TWI509019B - Polybutylene terephthalate resin composition and fused body - Google Patents

Polybutylene terephthalate resin composition and fused body Download PDF

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Publication number
TWI509019B
TWI509019B TW101135768A TW101135768A TWI509019B TW I509019 B TWI509019 B TW I509019B TW 101135768 A TW101135768 A TW 101135768A TW 101135768 A TW101135768 A TW 101135768A TW I509019 B TWI509019 B TW I509019B
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Taiwan
Prior art keywords
polybutylene terephthalate
resin composition
terephthalate resin
welding
copolymer
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Application number
TW101135768A
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English (en)
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TW201333100A (zh
Inventor
Kouichi Sakata
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Wintech Polymer Ltd
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Publication of TW201333100A publication Critical patent/TW201333100A/zh
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    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
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Description

聚對苯二甲酸丁二酯樹脂組合物及熔接體
本發明係關於聚對苯二甲酸丁二酯樹脂組合物，而成形性優良，作為成形品使複數成形品相互熔接時，顯示很高的熔接強度及耐熱衝擊性的樹脂組合物，及關於熔接該樹脂組合物所構成之成形品而成的熔接體。
聚對苯二甲酸丁二酯樹脂，係機械性質、電氣性質、其他物理、化學性質優良，且加工性良好，故作為工程塑膠，廣泛地使用於汽車零件、電氣．電子零件等的用途。
上述用途之中，有收容搭載電子零件的基板等的框體，該框體係接合蓋與本體而成。如此之框體，係將在於內部的基板等的零件，由外部的水份、灰塵、衝擊保護的目的使用，故要求蓋與本體充分密著。
可提高蓋與本體的接合強度，且簡便的接合方法，已知有振動熔接法及超音波熔接法等的熔接法。上述熔接 法，可良好地採用在如上所述之框體之蓋與本體之接合，此外，不僅是聚對苯二甲酸丁二酯樹脂，亦可良好地採用於其他樹脂所構成之成形品之接合。
