TWI509726B - 裸露工件儲存櫃及其附加容器儲存裝置 - Google Patents
裸露工件儲存櫃及其附加容器儲存裝置 Download PDFInfo
- Publication number
- TWI509726B TWI509726B TW101132227A TW101132227A TWI509726B TW I509726 B TWI509726 B TW I509726B TW 101132227 A TW101132227 A TW 101132227A TW 101132227 A TW101132227 A TW 101132227A TW I509726 B TWI509726 B TW I509726B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- workpiece
- storage
- bare
- storage cabinet
- Prior art date
Links
- 238000003860 storage Methods 0.000 title claims description 535
- 230000007246 mechanism Effects 0.000 claims description 83
- 238000012546 transfer Methods 0.000 claims description 60
- 230000005540 biological transmission Effects 0.000 claims description 38
- 230000004913 activation Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 32
- 238000000034 method Methods 0.000 description 31
- 230000032258 transport Effects 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 230000006870 function Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 7
- 238000003491 array Methods 0.000 description 6
- 239000000872 buffer Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000013500 data storage Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000012636 effector Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000012160 loading buffer Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000802 evaporation-induced self-assembly Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- 230000008929 regeneration Effects 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/225,547 US8888434B2 (en) | 2011-09-05 | 2011-09-05 | Container storage add-on for bare workpiece stocker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201321287A TW201321287A (zh) | 2013-06-01 |
| TWI509726B true TWI509726B (zh) | 2015-11-21 |
Family
ID=47189983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101132227A TWI509726B (zh) | 2011-09-05 | 2012-09-04 | 裸露工件儲存櫃及其附加容器儲存裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8888434B2 (enExample) |
| EP (1) | EP2754174B1 (enExample) |
| JP (1) | JP6109176B2 (enExample) |
| KR (1) | KR102000776B1 (enExample) |
| CN (1) | CN103946967B (enExample) |
| TW (1) | TWI509726B (enExample) |
| WO (1) | WO2013035037A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI867892B (zh) * | 2023-12-12 | 2024-12-21 | 友達光電股份有限公司 | 物料容納盒及自動化補料系統 |
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| US20050101050A1 (en) * | 2003-11-07 | 2005-05-12 | Lg Philips Lcd Co., Ltd. | Photolithograph system and method for driving the same |
| US9214372B2 (en) * | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
| JP2015141915A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
| WO2016018908A1 (en) * | 2014-07-29 | 2016-02-04 | Robotic Arts, Inc. | Robotically controlled architectural elements |
| KR102174332B1 (ko) * | 2014-07-30 | 2020-11-04 | 삼성전자주식회사 | 반도체 제조 라인의 스토커 및 상기 스토커를 이용하여 웨이퍼를 이송하는 방법 |
| US9576834B2 (en) * | 2015-03-16 | 2017-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker and method for dispatching wafer carrier in stocker |
| US9617075B2 (en) * | 2015-03-24 | 2017-04-11 | Joseph Porat | System and method for overhead warehousing |
| US11569138B2 (en) | 2015-06-16 | 2023-01-31 | Kla Corporation | System and method for monitoring parameters of a semiconductor factory automation system |
| US20170025190A1 (en) * | 2015-07-23 | 2017-01-26 | Richard Allen Gibson | Spherical fusion reactor with aerogel material |
| JP2018536984A (ja) | 2015-10-05 | 2018-12-13 | ブルックス シーシーエス ゲーエムベーハーＢｒｏｏｋｓ ＣＣＳ ＧｍｂＨ | 半導体システムにおける湿度制御 |
| JP6566051B2 (ja) * | 2016-02-15 | 2019-08-28 | 村田機械株式会社 | 保管装置及び搬送システム |
| SG11201806900WA (en) | 2016-03-03 | 2018-09-27 | Murata Machinery Ltd | Temporary storage system |
| US10138060B1 (en) * | 2016-06-22 | 2018-11-27 | Amazon Technologies, Inc. | Modular, multi-function robotic positioning system |
| CN106044229A (zh) * | 2016-07-22 | 2016-10-26 | 京东方科技集团股份有限公司 | 一种掩模板搬运设备及曝光机组系统 |
| US10928792B2 (en) * | 2016-07-25 | 2021-02-23 | Leridge Corporation | Parallel manufacturing systems and methods |
| US10220511B2 (en) * | 2016-07-28 | 2019-03-05 | X Development Llc | Customized robotic installation based on measurements collected on site |
| US20180029235A1 (en) * | 2016-07-28 | 2018-02-01 | X Development Llc | Error Accrual and Mitigation During Robotic Process |
