JP5436949B2 - アダプタユニット内蔵型ローダ室 - Google Patents
アダプタユニット内蔵型ローダ室 Download PDFInfo
- Publication number
- JP5436949B2 JP5436949B2 JP2009148302A JP2009148302A JP5436949B2 JP 5436949 B2 JP5436949 B2 JP 5436949B2 JP 2009148302 A JP2009148302 A JP 2009148302A JP 2009148302 A JP2009148302 A JP 2009148302A JP 5436949 B2 JP5436949 B2 JP 5436949B2
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- JP
- Japan
- Prior art keywords
- adapter unit
- processed
- semiconductor wafer
- unit
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
11 カセット載置部室
12 第1のウエハ搬送機構
13 バッファテーブル載置部
16 センタリング機構
20 プローバ室
30 アダプタユニット
31 ユニット本体
32 支持部材
32A 第1の支持部材
32B 第2の支持部材
34 光学センサ
W 半導体ウエハ
Claims (6)
- 複数の被処理体を収納する容器を載置する載置部と、上記載置部に載置された上記容器と処理室との間で上記被処理体を搬送する搬送機構と、を備えたローダ室であって、上記載置部とは別の部位に上記被処理体を搬送する自動搬送装置に対応して設けられ、上記自動搬送装置及び上記処理室それぞれとの間で搬送される上記被処理体を複数保持するアダプタユニットと、上記アダプタユニットの下方に設けられ、上記搬送機構と協働して上記被処理体のセンタリングを行うセンタリング機構と、を備え、上記センタリング機構は、上記搬送機構による上記被処理体の搬送方向で上記搬送機構側から上記被処理体のプリアライメント機構を構成する回転体の中心を通る延長線を挟む左右対称位置に立設された一対のセンタリング部材を有し、且つ、上記一対のセンタリング部材と上記回転体の中心との結線の延長上で上記一対のセンタリング部材がそれぞれ上記被処理体の大きさに即して移動可能に構成されていることを特徴とするアダプタユニット内蔵型ローダ室。
- 上記載置部と別の部位は、バッファテーブルが配置される部位であり、上記アダプタユニットは、上記バッファテーブルを兼ねていることを特徴とする請求項1に記載のアダプタユニット内蔵型ローダ室。
- 上記アダプタユニットは、ユニット本体と、上記ユニット本体内に上下方向に複数段に渡って設けられ且つ上記被処理体をその外周縁部の少なくとも三箇所で支持する支持部材と、を有し、上記ユニット本体は、上記搬送機構が上記被処理体を搬入、搬出する第1の開口部と、上記自動搬送装置が上記被処理体を搬入、搬出する第2の開口部と、を有することを特徴とする請求項1または請求項2に記載のアダプタユニット内蔵型ローダ室。
- 少なくとも三箇所の上記支持部材は、上記被処理体の中心方向に延びる第1の支持部材と、上記被処理体に対して接線方向に延びる第2の支持部材、を有することを特徴とする請求項3に記載のアダプタユニット内蔵型ローダ室。
- 上記アダプタユニットは、上記支持部材において上記被処理体の存否を検出するセンサを有することを特徴とする請求項3または請求項4に記載のアダプタユニット内蔵型ローダ室。
- 上記被処理体の電気的特性検査を行う検査装置に用いられることを特徴とする請求項1〜請求項5のいずれか1項に記載のアダプタユニット内蔵型ローダ室。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148302A JP5436949B2 (ja) | 2009-06-23 | 2009-06-23 | アダプタユニット内蔵型ローダ室 |
CN2010101053915A CN101930906B (zh) | 2009-06-23 | 2010-01-28 | 转接单元内置型真空互锁室 |
KR1020100054756A KR101664490B1 (ko) | 2009-06-23 | 2010-06-10 | 어댑터 유닛 내장 로더실 |
TW099120172A TWI493644B (zh) | 2009-06-23 | 2010-06-22 | Built-in adjustment unit type loading room |
KR1020160121402A KR101766594B1 (ko) | 2009-06-23 | 2016-09-22 | 어댑터 유닛 내장 로더실 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148302A JP5436949B2 (ja) | 2009-06-23 | 2009-06-23 | アダプタユニット内蔵型ローダ室 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011009255A JP2011009255A (ja) | 2011-01-13 |
JP2011009255A5 JP2011009255A5 (ja) | 2012-06-07 |
JP5436949B2 true JP5436949B2 (ja) | 2014-03-05 |
Family
ID=43369992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009148302A Expired - Fee Related JP5436949B2 (ja) | 2009-06-23 | 2009-06-23 | アダプタユニット内蔵型ローダ室 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5436949B2 (ja) |
KR (2) | KR101664490B1 (ja) |
CN (1) | CN101930906B (ja) |
TW (1) | TWI493644B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5664570B2 (ja) * | 2012-02-09 | 2015-02-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
CN104867854B (zh) * | 2015-04-29 | 2018-01-26 | 上海集成电路研发中心有限公司 | 一种可识别有无硅片的片盒装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09107013A (ja) * | 1995-10-09 | 1997-04-22 | Dainippon Screen Mfg Co Ltd | 基板受け渡し装置 |
KR20060126229A (ko) * | 2005-06-03 | 2006-12-07 | 삼성전자주식회사 | 자동 웨이퍼 센터링을 실시할 수 있는 반도체 소자 제조장치 및 웨이퍼 센터링 방법 |
JP4523513B2 (ja) * | 2005-08-05 | 2010-08-11 | 東京エレクトロン株式会社 | 基板受け渡し装置、基板受け渡し方法及び記憶媒体 |
JP4589853B2 (ja) | 2005-09-22 | 2010-12-01 | 東京エレクトロン株式会社 | 基板搬送システム及び基板搬送方法 |
CN100511629C (zh) * | 2005-10-06 | 2009-07-08 | 东京毅力科创株式会社 | 处理系统及其运作方法 |
TWI452643B (zh) * | 2006-05-11 | 2014-09-11 | Tokyo Electron Ltd | Inspection device and inspection method |
JP4166813B2 (ja) * | 2006-05-11 | 2008-10-15 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
-
2009
- 2009-06-23 JP JP2009148302A patent/JP5436949B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-28 CN CN2010101053915A patent/CN101930906B/zh active Active
- 2010-06-10 KR KR1020100054756A patent/KR101664490B1/ko active IP Right Grant
- 2010-06-22 TW TW099120172A patent/TWI493644B/zh active
-
2016
- 2016-09-22 KR KR1020160121402A patent/KR101766594B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2011009255A (ja) | 2011-01-13 |
TW201118973A (en) | 2011-06-01 |
TWI493644B (zh) | 2015-07-21 |
KR101664490B1 (ko) | 2016-10-10 |
KR20100138758A (ko) | 2010-12-31 |
KR20160114556A (ko) | 2016-10-05 |
CN101930906B (zh) | 2012-09-26 |
KR101766594B1 (ko) | 2017-08-08 |
CN101930906A (zh) | 2010-12-29 |
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