例如，於專利文獻1，揭示有將熱塑性樹脂組合物製的燈具外殼，以聚甲基丙烯酸甲酯樹脂製或聚碳酸酯樹脂製之透鏡以振動熔接法接合而製造汽車用燈具的技術。如此地使用熔接法將成形品相互接合之技術先前已知，但在於實際的產品開發，亦須考慮熔接體的機械強度。在於專利文獻1，構成上述燈具外殼的原料，係具有：聚合甲基丙烯酸甲酯單體與丙烯酸乙酯單體聚合而得之橡膠狀接枝共聚物；聚碳酸酯樹脂；聚對苯二甲酸烷二酯樹脂之樹脂組合物。該樹脂組合物的剛性低，荷重彎曲溫度等的耐熱性差。因此，即使使用記載於專利文獻1所記載的技術，製造收容基板等的框體，在機械強度等會有問題，故無法成為具有所望的性能的框體。此外，在於專利文獻1，僅揭示作為振動熔接性的外觀性(熔接口)，並無關於熔接強度的提示。
此外，在於專利文獻2，揭示有用於製造振動熔接成形品之聚對苯二甲酸丁二酯樹脂組合物。專利文獻2所記載的樹脂組合物，包含含有5~30莫耳%共聚用單體的變性聚酯共聚物，但是如果使用這變性聚酯共聚物，就因為成形品的耐熱性變低即使在專利文獻2上採用記載的技術，製造收容基板等的框體，也沒有成為有所望的性能的框體。
此外，於專利文獻3，揭示有用於製造振動熔接之成形 品之聚醯胺樹脂組合物。於專利文獻3，為提高成形品的熔接強度，記載只要將樹脂組合物的熔融黏度提高即可。
[先行技術文獻] [專利文獻]
[專利文獻1]日本特開2000-302824號公報
[專利文獻2]日本特開2006-176691號公報
[專利文獻3]日本特開2009-97011號公報
如上所述，於專利文獻3，雖然記載只要將構成熔接之成形品之樹脂組合物之溶融時的黏度提高，即可提升熔接強度，但是上述黏度高，係降低製造成形品時的樹脂組合物的流動性的意思。
在此，成形時的樹脂組合物的流動性不足，則可成形的成形品的形狀受到限定。特別是，為付與實際產品所要求的機械強度等而添加無機填充材時，流動性將變更容易下降。因此，要求在熔融時有一定水準以上的流動性，而可提高熔接強度的技術。
本發明者們，關於熔接聚對苯二甲酸丁二酯樹脂組合物所構成的成形品而成的熔接體，為解決上述課題專心反覆研究。此時，發現在於聚對苯二甲酸丁二酯樹脂組合物，即使提升溶融時的樹脂組合物的黏度，有無法提升熔接強 度之情形，並且，在聚對苯二甲酸丁二酯樹脂組合物之情形，含於樹脂組合物之聚對苯二甲酸丁二酯樹脂的分子量與熔接強度之間有所關係，進一步將上述分子量調整於特定的範圍，可提高構成熔接體之成形品間的熔接強度，且可將構成成形品之樹脂組合物的流動性調整在一定水準以上，而完成本發明名。更具體而言，本發明提供如下者。
(1)一種聚對苯二甲酸丁二酯樹脂組合物，由重量平均分子量為60000以上，80000以下的聚對苯二甲酸丁二酯樹脂(A)，及無機填充材(B)所構成。
(2)如(1)所述的聚對苯二甲酸丁二酯樹脂組合物，其中對聚對苯二甲酸丁二酯樹脂(A)100質量部，包含彈性體(C)5~20質量部。
(3)一種熔接體，將(1)或(2)所述的聚對苯二甲酸丁二酯樹脂組合物所構成的成形品相互熔接而成。
(4)如(3)所述的熔接體，將上述成形品相互抵接，於該接面產生摩擦熱而熔接形成。
本發明之樹脂組合物，流動性優良，且將本發明之樹脂組合物所構成的成形品相互熔接而成的熔接體成形品之間的熔接強度很強。
成形本發明之樹脂組合物而成之成形品，可活用成為原料之樹脂組合物之高流動性，作成熔接品時的成形品之間的很強的熔接強度，聚對苯二甲酸丁二酯樹脂所具有的優良的物性，良好地使用於為收容電子零件的框體或套子 ，外殼用的成形品。
以下，依序詳細說明關於本發明之聚對苯二甲酸丁二酯樹脂組合物之構成成分。
<聚對苯二甲酸丁二酯樹脂(A)>
首先，本發明之樹脂組合物之基礎樹脂之聚對苯二甲酸丁二酯樹脂(A)，係對苯二甲酸，與碳數4之烷二醇(1,4-丁二醇)或包含其酯形成衍生物的乙二醇成分聚縮合而得之聚對苯二甲酸丁二酯樹脂。
