TWI487442B - 用於處理待處理平面材料的方法、處理台與組件 - Google Patents

用於處理待處理平面材料的方法、處理台與組件 Download PDF

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Publication number
TWI487442B
TWI487442B TW099115099A TW99115099A TWI487442B TW I487442 B TWI487442 B TW I487442B TW 099115099 A TW099115099 A TW 099115099A TW 99115099 A TW99115099 A TW 99115099A TW I487442 B TWI487442 B TW I487442B
Authority
TW
Taiwan
Prior art keywords
reel
treated
processing station
processing
gap
Prior art date
Application number
TW099115099A
Other languages
English (en)
Chinese (zh)
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TW201108890A (en
Inventor
漢瑞 庫茲
Original Assignee
亞妥帖德國股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 亞妥帖德國股份有限公司 filed Critical 亞妥帖德國股份有限公司
Publication of TW201108890A publication Critical patent/TW201108890A/zh
Application granted granted Critical
Publication of TWI487442B publication Critical patent/TWI487442B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Advancing Webs (AREA)
  • Treatment Of Fiber Materials (AREA)
TW099115099A 2009-05-13 2010-05-12 用於處理待處理平面材料的方法、處理台與組件 TWI487442B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009021042 2009-05-13

Publications (2)

Publication Number Publication Date
TW201108890A TW201108890A (en) 2011-03-01
TWI487442B true TWI487442B (zh) 2015-06-01

Family

ID=42289719

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099115099A TWI487442B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法、處理台與組件
TW099115101A TWI492684B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW099115101A TWI492684B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置

Country Status (9)

Country Link
US (2) US9016230B2 (cg-RX-API-DMAC10.html)
EP (2) EP2430890B1 (cg-RX-API-DMAC10.html)
JP (2) JP5410598B2 (cg-RX-API-DMAC10.html)
KR (2) KR101284197B1 (cg-RX-API-DMAC10.html)
CN (2) CN102422727B (cg-RX-API-DMAC10.html)
BR (2) BRPI1011372B1 (cg-RX-API-DMAC10.html)
MY (2) MY153831A (cg-RX-API-DMAC10.html)
TW (2) TWI487442B (cg-RX-API-DMAC10.html)
WO (2) WO2010130444A1 (cg-RX-API-DMAC10.html)

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US20140020723A1 (en) * 2012-07-12 2014-01-23 James Murphy Mat cleaning system
DE102013207343B3 (de) * 2013-04-23 2014-08-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut
EP2854490A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method and apparatus for a wet-chemical or electrochemical treatment
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
JP6634098B2 (ja) 2015-06-30 2020-01-22 サン−ゴバン パフォーマンス プラスティックス コーポレイション 滑り軸受け
JP6070804B2 (ja) * 2015-10-21 2017-02-01 Ｊｆｅスチール株式会社 基材へのスラリー塗布方法及び塗布装置
CN105543945B (zh) * 2015-12-09 2018-05-15 东莞市威力固电路板设备有限公司 挤水辊装置
CN105780096B (zh) * 2016-05-25 2018-06-22 南通汇丰电子科技有限公司 一种电镀传动装置
KR102731377B1 (ko) * 2016-11-28 2024-11-15 엘지디스플레이 주식회사 롤투롤 제조장치
TWI620905B (zh) * 2017-06-14 2018-04-11 住華科技股份有限公司 除液裝置
CN109323162B (zh) * 2018-06-27 2023-10-13 深圳市烨光璇电子科技有限公司 背光模组生产线
CN110834345B (zh) * 2018-08-17 2022-09-09 扬博科技股份有限公司 可操控夹具启闭的致动装置
US12420305B2 (en) * 2019-08-12 2025-09-23 Louisiana-Pacific Corp. Coating process for engineered-wood panels or components

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TW200525051A (en) * 2003-12-10 2005-08-01 Hoellmueller Maschbau H Method and apparatus for carrying and treating flat material without contact by continuous equipment

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TW200525051A (en) * 2003-12-10 2005-08-01 Hoellmueller Maschbau H Method and apparatus for carrying and treating flat material without contact by continuous equipment

Also Published As

Publication number Publication date
JP5410598B2 (ja) 2014-02-05
BRPI1011372A2 (pt) 2016-03-15
MY156875A (en) 2016-04-15
KR20120010276A (ko) 2012-02-02
WO2010130444A1 (de) 2010-11-18
EP2430889A1 (de) 2012-03-21
TW201108890A (en) 2011-03-01
US20120080322A1 (en) 2012-04-05
JP5512799B2 (ja) 2014-06-04
US9713265B2 (en) 2017-07-18
TW201110838A (en) 2011-03-16
EP2430890B1 (de) 2014-12-10
HK1167985A1 (en) 2012-12-14
JP2012527104A (ja) 2012-11-01
US9016230B2 (en) 2015-04-28
CN102422728B (zh) 2015-04-01
WO2010130445A1 (de) 2010-11-18
TWI492684B (zh) 2015-07-11
KR20120030414A (ko) 2012-03-28
JP2012527103A (ja) 2012-11-01
KR101341146B1 (ko) 2013-12-11
BRPI1011372B1 (pt) 2019-12-10
KR101284197B1 (ko) 2013-07-09
US20120111365A1 (en) 2012-05-10
BRPI1011369A2 (pt) 2016-03-15
CN102422728A (zh) 2012-04-18
CN102422727B (zh) 2015-05-13
MY153831A (en) 2015-03-31
CN102422727A (zh) 2012-04-18
EP2430890A1 (de) 2012-03-21
EP2430889B1 (de) 2014-04-30

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