TWI524453B - 液體處理方法、液體處理裝置及記憶媒體 - Google Patents

液體處理方法、液體處理裝置及記憶媒體 Download PDF

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Publication number
TWI524453B
TWI524453B TW101113226A TW101113226A TWI524453B TW I524453 B TWI524453 B TW I524453B TW 101113226 A TW101113226 A TW 101113226A TW 101113226 A TW101113226 A TW 101113226A TW I524453 B TWI524453 B TW I524453B
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TW
Taiwan
Prior art keywords
liquid
substrate
organic solvent
diw
chemical
Prior art date
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TW101113226A
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English (en)
Chinese (zh)
Other versions
TW201306151A (zh
Inventor
關口賢治
藤井康
坂崎哲也
Original Assignee
東京威力科創股份有限公司
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Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201306151A publication Critical patent/TW201306151A/zh
Application granted granted Critical
Publication of TWI524453B publication Critical patent/TWI524453B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW101113226A 2011-04-15 2012-04-13 液體處理方法、液體處理裝置及記憶媒體 TWI524453B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011091295 2011-04-15
JP2011277159A JP5813495B2 (ja) 2011-04-15 2011-12-19 液処理方法、液処理装置および記憶媒体

Publications (2)

Publication Number Publication Date
TW201306151A TW201306151A (zh) 2013-02-01
TWI524453B true TWI524453B (zh) 2016-03-01

Family

ID=47005472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101113226A TWI524453B (zh) 2011-04-15 2012-04-13 液體處理方法、液體處理裝置及記憶媒體

Country Status (4)

Country Link
US (1) US9111967B2 (https=)
JP (1) JP5813495B2 (https=)
KR (1) KR101678248B1 (https=)
TW (1) TWI524453B (https=)

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US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
KR20150000548A (ko) * 2013-06-24 2015-01-05 삼성전자주식회사 기판 처리 장치
JP6308910B2 (ja) * 2013-11-13 2018-04-11 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
TWI539515B (zh) * 2013-11-13 2016-06-21 弘塑科技股份有限公司 晶片堆疊結構之洗淨方法及洗淨設備
CN104979236B (zh) * 2014-04-11 2017-09-26 沈阳芯源微电子设备有限公司 一种化学液供给装置及其供给方法
KR102347975B1 (ko) * 2014-07-14 2022-01-07 세메스 주식회사 기판 처리 장치 및 방법
JP6449097B2 (ja) 2014-07-24 2019-01-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6440111B2 (ja) * 2014-08-14 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
CN105047529A (zh) * 2015-05-28 2015-11-11 上海集成电路研发中心有限公司 改善小尺寸高深宽比结构的湿法工艺润湿性的方法
KR101736871B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 장치 및 방법
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
JP6623943B2 (ja) 2016-06-14 2019-12-25 東京エレクトロン株式会社 半導体装置の製造方法、熱処理装置及び記憶媒体。
EP3282474B1 (en) * 2016-08-11 2021-08-04 IMEC vzw Method for performing a wet treatment of a substrate
WO2018037691A1 (ja) * 2016-08-22 2018-03-01 東京エレクトロン株式会社 塗布方法、塗布装置及び記憶媒体
JP6979826B2 (ja) * 2017-08-04 2021-12-15 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR102029127B1 (ko) * 2019-02-08 2019-10-07 영창케미칼 주식회사 반도체 제조 공정에 있어서 실리콘 또는 실리콘 화합물 패턴을 형성하기 위한 신규 방법
JP7250566B2 (ja) * 2019-02-26 2023-04-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
TW202105495A (zh) * 2019-05-23 2021-02-01 日商東京威力科創股份有限公司 基板處理方法
JP7419896B2 (ja) * 2020-03-16 2024-01-23 栗田工業株式会社 ウエハの洗浄方法
JP7580217B2 (ja) 2020-07-27 2024-11-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および、処理液
JP7513454B2 (ja) 2020-07-27 2024-07-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7546399B2 (ja) * 2020-07-27 2024-09-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置および処理液
CN112185857A (zh) * 2020-09-29 2021-01-05 王健 一种晶圆电镀前处理用摇摆喷淋工艺
KR102597005B1 (ko) * 2020-12-29 2023-11-02 세메스 주식회사 기판 처리 방법
JP7592500B2 (ja) * 2021-01-18 2024-12-02 東京エレクトロン株式会社 基板処理方法および基板処理装置
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CN118073176B (zh) * 2024-04-25 2024-07-09 合肥新晶集成电路有限公司 晶圆清洗方法和晶圆清洗机

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Also Published As

Publication number Publication date
KR20120117678A (ko) 2012-10-24
JP5813495B2 (ja) 2015-11-17
US20120260949A1 (en) 2012-10-18
KR101678248B1 (ko) 2016-11-21
TW201306151A (zh) 2013-02-01
US9111967B2 (en) 2015-08-18
JP2012231116A (ja) 2012-11-22

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