在於本發明，聚對苯二甲酸丁二酯樹脂，係由來自對苯二甲酸之反覆單位，與來自1,4-丁二醇單位之反覆單位所組成之未變性聚對苯二甲酸丁二酯樹脂。
為提高熔接之成形品之間的熔接強度，亦有使用包含來自對苯二甲酸、1,4-丁二醇以外的其他單體之反覆單位之所謂變性聚對苯二甲酸丁二酯樹脂之情形，但是根據本發明，由於即使使用未變性的聚對苯二甲酸丁二酯樹脂，亦可提高成形品之間的熔接強度，故由耐熱性的觀點，使用未變性的聚對苯二甲酸丁二酯樹脂為佳。
聚對苯二甲酸丁二酯樹脂(A)的重量平均分子量為60000以上80000以下。重量平均分子量未滿60000時，雖然成形時的流動性優良，但是無法提高熔接之成形品之間的熔接強度。此外，重量平均分子量超過80000時，會顯著地變成高黏度，無法得到藉由射出成形製造成形品所 需的流動性。由熔接強度與流動性的觀點，聚對苯二甲酸丁二酯樹脂(A)的重量平均分子量，以65000以上75000以下更佳，進一部以65000以上70000以下為佳。
此外，聚對苯二甲酸丁二酯樹脂(A)的重量平均分子量，在於上述範圍，則聚對苯二甲酸丁二酯樹脂(A)的耐熱性會變高。在此，耐熱性係指以DSC(示差掃描熱量測定)，以升溫速度10℃/min，降溫速度-10℃/min測定之結晶化溫度(Tc)，上述結晶化溫度以190℃以上為佳。此外，聚對苯二甲酸丁二酯樹脂(A)的重量平均分子量，在於上述範圍，則由樹脂組合物所構成之熔接體之耐熱衝擊性良好。
再者，亦可藉由混合具有不同的重量平均分子量的聚對苯二甲酸丁二酯樹脂調整重量平均分子量。例如，可藉由混合重量平均分子量為50000的聚對苯二甲酸丁二酯樹脂與重量平均分子量為100000的聚對苯二甲酸丁二酯樹脂，而調製70000的聚對苯二甲酸丁二酯樹脂。
<無機填充劑(B)>
用於本發明之無機填充劑(B)，可良好地使用任何習知之玻璃纖維。然後，玻璃纖維之玻璃纖維徑，或圓筒、繭形、長圓剖面等的形狀、或者用於製造切股或粗紗等時的長度或切玻璃的方法並無特別限定。於本發明，玻璃的種類亦無特別限定，品質上，可良好地使用E玻璃或於組成中具有鋯元素之耐腐蝕玻璃。
此外，於本發明，以提升玻璃纖維與樹脂母材之界面特性的目的，可良好地使用以胺基矽烷化合物或環氧化合 物等的有機處理劑表面處理之玻璃纖維。其中，可特別良好地使用以加熱減量值表示之有機處理劑量為1質量%以上的玻璃纖維。用於該玻璃纖維的胺基矽烷化合物、環氧化合物，只要是習知者均可良好地使用，於本發明，可用於玻璃纖維的表面處理之胺基矽烷化合物、環氧化合物的種類並無特別限定。
此外，使用於本發明之無機填充劑，可舉例如玻璃珠、玻璃片、二氧化矽、高嶺土、滑石粉、黏土、鈣矽石、氧化鈦、氧化鋅、氧化鋁、碳酸鈣、碳酸鎂等的非纖維狀填充劑。該等無機填充劑，以單獨使用時，由於無法得到具有充分的強度的成形體，該等無機填充劑，與纖維狀填充劑並用為佳。此外按照需要，亦可對該等無機填充劑，以表面處理劑等處理。
該等無機填充劑(B)的添加量，以可賦予實際產品所要求的機械強度等，亦不損及成形所需的流動性的範圍適宜選擇為佳。
<彈性體(C)>
於使用超音波熔接或振動熔接工法等的用途，有連接器等的金屬接頭或各種傳感器零件等與成形品一體化之情形。特別是在於裝載於汽車的零件用途，由於大多要求可於高溫．高濕環境及冷熱循環環境中的高度的耐久性，故亦可添加改善冷熱循環之彈性體。
彈性體(C)，以熱塑性彈性體或核殼彈性體等有用，熱塑性彈性體可舉烯烴系、苯乙烯系、聚酯系的彈性體。
作為烯烴系彈性體，較佳的是以乙烯及/或丙烯作為主成分的共聚物，可良好地利用(a-1)乙烯-不飽和羧酸烷酯共聚物或(a-2)由α-烯烴與α,β-不飽和酸的縮水甘油酯所構成之烯烴系共聚物，與(b)主要以下述通式(1)所示之反覆單位所構成之聚合物或共聚物之一種或二種以上，以分枝或架橋構造化學鍵結之接枝共聚物。
