HK1095968A1 - Nozzle arrangement and method for processing a material for processing with a processing medium - Google Patents

Nozzle arrangement and method for processing a material for processing with a processing medium

Info

Publication number
HK1095968A1
HK1095968A1 HK07103098.8A HK07103098A HK1095968A1 HK 1095968 A1 HK1095968 A1 HK 1095968A1 HK 07103098 A HK07103098 A HK 07103098A HK 1095968 A1 HK1095968 A1 HK 1095968A1
Authority
HK
Hong Kong
Prior art keywords
processing
nozzle arrangement
medium
flow
transport direction
Prior art date
Application number
HK07103098.8A
Inventor
Henry Kunze
Ferdinand Wiener
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34778073&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1095968(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1095968A1 publication Critical patent/HK1095968A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

A nozzle arrangement is disclosed, for particular application as flushing nozzles in galvanising units with horizontal flow of a material (10) for processing, in the form of circuit boards. The material (10) for processing may thus be transported in a transport direction (18) from an entry region (15) to an exit region (16) of the nozzle arrangement. The nozzle arrangement comprises at least one nozzle opening (8), embodied such that a flow of a material (10) for processing runs at an inclined given angle to a transport plane of the material (10) for processing, such that the flow of the processing medium is diverted in the transport direction (18) of the material (10) for processing.
HK07103098.8A 2004-01-16 2007-03-22 Nozzle arrangement and method for processing a material for processing with a processing medium HK1095968A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004002421A DE102004002421A1 (en) 2004-01-16 2004-01-16 nozzle assembly
PCT/EP2005/000269 WO2005069704A1 (en) 2004-01-16 2005-01-13 Nozzle arrangement and method for processing a material for processing with a processing medium

Publications (1)

Publication Number Publication Date
HK1095968A1 true HK1095968A1 (en) 2007-05-18

Family

ID=34778073

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07103098.8A HK1095968A1 (en) 2004-01-16 2007-03-22 Nozzle arrangement and method for processing a material for processing with a processing medium

Country Status (12)

Country Link
EP (1) EP1704759B1 (en)
JP (1) JP5005353B2 (en)
KR (1) KR101203458B1 (en)
CN (1) CN1910972B (en)
AT (1) ATE358410T1 (en)
BR (1) BRPI0506905A (en)
DE (2) DE102004002421A1 (en)
ES (1) ES2281069T3 (en)
HK (1) HK1095968A1 (en)
PL (1) PL1704759T3 (en)
TW (1) TWI304753B (en)
WO (1) WO2005069704A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004002421A1 (en) * 2004-01-16 2005-08-18 Atotech Deutschland Gmbh nozzle assembly
DE102006055112A1 (en) * 2006-11-21 2008-05-29 Billhöfer Maschinenfabrik GmbH & Co. KG Apparatus for coating a welded or glued seam of a container, associated method and container produced by this method
DE102009032217A1 (en) * 2009-07-06 2011-01-13 Gebr. Schmid Gmbh & Co. Method and device for the treatment of substrates
DE102009034686B3 (en) * 2009-07-24 2010-12-09 Windmöller & Hölscher Kg Device for providing workpieces or webs with glue
DE102009048820A1 (en) * 2009-10-09 2011-04-14 Andritz Küsters Gmbh Curtain applicator
DE102012212665A1 (en) * 2012-07-19 2014-01-23 Robert Bosch Gmbh Device useful for coating a first component surface of a component, preferably a substrate for a thin-film solar cell, comprises a first liquid for coating the first component surface, and a second liquid different from the first liquid
DE102014007057B3 (en) * 2014-05-15 2015-09-24 Atotech Deutschland Gmbh Method and device for the treatment of sensitive plate-shaped and flexible workpieces by guiding the same in a channel flow
CN107635722B (en) * 2015-06-23 2021-11-05 戴科知识产权控股有限责任公司 Method for post-mold treatment of a venturi device or check valve
CN115644495A (en) * 2022-10-11 2023-01-31 广东中烟工业有限责任公司 Residual waste cigarette tobacco shred recovery device

Family Cites Families (26)

