JP5384270B2 - ローダ - Google Patents

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Publication number
JP5384270B2
JP5384270B2 JP2009218244A JP2009218244A JP5384270B2 JP 5384270 B2 JP5384270 B2 JP 5384270B2 JP 2009218244 A JP2009218244 A JP 2009218244A JP 2009218244 A JP2009218244 A JP 2009218244A JP 5384270 B2 JP5384270 B2 JP 5384270B2
Authority
JP
Japan
Prior art keywords
wafer
cassette
loader
dicing frame
moving body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009218244A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011066368A (ja
JP2011066368A5 (enExample
Inventor
旨俊 長坂
郁男 小笠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009218244A priority Critical patent/JP5384270B2/ja
Priority to KR1020100089380A priority patent/KR101250135B1/ko
Priority to CN2010102875090A priority patent/CN102024727B/zh
Priority to TW099131854A priority patent/TWI487054B/zh
Publication of JP2011066368A publication Critical patent/JP2011066368A/ja
Publication of JP2011066368A5 publication Critical patent/JP2011066368A5/ja
Application granted granted Critical
Publication of JP5384270B2 publication Critical patent/JP5384270B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009218244A 2009-09-21 2009-09-21 ローダ Active JP5384270B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ
KR1020100089380A KR101250135B1 (ko) 2009-09-21 2010-09-13 로더
CN2010102875090A CN102024727B (zh) 2009-09-21 2010-09-17 加载器
TW099131854A TWI487054B (zh) 2009-09-21 2010-09-20 Loader

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ

Publications (3)

Publication Number Publication Date
JP2011066368A JP2011066368A (ja) 2011-03-31
JP2011066368A5 JP2011066368A5 (enExample) 2012-09-13
JP5384270B2 true JP5384270B2 (ja) 2014-01-08

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009218244A Active JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ

Country Status (4)

Country Link
JP (1) JP5384270B2 (enExample)
KR (1) KR101250135B1 (enExample)
CN (1) CN102024727B (enExample)
TW (1) TWI487054B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
JP4300003B2 (ja) * 2002-08-07 2009-07-22 東京エレクトロン株式会社 載置台の駆動装置及びプローブ方法
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法
JP5381118B2 (ja) * 2009-01-21 2014-01-08 東京エレクトロン株式会社 プローブ装置

Also Published As

Publication number Publication date
TW201135862A (en) 2011-10-16
CN102024727A (zh) 2011-04-20
JP2011066368A (ja) 2011-03-31
CN102024727B (zh) 2013-04-17
TWI487054B (zh) 2015-06-01
KR20110031884A (ko) 2011-03-29
KR101250135B1 (ko) 2013-04-04

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