TWI503340B - 底層充填組成物及使用該組成物製造電氣組合件之方法 - Google Patents

底層充填組成物及使用該組成物製造電氣組合件之方法 Download PDF

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TWI503340B
TWI503340B TW099140304A TW99140304A TWI503340B TW I503340 B TWI503340 B TW I503340B TW 099140304 A TW099140304 A TW 099140304A TW 99140304 A TW99140304 A TW 99140304A TW I503340 B TWI503340 B TW I503340B
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composition
underfill
present
filler
dioxide
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TW099140304A
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TW201139492A (en
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馬克Ｂ 威爾森
史戴分尼Ｌ 波堤薩克
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陶氏全球科技責任有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
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    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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TW099140304A 2009-11-23 2010-11-23 底層充填組成物及使用該組成物製造電氣組合件之方法 TWI503340B (zh)

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