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US2900992A (en) * 1956-03-14 1959-08-25 Ajem Lab Inc Metal processing apparatus
JPS5911648B2 (en) * 1976-08-02 1984-03-16 大同製鋼株式会社 Flotation device for strip material
JPS57176790A (en) * 1981-04-22 1982-10-30 Koito Mfg Co Ltd Method of producing laminated printed circuit board
JPS59109273A (en) * 1982-12-15 1984-06-23 Matsushita Electric Ind Co Ltd Nozzle for rotary coater
DE3528575A1 (en) * 1985-08-06 1987-02-19 Schering Ag METHOD AND DEVICE FOR CLEANING, ACTIVATING AND / OR METALLIZING DRILL HOLES IN HORIZONTALLY GUIDED PCBS
US4938257A (en) 1986-11-21 1990-07-03 Teledyne Industries, Inc. Printed circuit cleaning apparatus
DE8703114U1 (en) * 1987-02-25 1987-04-09 Schering Ag, 1000 Berlin Und 4709 Bergkamen, De
DE3708529A1 (en) * 1987-03-16 1988-09-29 Siemens Ag Cleansing module
JPS64523U (en) * 1987-06-22 1989-01-05
JPH0350792A (en) * 1989-07-19 1991-03-05 Canon Inc Very small hole treatment for printed board and device therefor
US5294259A (en) * 1992-05-18 1994-03-15 International Business Machines Corporation Fluid treatment device
US5378307A (en) * 1993-04-28 1995-01-03 International Business Machines Corporation Fluid treatment apparatus
JPH08274014A (en) * 1995-03-29 1996-10-18 Tokyo Ohka Kogyo Co Ltd Coating nozzle, coating method using the same and applying device with the coating nozzle assembled thereinto
US5904773A (en) 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
KR100195334B1 (en) * 1996-08-16 1999-06-15 구본준 A cleaning apparatus
DE19723458A1 (en) * 1997-06-04 1998-12-10 Voith Sulzer Papiermasch Gmbh Device and method for applying a liquid or pasty medium to a moving surface
US6444269B1 (en) * 1997-06-27 2002-09-03 Alcan International Limited Apparatus and method for coating sheet or strip articles
JP4090585B2 (en) * 1997-08-04 2008-05-28 松下電器産業株式会社 Heat treatment method for target object and apparatus therefor
JP3521716B2 (en) * 1997-11-25 2004-04-19 凸版印刷株式会社 Coating liquid supply device for spin coating device
JP2001010724A (en) * 1999-06-28 2001-01-16 Watanabe Shoko:Kk Floating carrier device
US6265020B1 (en) * 1999-09-01 2001-07-24 Shipley Company, L.L.C. Fluid delivery systems for electronic device manufacture
DE10044209A1 (en) * 2000-09-07 2002-04-04 Schmid Gmbh & Co Geb Method and device for treating objects, especially printed circuit boards
US6736484B2 (en) * 2001-12-14 2004-05-18 Seiko Epson Corporation Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter method of manufacture thereof, and device for manufacturing thereof; and device incorporating backing, method of manufacturing thereof, and device for manufacture thereof
CN1269994C (en) * 2002-02-11 2006-08-16 皮尔注册商人 Apparatus for spraying printed circuit-board
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly
DE102004002421A1 (en) * 2004-01-16 2005-08-18 Atotech Deutschland Gmbh nozzle assembly

Also Published As

Publication number Publication date
EP1704759A1 (en) 2006-09-27
KR101203458B1 (en) 2012-11-21
KR20060130174A (en) 2006-12-18
EP1704759B1 (en) 2007-03-28
WO2005069704A1 (en) 2005-07-28
JP2007517649A (en) 2007-07-05
TW200529928A (en) 2005-09-16
DE102004002421A1 (en) 2005-08-18
CN1910972B (en) 2010-10-13
PL1704759T3 (en) 2007-08-31
ATE358410T1 (en) 2007-04-15
BRPI0506905A (en) 2007-05-29
CN1910972A (en) 2007-02-07
TWI304753B (en) 2009-01-01
DE502005000528D1 (en) 2007-05-10
JP5005353B2 (en) 2012-08-22
ES2281069T3 (en) 2007-09-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160113