式(1)之中，R係表示氫原子或低級烷基(例如C1~C6之烷基)，X係表示選自由-COOCH3 、-COOC2 H5 、-COOC4 H9 、-COOCH2 CH(C2 H5 )C4 H9 、苯基及氰基所組成之群之一種以上的基。
該接枝共聚物，特別對改善熱衝擊性有效果。(a-1)乙烯不飽和羧酸烷酯共聚物的具體例，可舉乙烯-丙烯酸共聚物、乙烯-甲基丙烯酸共聚物、乙烯-丙烯酸-丙烯酸乙酯共聚物、乙烯丙烯酸乙酯共聚物、乙烯-醋酸乙烯共聚物、乙烯-醋酸乙烯酯-丙烯酸乙酯共聚物等的隨機共聚物，再者，亦可將該等共聚物混合使用。
此外，構成(a-2)之烯烴系共聚物之一方的單體的α-烯烴，可舉乙烯、丙烯、丁烯-1等，惟使用乙烯為佳。此外，構成(a-2)成分之其他的單體的α,β-不飽和酸的縮水甘油酯，係以下述通式(2)所示之化合物，可舉例如丙烯 酸縮水甘油酯、甲基丙烯酸縮水甘油酯、乙基丙烯酸縮水甘油酯等，特別是可良好地使用甲基丙烯酸縮水甘油酯。
式(2)之中，R1係表示氫原子或低級烷基(例如C1~C6之烷基)。
α-烯烴(例如乙烯)與α,β-不飽和酸的縮水甘油酯，可藉由通常習知之自由基聚合反應共聚合而得(a-2)之共聚物。鏈段(a-2)的構成，以α-烯烴70~99質量%，α,β-不飽和酸的縮水甘油酯30~1質量%為佳。
接著，與該烯烴系共聚物(a-1)或(a-2)接枝聚合之聚合物或共聚物(b)，係以一種上述通式(1)所示之反覆單位所構成之單獨聚合物或二種以上所構成之共聚物，可舉例如，聚甲基丙烯酸甲酯、聚丙烯酸乙酯、聚丙烯酸丁酯、聚丙烯酸-2-乙基己酯、聚苯乙烯、聚丙烯、丙烯腈-苯乙烯共聚物、丙烯酸丁酯-甲基丙烯酸甲酯共聚物、丙烯酸丁酯-苯乙烯共聚物等，以丙烯酸丁酯-甲基丙烯酸甲酯共聚物特別佳。該等聚合物或共聚物(b)亦係藉由對應之乙烯基系單體之自由基聚合而調製。
使用於本發明之接枝共聚物，其特徵在於：並非單獨使用(a-1)或(a-2)之烯烴系共聚物，或(b)之(共)聚合物((共)聚合物，係表示共聚物或單獨聚合物)，而係(a-1) 或(a-2)之共聚物與(b)之(共)聚合物至少以一點化學鍵結之分枝或具有架橋構造之接枝共聚物，如後所述藉由具有該接枝構造可顯著地得到僅以(a-1)、(a-2)或(b)單獨調合所無法獲得的效果。在此，為構成接枝共聚物的(a-1)或(a-2)與(b)的比例為95：5~5：95(質量比)、以80：20~20：80為佳。
苯乙烯系彈性體，以聚苯乙烯嵌段與聚烯烴構造之彈性體嵌段所構成之嵌段共聚物等為佳。該等嵌段共聚物，可舉聚苯乙烯-聚異戊二烯-聚苯乙烯嵌段共聚物(SIS)、聚苯乙烯-聚(乙烯/丙烯)-聚苯乙烯嵌段共聚物(SEPS)、聚苯乙烯-聚(乙烯/丁烯)-聚苯乙烯嵌段共聚物(SEBS)、聚苯乙烯-聚(乙烯-乙烯/丙烯)-聚苯乙烯嵌段共聚物(SEEPS)等。該等苯乙烯系熱塑性彈性體，係由芳香族乙烯基化合物，與烯烴系化合物或共軛二烯烴化合物所組成之嵌段共聚物。
核殼系彈性體，係具有核層(核部)，與一部分或全部覆蓋該核層(核層之表面)之殼層之多層構造之聚合物。核殼系彈性體，係核層以橡膠成分(軟質成分)構成，特別是以丙烯酸橡膠成分為佳。橡膠成分的玻璃轉移溫度，可例如為未滿0℃(例如-10℃以下)，以-20℃以下(例如-180~-25℃左右)為佳，以-30℃以下(例如-150~-40℃左右度)更佳。
作為橡膠成分的丙烯酸系橡膠，係以丙烯酸系單體[特別是，烷基丙烯酸酯(丁基丙烯酸酯等的丙烯酸C1~12烷 酯，以丙烯酸C1~8烷酯為佳，以丙烯酸C2~6烷酯更佳)等的丙烯酸酯]為主成分的聚合物。丙烯酸系橡膠之，可為丙烯酸系單體的單獨或共聚物(丙烯酸系單體相互之共聚物、丙烯酸系單體與其他含有不飽和鍵結之單體之共聚物等)，亦可為丙烯酸系單體(及含有其他的不飽和鍵結之單體)與架橋性單體之共聚物。
