KR101250135B1 - 로더 - Google Patents

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Publication number
KR101250135B1
KR101250135B1 KR1020100089380A KR20100089380A KR101250135B1 KR 101250135 B1 KR101250135 B1 KR 101250135B1 KR 1020100089380 A KR1020100089380 A KR 1020100089380A KR 20100089380 A KR20100089380 A KR 20100089380A KR 101250135 B1 KR101250135 B1 KR 101250135B1
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KR
South Korea
Prior art keywords
wafer
cassette
loader
dicing frame
movable body
Prior art date
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Active
Application number
KR1020100089380A
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English (en)
Korean (ko)
Other versions
KR20110031884A (ko
Inventor
무네토시 나가사카
이쿠오 오가사와라
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110031884A publication Critical patent/KR20110031884A/ko
Application granted granted Critical
Publication of KR101250135B1 publication Critical patent/KR101250135B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100089380A 2009-09-21 2010-09-13 로더 Active KR101250135B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ
JPJP-P-2009-218244 2009-09-21

Publications (2)

Publication Number Publication Date
KR20110031884A KR20110031884A (ko) 2011-03-29
KR101250135B1 true KR101250135B1 (ko) 2013-04-04

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100089380A Active KR101250135B1 (ko) 2009-09-21 2010-09-13 로더

Country Status (4)

Country Link
JP (1) JP5384270B2 (enExample)
KR (1) KR101250135B1 (enExample)
CN (1) CN102024727B (enExample)
TW (1) TWI487054B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
KR20100085877A (ko) * 2009-01-21 2010-07-29 도쿄엘렉트론가부시키가이샤 프로브 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
JP4300003B2 (ja) * 2002-08-07 2009-07-22 東京エレクトロン株式会社 載置台の駆動装置及びプローブ方法
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
KR20100085877A (ko) * 2009-01-21 2010-07-29 도쿄엘렉트론가부시키가이샤 프로브 장치

Also Published As

Publication number Publication date
TW201135862A (en) 2011-10-16
CN102024727A (zh) 2011-04-20
JP2011066368A (ja) 2011-03-31
CN102024727B (zh) 2013-04-17
TWI487054B (zh) 2015-06-01
JP5384270B2 (ja) 2014-01-08
KR20110031884A (ko) 2011-03-29

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