| US10589931B2 (en) | 2016-09-30 | 2020-03-17 | Staples, Inc. | Hybrid modular storage fetching system |
| US10803420B2 (en) | 2016-09-30 | 2020-10-13 | Staples, Inc. | Hybrid modular storage fetching system |
| US10683171B2 (en) | 2016-09-30 | 2020-06-16 | Staples, Inc. | Hybrid modular storage fetching system |
| WO2018147953A1 (en) * | 2017-01-05 | 2018-08-16 | Staples, Inc. | Hybrid modular storage fetching system |
| US11084410B1 (en) | 2018-08-07 | 2021-08-10 | Staples, Inc. | Automated guided vehicle for transporting shelving units |
| US11590997B1 (en) | 2018-08-07 | 2023-02-28 | Staples, Inc. | Autonomous shopping cart |
| US11630447B1 (en) | 2018-08-10 | 2023-04-18 | Staples, Inc. | Automated guided vehicle for transporting objects |
| US11437258B2 (en) * | 2018-08-30 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same |
| US11119487B2 (en) | 2018-12-31 | 2021-09-14 | Staples, Inc. | Automated preparation of deliveries in delivery vehicles using automated guided vehicles |
| US11180069B2 (en) | 2018-12-31 | 2021-11-23 | Staples, Inc. | Automated loading of delivery vehicles using automated guided vehicles |
| US11124401B1 (en) | 2019-03-31 | 2021-09-21 | Staples, Inc. | Automated loading of delivery vehicles |
| US20230016251A1 (en) * | 2021-07-15 | 2023-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Compound fork device and system including the same |
| TWI859799B (zh) * | 2023-03-31 | 2024-10-21 | 迅得機械股份有限公司 | 小型倉儲裝置 |
| TWI859798B (zh) * | 2023-03-31 | 2024-10-21 | 迅得機械股份有限公司 | 具有可折收承載件的小型倉儲裝置 |
| TWI871123B (zh) * | 2023-12-05 | 2025-01-21 | 旭東機械工業股份有限公司 | 晶圓盒之移送裝置 |
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| US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
| JP2002231785A (ja) * | 2000-11-28 | 2002-08-16 | Dainippon Screen Mfg Co Ltd | 基板受渡装置、基板処理装置および載置台 |
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| US20100241271A1 (en) * | 2006-03-31 | 2010-09-23 | Ihi Corporation | Wafer storing cabinet and storage control method thereof |
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| JP5421043B2 (ja) * | 2009-09-29 | 2014-02-19 | 大日本スクリーン製造株式会社 | 基板処理装置及びこれを備えた基板処理システム |
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| JP5722092B2 (ja) * | 2011-03-18 | 2015-05-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6278751B2 (ja) * | 2014-03-04 | 2018-02-14 | 東京エレクトロン株式会社 | 搬送方法及び基板処理装置 |
| JP7017859B2 (ja) | 2017-03-21 | 2022-02-09 | 日鉄鋼板株式会社 | 建築パネル |
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2011
- 2011-09-05 US US13/225,547 patent/US8888434B2/en active Active
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2012
- 2012-09-04 JP JP2014529111A patent/JP6109176B2/ja active Active
- 2012-09-04 WO PCT/IB2012/054560 patent/WO2013035037A1/en not_active Ceased
- 2012-09-04 CN CN201280043130.2A patent/CN103946967B/zh active Active
- 2012-09-04 TW TW101132227A patent/TWI509726B/zh active
- 2012-09-04 EP EP12787502.9A patent/EP2754174B1/en active Active
- 2012-09-04 KR KR1020147009083A patent/KR102000776B1/ko active Active
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2014
- 2014-10-14 US US14/513,214 patent/US10529609B2/en active Active
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2019
- 2019-12-20 US US16/723,009 patent/US11049750B2/en active Active
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2021
- 2021-06-29 US US17/362,716 patent/US11587816B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
| JP2002231785A (ja) * | 2000-11-28 | 2002-08-16 | Dainippon Screen Mfg Co Ltd | 基板受渡装置、基板処理装置および載置台 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI867892B (zh) * | 2023-12-12 | 2024-12-21 | 友達光電股份有限公司 | 物料容納盒及自動化補料系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103946967A (zh) | 2014-07-23 |
| US8888434B2 (en) | 2014-11-18 |
| TW201321287A (zh) | 2013-06-01 |
| JP2014529914A (ja) | 2014-11-13 |
| US20160247701A1 (en) | 2016-08-25 |
| CN103946967B (zh) | 2018-02-02 |
| US10529609B2 (en) | 2020-01-07 |
| JP6109176B2 (ja) | 2017-04-05 |
| KR102000776B1 (ko) | 2019-07-16 |
| KR20140060347A (ko) | 2014-05-19 |
| US20130058743A1 (en) | 2013-03-07 |
| US11049750B2 (en) | 2021-06-29 |
| US11587816B2 (en) | 2023-02-21 |
| US20200126833A1 (en) | 2020-04-23 |
| US20210398836A1 (en) | 2021-12-23 |
| EP2754174A1 (en) | 2014-07-16 |
| EP2754174B1 (en) | 2021-04-07 |
| WO2013035037A1 (en) | 2013-03-14 |
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