接著，聚酯系彈性體，可分為聚醚型與聚酯型，惟只要其彎曲彈性係數在1000MPa以下，較佳的是700MPa以下，則均可使用。彎曲彈性係數超過1000MPa，則無法獲得充分的柔軟性。所謂聚醚型，係將芳香族聚酯作為硬鏈段，以氧化亞烷基二醇的聚合物與二羧酸所構成汁聚酯作為軟鏈段的聚酯彈性體。硬鏈段中的芳香族聚酯單位，係二羧酸化合物與二羥基化合物之聚縮合、氧代羧酸化合物的聚縮合或該等三成分化合物的聚縮合物。例如，使用聚對苯二甲酸丁二酯等作為硬鏈段。使用由聚烯烴基醚與二羧酸聚縮合的化合物作為柔軟段。例如，使用由四氫呋喃所衍生的聚四亞甲基醚二醇之酯化合物。
所謂聚酯型，係以芳香族聚酯作為硬鏈段，以非晶性聚酯作為柔軟段之聚酯彈性體。硬鏈段中的芳香族聚酯單位與上述聚醚型相同。柔軟段，係藉由內脂的開環聚合物，即聚內脂或由脂肪族二羧酸與脂肪族二醇所衍生的脂肪族聚酯。
使用於本發明之彈性體的種類，並無特別限定，惟具有縮水甘油基的彈性體，與聚對苯二甲酸丁二酯樹脂的密 著性優良，且可提高熔接之成形品之間的熔接強度而佳，具有縮水甘油基的核殼系彈性體，由於熔接強度與流動性的平衡良好而更佳。但是，添加量過多則樹脂組合物的黏度上升，為因流動性的下降而無法得到成形品，故彈性體的添加量，對聚對苯二甲酸丁二酯樹脂(A)100質量部，以5~20質量部為佳，以5~10質量部程度更佳。
以不對熔接之成形品之間的熔接強度帶來不良影響的範圍，為對本發明之聚對苯二甲酸丁二酯樹脂組合物賦予所期望的特性，亦可調合，一般添加於熱塑性樹脂及熱硬化性樹脂等之習知的物質，即氧化防止劑或耐熱穩定劑、紫外線吸收劑等的穩定劑、帶電防止劑、染料或顏料等的著色劑、潤滑劑、可塑劑及結晶化促進劑、結晶核劑、水解促進劑等。
為賦予成形品低彎曲性之苯乙烯丙烯共聚物、苯乙烯丁二烯丙烯共聚物等的樹脂的添加，由於會降低熔接強度而不佳。
用於本發明之樹脂組合物之調製，可使用一般使用於先前的樹脂組合物之調製法之設備與方法容易地調製。例如，1)將各成分混合之後，將混合物藉由單軸或雙軸擠出機，混練擠出而調製膠粒，之後成形的方法；2)首先調製組成不同的膠粒、將該膠粒混合既定量供於成形而成形之後得到目標組成之成形品的方法；3)將各成分之1或2以上直接放入成形機的方法等。此外，將樹脂成分的一部分作成細微的粉體，與此以外的成分混合添加的方法，在圖 謀該等成分的均勻的調合上為良好佳的方法。
<熔接體>
本發明之熔接體，係將由本發明之聚對苯二甲酸丁二酯樹脂組合物所構成之成形品相互熔接而成。
由本發明之樹脂組合物所構成之成形品，可將本發明的樹脂組合物以習知的成形方法成形而製造。先前習知的成形方法，可舉例如射出成形法等。
藉由將如上所述地製造之複數成形品熔接，可製造本發明之熔接體。在於本發明，將成形品相互熔接的方法，並無特別限定，可使用先前習知的熔接方法。可舉例如，振動熔接、超音波熔接、旋轉熔接、熱線熔接、熱板熔接、雷射熔接。進行該等熔接時的熔接條件，並無特別限定，可按照成形品的形狀適宜設定。
在於如上所述之熔接法，係構成熔接之一方的成形品之樹脂組合物，與構成另一方的成形品的樹脂組合物，藉由在成形品相互的接合部附近，以溶融狀態互相混合，之後，固化而進行成形品之間的接合。於本發明，藉由使聚對苯二甲酸丁二酯樹脂的重量平均分子量在於60000以上80000以下的範圍，而在混合的樹脂組合物，使高分子之間容易交絡，而可顯著地提升成形品之間的熔接強度。
於上述熔接法之中，使成形品相互抵接，於該抵接面產生摩擦熱而熔接之方法為佳。於該抵接面產生摩擦熱之熔接方法，可舉振動熔接法、超音波熔接法、旋轉熔接法。
振動熔接，係將成形品相互重疊，將藉由重疊而形成 之抵接面以上下壓接的狀態，藉由以此狀態施以橫向的振動所產生的摩擦熱進行熔接的方法。
超音波熔接，係將成形品相互重疊，將藉由重疊而形成之抵接面以上下壓接的狀態，藉由以此狀態施以超音波對該抵接面產生縱向的振動所產生的摩擦熱進行熔接的方法。
