TWI482269B - 非揮發性半導體記憶裝置 - Google Patents
非揮發性半導體記憶裝置 Download PDFInfo
- Publication number
- TWI482269B TWI482269B TW098114870A TW98114870A TWI482269B TW I482269 B TWI482269 B TW I482269B TW 098114870 A TW098114870 A TW 098114870A TW 98114870 A TW98114870 A TW 98114870A TW I482269 B TWI482269 B TW I482269B
- Authority
- TW
- Taiwan
- Prior art keywords
- island
- insulating film
- film
- semiconductor region
- shaped semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 232
- 239000012535 impurity Substances 0.000 claims description 119
- 239000000758 substrate Substances 0.000 claims description 47
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 30
- 229910052732 germanium Inorganic materials 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 10
- 239000010453 quartz Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 description 33
- 238000010168 coupling process Methods 0.000 description 33
- 238000005859 coupling reaction Methods 0.000 description 33
- 230000001965 increasing effect Effects 0.000 description 32
- 230000015572 biosynthetic process Effects 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000004544 sputter deposition Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052735 hafnium Inorganic materials 0.000 description 10
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 229910052727 yttrium Inorganic materials 0.000 description 8
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910000449 hafnium oxide Inorganic materials 0.000 description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229910052707 ruthenium Inorganic materials 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 5
- 230000005641 tunneling Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005499 laser crystallization Methods 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001272 nitrous oxide Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- KODMFZHGYSZSHL-UHFFFAOYSA-N aluminum bismuth Chemical class [Al].[Bi] KODMFZHGYSZSHL-UHFFFAOYSA-N 0.000 description 1
- CFTFRNVHBXMNKE-UHFFFAOYSA-N aluminum iridium Chemical compound [Al].[Ir] CFTFRNVHBXMNKE-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- UIZLQMLDSWKZGC-UHFFFAOYSA-N cadmium helium Chemical compound [He].[Cd] UIZLQMLDSWKZGC-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- MQAKKMPOYHNCKJ-UHFFFAOYSA-N cerium;methane Chemical compound C.[Ce] MQAKKMPOYHNCKJ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910003454 ytterbium oxide Inorganic materials 0.000 description 1
- 229940075624 ytterbium oxide Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008123583 | 2008-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200952160A TW200952160A (en) | 2009-12-16 |
| TWI482269B true TWI482269B (zh) | 2015-04-21 |
Family
ID=41264670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098114870A TWI482269B (zh) | 2008-05-09 | 2009-05-05 | 非揮發性半導體記憶裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8193574B2 (https=) |
| JP (1) | JP5479773B2 (https=) |
| KR (1) | KR101508492B1 (https=) |
| CN (1) | CN102017129B (https=) |
| TW (1) | TWI482269B (https=) |
| WO (1) | WO2009136615A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8198666B2 (en) * | 2009-02-20 | 2012-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including a nonvolatile memory element having first, second and third insulating films |
| WO2011118076A1 (ja) * | 2010-03-23 | 2011-09-29 | シャープ株式会社 | 半導体装置、アクティブマトリクス基板、及び表示装置 |
| CN102709290B (zh) * | 2012-05-22 | 2016-08-03 | 上海华虹宏力半导体制造有限公司 | 存储器及其形成方法 |
| US9117525B2 (en) | 2012-09-12 | 2015-08-25 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
| KR20140081412A (ko) * | 2012-12-21 | 2014-07-01 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| CN103199116B (zh) | 2013-03-29 | 2016-04-27 | 京东方科技集团股份有限公司 | 悬浮栅晶体管及其制作方法、应用方法、显示器驱动电路 |
| JP2016039226A (ja) * | 2014-08-07 | 2016-03-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10096718B2 (en) | 2016-06-17 | 2018-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, electronic device, manufacturing method of transistor |
| JP2019220530A (ja) * | 2018-06-18 | 2019-12-26 | 株式会社ジャパンディスプレイ | 半導体装置 |
| TWI897022B (zh) * | 2023-09-01 | 2025-09-11 | 新唐科技股份有限公司 | 半導體結構及其形成方法 |
| CN119947103A (zh) | 2023-11-02 | 2025-05-06 | 株式会社半导体能源研究所 | 半导体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4453234A (en) * | 1980-09-26 | 1984-06-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Nonvolatile semiconductor memory device |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01128472A (ja) * | 1987-11-13 | 1989-05-22 | Toshiba Corp | 半導体不揮発性記憶装置 |
| JPH088315B2 (ja) * | 1989-03-08 | 1996-01-29 | 富士通株式会社 | 半導体装置の製造方法及び半導体装置 |
