TWI487054B - Loader - Google Patents

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Publication number
TWI487054B
TWI487054B TW099131854A TW99131854A TWI487054B TW I487054 B TWI487054 B TW I487054B TW 099131854 A TW099131854 A TW 099131854A TW 99131854 A TW99131854 A TW 99131854A TW I487054 B TWI487054 B TW I487054B
Authority
TW
Taiwan
Prior art keywords
cassette
wafer
loader
moving body
dicing frame
Prior art date
Application number
TW099131854A
Other languages
English (en)
Chinese (zh)
Other versions
TW201135862A (en
Inventor
Munetoshi Nagasaka
Ikuo Ogasawara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201135862A publication Critical patent/TW201135862A/zh
Application granted granted Critical
Publication of TWI487054B publication Critical patent/TWI487054B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099131854A 2009-09-21 2010-09-20 Loader TWI487054B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ

Publications (2)

Publication Number Publication Date
TW201135862A TW201135862A (en) 2011-10-16
TWI487054B true TWI487054B (zh) 2015-06-01

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099131854A TWI487054B (zh) 2009-09-21 2010-09-20 Loader

Country Status (4)

Country Link
JP (1) JP5384270B2 (enExample)
KR (1) KR101250135B1 (enExample)
CN (1) CN102024727B (enExample)
TW (1) TWI487054B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040040661A1 (en) * 2002-08-29 2004-03-04 Tadashi Obikane Load port capable of coping with different types of cassette containing substrates to be processed
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
JP4300003B2 (ja) * 2002-08-07 2009-07-22 東京エレクトロン株式会社 載置台の駆動装置及びプローブ方法
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP5381118B2 (ja) * 2009-01-21 2014-01-08 東京エレクトロン株式会社 プローブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040040661A1 (en) * 2002-08-29 2004-03-04 Tadashi Obikane Load port capable of coping with different types of cassette containing substrates to be processed
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法

Also Published As

Publication number Publication date
TW201135862A (en) 2011-10-16
CN102024727A (zh) 2011-04-20
JP2011066368A (ja) 2011-03-31
CN102024727B (zh) 2013-04-17
JP5384270B2 (ja) 2014-01-08
KR20110031884A (ko) 2011-03-29
KR101250135B1 (ko) 2013-04-04

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