CN102024727B - 加载器 - Google Patents

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Publication number
CN102024727B
CN102024727B CN2010102875090A CN201010287509A CN102024727B CN 102024727 B CN102024727 B CN 102024727B CN 2010102875090 A CN2010102875090 A CN 2010102875090A CN 201010287509 A CN201010287509 A CN 201010287509A CN 102024727 B CN102024727 B CN 102024727B
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CN
China
Prior art keywords
wafer
carrier
mentioned
loader
dicing frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2010102875090A
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English (en)
Chinese (zh)
Other versions
CN102024727A (zh
Inventor
长坂旨俊
小笠原郁男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102024727A publication Critical patent/CN102024727A/zh
Application granted granted Critical
Publication of CN102024727B publication Critical patent/CN102024727B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2010102875090A 2009-09-21 2010-09-17 加载器 Active CN102024727B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ
JP2009-218244 2009-09-21

Publications (2)

Publication Number Publication Date
CN102024727A CN102024727A (zh) 2011-04-20
CN102024727B true CN102024727B (zh) 2013-04-17

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102875090A Active CN102024727B (zh) 2009-09-21 2010-09-17 加载器

Country Status (4)

Country Link
JP (1) JP5384270B2 (enExample)
KR (1) KR101250135B1 (enExample)
CN (1) CN102024727B (enExample)
TW (1) TWI487054B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328777C (zh) * 2002-05-29 2007-07-25 东京毅力科创株式会社 探测片搬送装置及被接合体移动机构
CN100397091C (zh) * 2002-08-07 2008-06-25 东京毅力科创株式会社 装载台驱动装置与探查方法
CN101276771A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 被检查体的搬送装置和检查装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法
JP5381118B2 (ja) * 2009-01-21 2014-01-08 東京エレクトロン株式会社 プローブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328777C (zh) * 2002-05-29 2007-07-25 东京毅力科创株式会社 探测片搬送装置及被接合体移动机构
CN100397091C (zh) * 2002-08-07 2008-06-25 东京毅力科创株式会社 装载台驱动装置与探查方法
CN101276771A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 被检查体的搬送装置和检查装置

Also Published As

Publication number Publication date
TW201135862A (en) 2011-10-16
CN102024727A (zh) 2011-04-20
JP2011066368A (ja) 2011-03-31
TWI487054B (zh) 2015-06-01
JP5384270B2 (ja) 2014-01-08
KR20110031884A (ko) 2011-03-29
KR101250135B1 (ko) 2013-04-04

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