CN102422727B - 用于处理平面处理物的方法和设备以及用于去除或挡住处理液的装置 - Google Patents

用于处理平面处理物的方法和设备以及用于去除或挡住处理液的装置 Download PDF

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Publication number
CN102422727B
CN102422727B CN201080021230.6A CN201080021230A CN102422727B CN 102422727 B CN102422727 B CN 102422727B CN 201080021230 A CN201080021230 A CN 201080021230A CN 102422727 B CN102422727 B CN 102422727B
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CN
China
Prior art keywords
treatment
return
gap
liquid
return surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080021230.6A
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English (en)
Chinese (zh)
Other versions
CN102422727A (zh
Inventor
亨利·孔策
费迪南德·维纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN102422727A publication Critical patent/CN102422727A/zh
Application granted granted Critical
Publication of CN102422727B publication Critical patent/CN102422727B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Advancing Webs (AREA)
  • Treatment Of Fiber Materials (AREA)
CN201080021230.6A 2009-05-13 2010-05-12 用于处理平面处理物的方法和设备以及用于去除或挡住处理液的装置 Expired - Fee Related CN102422727B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009021042 2009-05-13
DE102009021042.3 2009-05-13
PCT/EP2010/002939 WO2010130445A1 (de) 2009-05-13 2010-05-12 Verfahren und anlage zum behandeln von flächigem behandlungsgut und vorrichtung zum entfernen oder abhalten von behandlungsflüssigkeit

Publications (2)

Publication Number Publication Date
CN102422727A CN102422727A (zh) 2012-04-18
CN102422727B true CN102422727B (zh) 2015-05-13

Family

ID=42289719

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201080021230.6A Expired - Fee Related CN102422727B (zh) 2009-05-13 2010-05-12 用于处理平面处理物的方法和设备以及用于去除或挡住处理液的装置
CN201080021231.0A Expired - Fee Related CN102422728B (zh) 2009-05-13 2010-05-12 用于处理平面处理物的方法、处理站和设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201080021231.0A Expired - Fee Related CN102422728B (zh) 2009-05-13 2010-05-12 用于处理平面处理物的方法、处理站和设备

Country Status (9)

Country Link
US (2) US9016230B2 (cg-RX-API-DMAC10.html)
EP (2) EP2430890B1 (cg-RX-API-DMAC10.html)
JP (2) JP5410598B2 (cg-RX-API-DMAC10.html)
KR (2) KR101284197B1 (cg-RX-API-DMAC10.html)
CN (2) CN102422727B (cg-RX-API-DMAC10.html)
BR (2) BRPI1011372B1 (cg-RX-API-DMAC10.html)
MY (2) MY153831A (cg-RX-API-DMAC10.html)
TW (2) TWI487442B (cg-RX-API-DMAC10.html)
WO (2) WO2010130444A1 (cg-RX-API-DMAC10.html)

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US20140020723A1 (en) * 2012-07-12 2014-01-23 James Murphy Mat cleaning system
DE102013207343B3 (de) * 2013-04-23 2014-08-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut
EP2854490A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method and apparatus for a wet-chemical or electrochemical treatment
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
JP6634098B2 (ja) 2015-06-30 2020-01-22 サン−ゴバン パフォーマンス プラスティックス コーポレイション 滑り軸受け
JP6070804B2 (ja) * 2015-10-21 2017-02-01 Ｊｆｅスチール株式会社 基材へのスラリー塗布方法及び塗布装置
CN105543945B (zh) * 2015-12-09 2018-05-15 东莞市威力固电路板设备有限公司 挤水辊装置
CN105780096B (zh) * 2016-05-25 2018-06-22 南通汇丰电子科技有限公司 一种电镀传动装置
KR102731377B1 (ko) * 2016-11-28 2024-11-15 엘지디스플레이 주식회사 롤투롤 제조장치
TWI620905B (zh) * 2017-06-14 2018-04-11 住華科技股份有限公司 除液裝置
CN109323162B (zh) * 2018-06-27 2023-10-13 深圳市烨光璇电子科技有限公司 背光模组生产线
CN110834345B (zh) * 2018-08-17 2022-09-09 扬博科技股份有限公司 可操控夹具启闭的致动装置
US12420305B2 (en) * 2019-08-12 2025-09-23 Louisiana-Pacific Corp. Coating process for engineered-wood panels or components

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CN100466882C (zh) * 2002-02-12 2009-03-04 埃托特克德国有限公司 在输送带式处理线上传送平坦工件的装置和方法

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Also Published As

Publication number Publication date
JP5410598B2 (ja) 2014-02-05
BRPI1011372A2 (pt) 2016-03-15
TWI487442B (zh) 2015-06-01
MY156875A (en) 2016-04-15
KR20120010276A (ko) 2012-02-02
WO2010130444A1 (de) 2010-11-18
EP2430889A1 (de) 2012-03-21
TW201108890A (en) 2011-03-01
US20120080322A1 (en) 2012-04-05
JP5512799B2 (ja) 2014-06-04
US9713265B2 (en) 2017-07-18
TW201110838A (en) 2011-03-16
EP2430890B1 (de) 2014-12-10
HK1167985A1 (en) 2012-12-14
JP2012527104A (ja) 2012-11-01
US9016230B2 (en) 2015-04-28
CN102422728B (zh) 2015-04-01
WO2010130445A1 (de) 2010-11-18
TWI492684B (zh) 2015-07-11
KR20120030414A (ko) 2012-03-28
JP2012527103A (ja) 2012-11-01
KR101341146B1 (ko) 2013-12-11
BRPI1011372B1 (pt) 2019-12-10
KR101284197B1 (ko) 2013-07-09
US20120111365A1 (en) 2012-05-10
BRPI1011369A2 (pt) 2016-03-15
CN102422728A (zh) 2012-04-18
MY153831A (en) 2015-03-31
CN102422727A (zh) 2012-04-18
EP2430890A1 (de) 2012-03-21
EP2430889B1 (de) 2014-04-30

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