| JP2563683B2 (ja) * | 1990-03-08 | 1996-12-11 | 松下電子工業株式会社 | 不揮発性半導体記憶装置およびその製造方法 |
| JP3507761B2 (ja) * | 1990-07-12 | 2004-03-15 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| JPH06334195A (ja) * | 1993-05-18 | 1994-12-02 | Nippon Steel Corp | 不揮発性半導体記憶装置 |
| JPH07130893A (ja) * | 1993-11-05 | 1995-05-19 | Sony Corp | 半導体装置及びその製造方法 |
| TW326553B (en) | 1996-01-22 | 1998-02-11 | Handotai Energy Kenkyusho Kk | Semiconductor device and method of fabricating same |
| US5886376A (en) * | 1996-07-01 | 1999-03-23 | International Business Machines Corporation | EEPROM having coplanar on-insulator FET and control gate |
| JP3183326B2 (ja) * | 1996-07-17 | 2001-07-09 | 日本電気株式会社 | 読出専用半導体記憶装置 |
| US7602007B2 (en) | 1997-04-28 | 2009-10-13 | Yoshihiro Kumazaki | Semiconductor device having controllable transistor threshold voltage |
| JPH1187664A (ja) | 1997-04-28 | 1999-03-30 | Nippon Steel Corp | 半導体装置及びその製造方法 |
| JP2006013534A (ja) | 1997-07-08 | 2006-01-12 | Sony Corp | 半導体不揮発性記憶装置の製造方法 |
| US6005270A (en) | 1997-11-10 | 1999-12-21 | Sony Corporation | Semiconductor nonvolatile memory device and method of production of same |
| TW518637B (en) | 1999-04-15 | 2003-01-21 | Semiconductor Energy Lab | Electro-optical device and electronic equipment |
| JP2001135736A (ja) * | 1999-11-08 | 2001-05-18 | Nec Corp | 不揮発性半導体記憶装置及びその製造方法 |
| JP4663094B2 (ja) | 2000-10-13 | 2011-03-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP4776801B2 (ja) | 2001-04-24 | 2011-09-21 | 株式会社半導体エネルギー研究所 | メモリ回路 |
| TW559814B (en) | 2001-05-31 | 2003-11-01 | Semiconductor Energy Lab | Nonvolatile memory and method of driving the same |
| JP4859292B2 (ja) * | 2001-07-02 | 2012-01-25 | 富士通セミコンダクター株式会社 | 半導体集積回路装置およびｎａｎｄ型不揮発性半導体装置 |
| JP4281331B2 (ja) * | 2002-01-21 | 2009-06-17 | 株式会社デンソー | 不揮発性半導体記憶装置 |
| JP2004165182A (ja) * | 2002-11-08 | 2004-06-10 | Ricoh Co Ltd | 半導体装置 |
| JP2006339554A (ja) * | 2005-06-06 | 2006-12-14 | Sanyo Electric Co Ltd | 不揮発性半導体記憶装置及びその動作方法 |
| EP1837917A1 (en) | 2006-03-21 | 2007-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device |
| EP1837900A3 (en) | 2006-03-21 | 2008-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device |
| JP5164404B2 (ja) | 2006-03-21 | 2013-03-21 | 株式会社半導体エネルギー研究所 | 不揮発性半導体記憶装置 |
| US8629490B2 (en) * | 2006-03-31 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor storage device with floating gate electrode and control gate electrode |
| JP5483660B2 (ja) * | 2006-06-01 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7596024B2 (en) * | 2006-07-14 | 2009-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory |
| US8188535B2 (en) | 2008-05-16 | 2012-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device and manufacturing method thereof |
-
2009
- 2009-04-24 CN CN200980117627.2A patent/CN102017129B/zh not_active Expired - Fee Related
- 2009-04-24 KR KR1020107027516A patent/KR101508492B1/ko not_active Expired - Fee Related
- 2009-04-24 WO PCT/JP2009/058594 patent/WO2009136615A1/en not_active Ceased
- 2009-04-30 JP JP2009110344A patent/JP5479773B2/ja not_active Expired - Fee Related
- 2009-05-01 US US12/434,390 patent/US8193574B2/en not_active Expired - Fee Related
- 2009-05-05 TW TW098114870A patent/TWI482269B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4453234A (en) * | 1980-09-26 | 1984-06-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Nonvolatile semiconductor memory device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090278188A1 (en) | 2009-11-12 |
| KR20110010762A (ko) | 2011-02-07 |
| JP5479773B2 (ja) | 2014-04-23 |
| CN102017129B (zh) | 2013-10-23 |
| CN102017129A (zh) | 2011-04-13 |
| KR101508492B1 (ko) | 2015-05-18 |
| JP2009295971A (ja) | 2009-12-17 |
| WO2009136615A1 (en) | 2009-11-12 |
| US8193574B2 (en) | 2012-06-05 |
| TW200952160A (en) | 2009-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI482269B (zh) | 非揮發性半導體記憶裝置 | |
| CN101047190B (zh) | 非易失性半导体存储器件及其制造方法 | |
| US7955995B2 (en) | Nonvolatile semiconductor memory device and manufacturing method thereof, semiconductor device and manufacturing method thereof, and manufacturing method of insulating film | |
| KR101345418B1 (ko) | 불휘발성 반도체 기억장치 | |
| KR101324757B1 (ko) | 불휘발성 반도체 기억장치 | |
| KR101488517B1 (ko) | 반도체장치 | |
| TWI429028B (zh) | 非揮發性半導體記憶體裝置及其製造方法 | |
| US7760552B2 (en) | Verification method for nonvolatile semiconductor memory device | |
| US8227863B2 (en) | Nonvolatile semiconductor memory device | |
| TW200814240A (en) | Nonvolatile semiconductor memory device | |
| US8872251B2 (en) | Nonvolatile semiconductor memory device and manufacturing method thereof | |
| JP5238178B2 (ja) | 半導体装置 | |
| JP5132171B2 (ja) | 不揮発性半導体記憶装置及びその作製方法並びに半導体装置及びその作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |