TWI514534B - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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Publication number
TWI514534B
TWI514534B TW103127991A TW103127991A TWI514534B TW I514534 B TWI514534 B TW I514534B TW 103127991 A TW103127991 A TW 103127991A TW 103127991 A TW103127991 A TW 103127991A TW I514534 B TWI514534 B TW I514534B
Authority
TW
Taiwan
Prior art keywords
wires
wire
common
suspension
semiconductor device
Prior art date
Application number
TW103127991A
Other languages
English (en)
Chinese (zh)
Other versions
TW201445691A (zh
Inventor
高橋典之
Original Assignee
瑞薩電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW201445691A publication Critical patent/TW201445691A/zh
Application granted granted Critical
Publication of TWI514534B publication Critical patent/TWI514534B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW103127991A 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof TWI514534B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007187789 2007-07-19
JP2007316920A JP5155644B2 (ja) 2007-07-19 2007-12-07 半導体装置

Publications (2)

Publication Number Publication Date
TW201445691A TW201445691A (zh) 2014-12-01
TWI514534B true TWI514534B (zh) 2015-12-21

Family

ID=40444481

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103127991A TWI514534B (zh) 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof
TW097121800A TWI452663B (zh) 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW097121800A TWI452663B (zh) 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP5155644B2 (enExample)
KR (1) KR101477807B1 (enExample)
CN (2) CN101452902B (enExample)
TW (2) TWI514534B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102044514A (zh) * 2010-04-29 2011-05-04 中颖电子股份有限公司 芯片引线键合区及应用其的半导体器件
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
KR102071078B1 (ko) * 2012-12-06 2020-01-30 매그나칩 반도체 유한회사 멀티 칩 패키지
CN104103620B (zh) * 2014-07-29 2017-02-15 日月光封装测试(上海)有限公司 引线框架及半导体封装体
CN104485323B (zh) * 2014-12-23 2017-08-25 日月光封装测试(上海)有限公司 引线框架和半导体封装体
CN104547477A (zh) * 2015-01-29 2015-04-29 李秀娟 一种用于肛周脓肿引流术后护理的中药制剂及制备方法
JP2017045944A (ja) 2015-08-28 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置
JP6394634B2 (ja) * 2016-03-31 2018-09-26 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法
US10714418B2 (en) * 2018-03-26 2020-07-14 Texas Instruments Incorporated Electronic device having inverted lead pins
US11862540B2 (en) 2020-03-06 2024-01-02 Stmicroelectronics Sdn Bhd Mold flow balancing for a matrix leadframe
CN114203665B (zh) * 2021-12-31 2025-02-11 矽典微电子(上海)有限公司 封装框架及封装结构

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058739A (ja) * 1998-08-10 2000-02-25 Hitachi Ltd 半導体装置およびその製造に用いるリードフレーム
JP2002043497A (ja) * 2000-07-27 2002-02-08 Mitsubishi Electric Corp 半導体装置
JP2003046051A (ja) * 2001-07-30 2003-02-14 Nec Corp リードフレーム、半導体装置およびその樹脂封止法
TW550776B (en) * 2001-07-09 2003-09-01 Hitachi Ltd Semiconductor device and method of manufacturing the same
TW579560B (en) * 2001-07-31 2004-03-11 Hitachi Ltd Semiconductor device and its manufacturing method
TW200411870A (en) * 2002-11-15 2004-07-01 Renesas Tech Corp Method of manufacturing a semiconductor device
US6967128B2 (en) * 2002-06-06 2005-11-22 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
US7064420B2 (en) * 2002-09-30 2006-06-20 St Assembly Test Services Ltd. Integrated circuit leadframe with ground plane
US20060186528A1 (en) * 2002-06-05 2006-08-24 Toshio Sasaki Semiconductor device
US20070004092A1 (en) * 2003-08-29 2007-01-04 Hiromichi Suzuki Semiconductor device manufacturing method
US7176557B2 (en) * 2004-03-23 2007-02-13 Renesas Technology Corp. Semiconductor device
JP2007180077A (ja) * 2005-12-27 2007-07-12 Renesas Technology Corp 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
JPS6476745A (en) * 1987-09-17 1989-03-22 Hitachi Ltd Lead frame
JPH01106461A (ja) * 1987-10-20 1989-04-24 Fujitsu Ltd リードフレーム
US5543657A (en) * 1994-10-07 1996-08-06 International Business Machines Corporation Single layer leadframe design with groundplane capability
TW363333B (en) * 1995-04-24 1999-07-01 Toshiba Corp Semiconductor apparatus and manufacturing method thereof and electric apparatus
JPH11168169A (ja) * 1997-12-04 1999-06-22 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP2002026179A (ja) * 2000-07-04 2002-01-25 Nec Kyushu Ltd 半導体装置およびその製造方法
CN100533722C (zh) * 2002-07-01 2009-08-26 株式会社瑞萨科技 半导体器件
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058739A (ja) * 1998-08-10 2000-02-25 Hitachi Ltd 半導体装置およびその製造に用いるリードフレーム
JP2002043497A (ja) * 2000-07-27 2002-02-08 Mitsubishi Electric Corp 半導体装置
TW550776B (en) * 2001-07-09 2003-09-01 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP2003046051A (ja) * 2001-07-30 2003-02-14 Nec Corp リードフレーム、半導体装置およびその樹脂封止法
US7239009B2 (en) * 2001-07-30 2007-07-03 Nec Corporation Lead frame and semiconductor device having the same as well as method of resin-molding the same
TW579560B (en) * 2001-07-31 2004-03-11 Hitachi Ltd Semiconductor device and its manufacturing method
US20060186528A1 (en) * 2002-06-05 2006-08-24 Toshio Sasaki Semiconductor device
US6967128B2 (en) * 2002-06-06 2005-11-22 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
US7064420B2 (en) * 2002-09-30 2006-06-20 St Assembly Test Services Ltd. Integrated circuit leadframe with ground plane
TW200411870A (en) * 2002-11-15 2004-07-01 Renesas Tech Corp Method of manufacturing a semiconductor device
US20070004092A1 (en) * 2003-08-29 2007-01-04 Hiromichi Suzuki Semiconductor device manufacturing method
US7176557B2 (en) * 2004-03-23 2007-02-13 Renesas Technology Corp. Semiconductor device
JP2007180077A (ja) * 2005-12-27 2007-07-12 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
KR20090009142A (ko) 2009-01-22
JP5155644B2 (ja) 2013-03-06
CN102709268B (zh) 2015-04-08
KR101477807B1 (ko) 2014-12-30
TW200915520A (en) 2009-04-01
TWI452663B (zh) 2014-09-11
TW201445691A (zh) 2014-12-01
CN102709268A (zh) 2012-10-03
JP2009044114A (ja) 2009-02-26
CN101452902B (zh) 2012-08-08
CN101452902A (zh) 2009-06-10

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