KR20110060823A - 언더필용 에폭시 수지 제제 - Google Patents

언더필용 에폭시 수지 제제 Download PDF

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KR20110060823A
KR20110060823A KR1020100116890A KR20100116890A KR20110060823A KR 20110060823 A KR20110060823 A KR 20110060823A KR 1020100116890 A KR1020100116890 A KR 1020100116890A KR 20100116890 A KR20100116890 A KR 20100116890A KR 20110060823 A KR20110060823 A KR 20110060823A
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underfill
composition
substrate
electronic component
present
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Korean (ko)
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마크 비. 윌슨
스테파니 엘. 포티섹
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다우 글로벌 테크놀로지스 엘엘씨
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    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
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    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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