旋轉熔接，係將成形品相互重疊，將藉由重疊而形成之抵接面以上下壓接的狀態，藉由以此狀態使熔接之成形品的一方高速旋轉而產生的摩擦熱進行熔接的方法。
如上所述，藉由摩擦熱熔接的方法，係藉由對成形體相互重疊所產生的抵接面施加一定的壓力，使成形品相互熔接。藉由摩擦熱而熔融的樹脂組合物因壓力而被推動，而有無法施加充分的加壓力而熔接的可能性，惟只要聚對苯二甲酸丁二酯樹脂的重量平均分子量在60000以上80000以下的範圍，則熔融的樹脂組合物具有不會被加壓力推動的程度的黏度，故可邊施加充分的加壓力，將成形品之間熔接。
[實施例]
以下，藉由實施例更詳細地說明本發明，惟本發明並非限定於該等。
<材料>
此外，使用之成分的細節，物性評估之測定法如下所示。
(A)聚對苯二甲酸丁二酯樹脂(PBT樹脂)
(A-1)PBT樹脂：WINTEC POLYMER(股)製重量平均分子量75000，結晶化溫度192℃
(A-2)PBT樹脂：WINTEC POLYMER(股)製重量平均分子量66500，結晶化溫度193℃
(A-3)PBT樹脂：WINTEC POLYMER(股)製重量平均分子量58000，結晶化溫度195℃
(A-4)PBT樹脂：WINTEC POLYMER(股)製重量平均分子量100000，結晶化溫度190℃
(A’)變性PBT樹脂
(A’-1)變性PBT樹脂：WINTEC POLYMER(股)製重量平均分子量58000，異鄰苯二甲酸30mol%變性
(B)玻璃纖維
(B-1)玻璃纖維：日本電氣硝子(股)T127
(C)彈性體
(C-1)縮水甘油基甲基丙烯酸酯變性丙烯酸系核殼聚合物：(股)羅門哈斯製EXL2314
(C-2)丙烯酸系核殼聚合物：(股)羅門哈斯製EXL2311
(C-3)乙烯/縮水甘油基甲基丙烯酸酯-甲基丙烯酸甲酯/丁基丙烯酸酯接枝共聚物：日油株式會社(股)Modiper A4300
(C-4)乙烯乙基丙烯酸酯共聚物：日本Unicar(股)NUC-6570
<實施例1~7、比較例1~5>
將表1所示各成分秤量後乾式混合，使用(股)日本製 鋼所製30mm 2軸押出機TEX-30熔融混練製作膠粒(製作條件：料筒溫度260℃，擠出量15kg/h，螺桿旋轉數130rpm)。接著，由該膠粒製作各試驗片，測定各種物性。將結果一併示於表1。
<分子量>
使用上述所製作的聚對苯二甲酸丁二酯樹脂組合物的膠粒，以TOSO製尺寸排除色層分析儀HLC-8120GPC進行測定。於管柱使用Polymer Laboratories PLgel 5μm Mini MIX-C，以CHCl3 作為沖提液，以流速0.5ml/min，感測器UV/254nm，溫度40℃測定，以Polymer Laboratories公司製的標準樣品Polystyrene Standards(Mw：377400~580)，換算重量平均分子量。
<熔融黏度>
將膠粒以140℃×3h的條件乾燥後，以東洋精密機械(股)製毛細管流變儀，以孔徑=1.0mm，擠筒徑=9.55mm，料筒溫度=260℃，剪速度=1000sec-1 的條件測定溶融黏度(kPa．sec)。
<流動長>
將膠粒以140℃乾燥3小時之後，成形為厚度2mm的棒狀試驗片，以其流動長(mm)判斷。射出條件係以料筒溫度260℃，模具溫度65℃，射出速度4m/min，保壓力依序以3水準(50Mpa、75MPa、100MPa)評估。
<振動熔接強度>
使用發那科公司製的ROBOSHOT α 100iA，料筒溫度 =260℃，射出速度=1m/min，保壓=60MPa，模具溫度=80℃，射出時間=25秒，冷卻時間=10秒的條件，成形圖1所示的剖面形狀的2構件所構成的試驗片。圖1係示意表示振動熔接之2個成形品之剖面之圖，(a)係表示全體的圖，(b)係(a)中的虛線所圍的部分A的擴大圖。
