heavy Ind Ltd スタッカクレーン
JP2001274224A (ja) * 2000-03-27 2001-10-05 Mitsubishi Electric Corp 基板カセット装置
WO2003026002A1 (fr) * 2001-09-18 2003-03-27 Murata Kikai Kabushiki Kaisha Vehicule a guidage automatique
JP4276810B2 (ja) * 2002-02-15 2009-06-10 東京エレクトロン株式会社 無人搬送車
JP3927798B2 (ja) * 2001-12-03 2007-06-13 東京エレクトロン株式会社 移載装置
JP4502127B2 (ja) * 2005-04-01 2010-07-14 株式会社ダイフク カセット保管及び被処理板の処理設備
JP4706902B2 (ja) * 2005-04-11 2011-06-22 村田機械株式会社 搬送車及び物品の移載方法
JP4297145B2 (ja) * 2006-09-21 2009-07-15 村田機械株式会社 移載装置
JP2008118014A (ja) * 2006-11-07 2008-05-22 Toshiba Matsushita Display Technology Co Ltd 基板収容カセット
JP2009051307A (ja) * 2007-08-24 2009-03-12 Asyst Technologies Japan Inc 無人搬送車、該無人搬送車を備えた搬送移載システム、及び搬送移載方法

Also Published As

Publication number Publication date
KR20130008456A (ko) 2013-01-22
CN102874530B (zh) 2016-11-02
JP5927791B2 (ja) 2016-06-01
TW201305032A (zh) 2013-02-01
KR101526436B1 (ko) 2015-06-05
CN102874530A (zh) 2013-01-16
JP2013021166A (ja) 2013-01-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees