TWI486403B - 矽酮樹脂組合物、矽酮樹脂片、光半導體元件裝置及矽酮樹脂片之製造方法 - Google Patents
矽酮樹脂組合物、矽酮樹脂片、光半導體元件裝置及矽酮樹脂片之製造方法 Download PDFInfo
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- TWI486403B TWI486403B TW101139149A TW101139149A TWI486403B TW I486403 B TWI486403 B TW I486403B TW 101139149 A TW101139149 A TW 101139149A TW 101139149 A TW101139149 A TW 101139149A TW I486403 B TWI486403 B TW I486403B
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- Prior art keywords
- resin composition
- group
- fluorenone resin
- organopolyoxane
- resin sheet
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/16—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
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|---|---|---|---|
| JP2011238215A JP2013095809A (ja) | 2011-10-31 | 2011-10-31 | シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。 |
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| TW201317306A TW201317306A (zh) | 2013-05-01 |
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| EP (1) | EP2586830B1 (enrdf_load_stackoverflow) |
| JP (1) | JP2013095809A (enrdf_load_stackoverflow) |
| KR (1) | KR20130047665A (enrdf_load_stackoverflow) |
| CN (1) | CN103087528A (enrdf_load_stackoverflow) |
| TW (1) | TWI486403B (enrdf_load_stackoverflow) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011219597A (ja) * | 2010-04-08 | 2011-11-04 | Nitto Denko Corp | シリコーン樹脂シート |
| JP2014005324A (ja) * | 2012-06-21 | 2014-01-16 | Nitto Denko Corp | シリコーン樹脂組成物、半硬化体シート、シリコーン硬化体の製造方法、発光ダイオード装置およびその製造方法 |
| CN104471692A (zh) | 2012-07-17 | 2015-03-25 | 日东电工株式会社 | 封装层覆盖半导体元件以及半导体装置的制造方法 |
| US9536799B2 (en) * | 2012-12-21 | 2017-01-03 | Dow Corning Corporation | Hot-melt type curable silicone composition for compression molding or laminating |
| JP2015024571A (ja) * | 2013-07-26 | 2015-02-05 | 日東電工株式会社 | シートの製造方法およびシート製造装置 |
| JP2016169358A (ja) * | 2014-07-24 | 2016-09-23 | セントラル硝子株式会社 | 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置 |
| US9856361B2 (en) * | 2014-10-16 | 2018-01-02 | Sumitomo Osaka Cement Co., Ltd. | Surface-modified metal oxide particle dispersion liquid, method for producing same, surface-modified metal oxide particle-silicone resin composite composition, surface-modified metal oxide particle-silicone resin composite body, optical member and light emitting device |
| FR3029205B1 (fr) * | 2014-11-27 | 2018-05-25 | Institut Vedecom | Encapsulation de composants electroniques dans des materiaux polymeres |
| US20180037013A1 (en) * | 2015-03-05 | 2018-02-08 | Dow Corning Toray Co., Ltd. | Curable organopolysiloxane composition, a use thereof, and a laminate prepared from the composition |
| KR102065987B1 (ko) * | 2016-03-23 | 2020-01-15 | 주식회사 엘지화학 | 반도체 웨이퍼 표면 보호용 점착 필름 및 이의 제조방법 |
| CN107722634B (zh) * | 2017-09-26 | 2020-08-11 | 杭州师范大学 | 一种低密度硅橡胶及其制备方法 |
| CN112341821B (zh) * | 2019-08-06 | 2022-06-14 | 北京科化新材料科技有限公司 | 一种固体硅树脂复合物及其制备方法和应用 |
| WO2021035460A1 (en) * | 2019-08-26 | 2021-03-04 | Henkel Ag & Co. Kgaa | Foamable silicone composition, preparation method and use thereof |
| CN112898780A (zh) * | 2019-12-04 | 2021-06-04 | 明基材料股份有限公司 | 具阻水气特性的硅胶薄膜 |
| KR20230033466A (ko) * | 2021-09-01 | 2023-03-08 | 주식회사 한솔케미칼 | 돔 형상이 가능한 경화성 실리콘 조성물 및 그 경화물 |
| WO2025142577A1 (ja) * | 2023-12-27 | 2025-07-03 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理システム |
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| US4603168A (en) * | 1984-02-21 | 1986-07-29 | Toray Silicone Co., Ltd. | Method for curing organopolysiloxane compositions and the compositions |