接著，向圖1(a)之箭頭B所示方向施加壓力，使該2構件的端面相互(圖中的2處A部)抵接，對該抵接而成的A部，使用(股)日本Emerson製Orbita1100振動熔接機，頻率=203Hz，實加壓力=1.5Bar，熔接餘白=1.0mm，振幅=0.8mm的條件進行振動熔接。熔接之後，將試驗片一部分以切削加工切下，以萬能試驗機((股)Orientec製萬能拉力機UTA-50kN)，以速度5.0mm/min測定打穿剪強度，作為振動熔接強度。
<冷熱處理之後的振動熔接強度保持率>
將上述振動熔接強度測定用試驗片，以「-40℃ 30分鐘、120℃ 30分鐘」作為1循環，處理3000循環之後，測定熔接強度，求對處理前之熔接強度之保持率。
<冷熱處理之後的材料強度保持率>
使用發那科公司製的ROBOSHOT S2000i100B，料筒溫度=260℃，射出速度=1m/min，保壓=60MPa，模具溫度=80℃，依照ISO3167製造引張試驗片，依照ISO527測定引張強度。
此外，將上述引張試驗片，以「-40℃ 30分鐘、120℃ 30分鐘」作為1循環，處理3000循環之後，測定引張強度， 求對處理前的引張強度之保持率。
<超音波熔接強度>
使用住友重機械工業公司製SE100D，以料筒溫度=260℃，射出速度=1m/min，保壓=70MPa，模具溫度=80℃，射出時間=10秒，冷卻時間=10秒的條件，成形圖2所示剖面形狀的2構件所組成的試驗片。圖2係示意表示以超音波熔接之2個成形品之剖面之圖，(a)係表示全體之圖，(b)係(a)以虛線所圍之部分C之放大圖。
接著，與上述振動熔接時同樣地，使2構件的端面相互(圖中的2處的C部)抵接，向該接面施加壓力的狀態，對該抵接而成的C部，使用精電會電子工業製超音波焊接器SONOPET Σ-1200超音波熔接機，以焊頭振幅60μm，振動頻率20kHz，輸出1.2kW，加壓力0.1MPa的條件進行超音波熔接。熔接之後，將試驗片一部分以切削加工切下，以萬能試驗機((股)Orientec製萬能拉力機UTA-50kN)，以速度5.0mm/min測定打穿剪強度，作為超音波熔接強度。
如表1所記載，確認分子量在於特定範圍的聚對苯二甲酸丁二酯樹脂的聚對苯二甲酸丁二酯樹脂組合物的流動性優良，且相互熔接本發明之樹脂組合物所構成之成形品而成之熔接體，成形品之間的熔接強度很強，耐衝擊性亦優良。
再者，如「冷熱處理之後的材料強度保持率」的結果所示，對包含分子量不同的聚對苯二甲酸丁二酯樹脂的聚 對苯二甲酸丁二酯樹脂組合物所構成之成形品，即使分別進行同樣的冷熱處理時，成形品本身的強度幾乎沒有因分子量的影響。雖然如此，如「冷熱處理之後的振動熔接強度保持率」的結果所示，於熔接體的耐熱衝擊性出現因分子量的影響，於本發明之分子量的範圍顯示優良的耐熱衝擊性。由以上，確認聚對苯二甲酸丁二酯樹脂的分子量，特別對熔接體的特性有影響。
圖1係示意表示振動熔接之2個成形品之剖斷之圖，(a)係表示全體之圖，(b)係(a)中的虛線所圍的部分A的放大圖。
圖2係示意表示超音波熔接之2個成形品之剖面之圖，(a)係表示全體之圖，(b)係(a)中的虛線所圍的部分C的放大圖。

Claims (3)

  1. 一種聚對苯二甲酸丁二酯樹脂組合物，其包含熱塑性樹脂、和無機填充劑(B)，該熱塑性樹脂只由聚對苯二甲酸丁二酯樹脂(A)和彈性體(C)所構成，該聚對苯二甲酸丁二酯樹脂(A)的重量平均分子量為60000以上、80000以下，該彈性體(C)，相對於該聚對苯二甲酸丁二酯樹脂(A)100質量部，為5~20質量部。
  2. 一種熔接體，將申請專利範圍第1項所述的聚對苯二甲酸丁二酯樹脂組合物所構成之成形品相互熔接而成。
  3. 如申請專利範圍第2項所述的熔接體，將上述成形品相互抵接，對抵接面產生摩擦熱熔接而成。
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