TWI490996B - 接合用導線 - Google Patents

接合用導線 Download PDF

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Publication number
TWI490996B
TWI490996B TW103108465A TW103108465A TWI490996B TW I490996 B TWI490996 B TW I490996B TW 103108465 A TW103108465 A TW 103108465A TW 103108465 A TW103108465 A TW 103108465A TW I490996 B TWI490996 B TW I490996B
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Taiwan
Prior art keywords
wire
mass
less
bonding
ppm
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TW103108465A
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English (en)
Chinese (zh)
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TW201448152A (zh
Inventor
Tsuyoshi Hasegawa
Original Assignee
Tatsuta Densen Kk
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Publication of TW201448152A publication Critical patent/TW201448152A/zh
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Publication of TWI490996B publication Critical patent/TWI490996B/zh

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    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
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    • H01L2224/49105—Connecting at different heights
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
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    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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SG11201604430YA (en) 2015-07-23 2017-02-27 Nippon Micrometal Corp Bonding wire for semiconductor device
SG10201508103QA (en) * 2015-09-29 2017-04-27 Heraeus Materials Singapore Pte Ltd Alloyed silver wire
WO2017154453A1 (ja) * 2016-03-11 2017-09-14 タツタ電線株式会社 ボンディングワイヤ
TWI609977B (zh) * 2016-10-17 2018-01-01 光大應用材料科技股份有限公司 銀合金線材
CN114502754B (zh) * 2019-10-01 2023-11-17 田中电子工业株式会社 引线接合结构和其中使用的接合线及半导体装置
CN111029267B (zh) * 2019-11-22 2021-12-24 中国电子科技集团公司第十三研究所 一种倒装互连结构及其制备方法

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