| TW200308030A (en) * | 2002-05-16 | 2003-12-16 | Dow Corning | Semiconductor package and method of preparing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4558109A (en) * | 1984-07-25 | 1985-12-10 | Sws Silicones Corporation | Curable organopolysiloxane compositions |
| JPS6183251A (ja) * | 1984-10-01 | 1986-04-26 | Shin Etsu Chem Co Ltd | 硬化性オルガノポリシロキサン組成物 |
| US4754013A (en) * | 1986-12-29 | 1988-06-28 | Dow Corning Corporation | Self-adhering polyorganosiloxane compositions |
| US5270425A (en) * | 1992-11-23 | 1993-12-14 | Dow Corning Corporation | One-part curable organosiloxane compositions |
| JP3523098B2 (ja) | 1998-12-28 | 2004-04-26 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物 |
| JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| US7595113B2 (en) | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
| FR2848215B1 (fr) * | 2002-12-04 | 2006-08-04 | Rhodia Chimie Sa | Composition elastomere silicone, adhesive, monocomposante et reticulable par polyaddition |
| JP4733933B2 (ja) * | 2004-06-18 | 2011-07-27 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物 |
| US20080276983A1 (en) * | 2005-11-04 | 2008-11-13 | Robert Andrew Drake | Encapsulation of Photovoltaic Cells |
| JP5072263B2 (ja) | 2006-05-16 | 2012-11-14 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP5138924B2 (ja) | 2006-12-14 | 2013-02-06 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 光半導体封止用シリコーンゴム組成物および光半導体装置 |
| JP2009084511A (ja) | 2007-10-02 | 2009-04-23 | Sekisui Chem Co Ltd | 光半導体用封止シート及び光半導体素子 |
| JP5566036B2 (ja) * | 2009-02-02 | 2014-08-06 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
| JP5566088B2 (ja) * | 2008-12-12 | 2014-08-06 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
| EP2196503B1 (en) | 2008-12-12 | 2015-02-18 | Nitto Denko Corporation | Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof |
| US8470952B2 (en) * | 2009-12-24 | 2013-06-25 | Nitto Denko Corporation | Composition for thermosetting silicone resin |
| JP2011178888A (ja) * | 2010-03-01 | 2011-09-15 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
| JP2012082320A (ja) * | 2010-10-12 | 2012-04-26 | Nitto Denko Corp | 半硬化状シリコーン樹脂シート |
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2011
- 2011-10-31 JP JP2011238215A patent/JP2013095809A/ja active Pending
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2012
- 2012-10-11 US US13/649,716 patent/US8779043B2/en not_active Expired - Fee Related
- 2012-10-18 EP EP12189001.6A patent/EP2586830B1/en not_active Not-in-force
- 2012-10-23 TW TW101139149A patent/TWI486403B/zh not_active IP Right Cessation
- 2012-10-30 KR KR1020120121133A patent/KR20130047665A/ko not_active Withdrawn
- 2012-10-31 CN CN2012104294471A patent/CN103087528A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4603168A (en) * | 1984-02-21 | 1986-07-29 | Toray Silicone Co., Ltd. | Method for curing organopolysiloxane compositions and the compositions |
| TW200308030A (en) * | 2002-05-16 | 2003-12-16 | Dow Corning | Semiconductor package and method of preparing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013095809A (ja) | 2013-05-20 |
| CN103087528A (zh) | 2013-05-08 |
| KR20130047665A (ko) | 2013-05-08 |
| US20130105997A1 (en) | 2013-05-02 |
| EP2586830B1 (en) | 2014-05-14 |
| US8779043B2 (en) | 2014-07-15 |
| TW201317306A (zh) | 2013-05-01 |
| EP2586830A1 (en) | 2013-05-01 |
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