TWI480420B - 電鍍液分析及控制方法與設備 - Google Patents

電鍍液分析及控制方法與設備 Download PDF

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Publication number
TWI480420B
TWI480420B TW097148577A TW97148577A TWI480420B TW I480420 B TWI480420 B TW I480420B TW 097148577 A TW097148577 A TW 097148577A TW 97148577 A TW97148577 A TW 97148577A TW I480420 B TWI480420 B TW I480420B
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TW
Taiwan
Prior art keywords
solution
plating solution
volume
agent
added
Prior art date
Application number
TW097148577A
Other languages
English (en)
Chinese (zh)
Other versions
TW200949009A (en
Inventor
Nanhai Li
Artur Kolics
Aman Jain
Ron Rulkins
Darin Birtwhistle
Chee Chan
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200949009A publication Critical patent/TW200949009A/zh
Application granted granted Critical
Publication of TWI480420B publication Critical patent/TWI480420B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
    • G05D11/138—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture by sensing the concentration of the mixture, e.g. measuring pH value
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8411—Application to online plant, process monitoring
    • G01N2021/8416—Application to online plant, process monitoring and process controlling, not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/65—Raman scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW097148577A 2007-12-12 2008-12-12 電鍍液分析及控制方法與設備 TWI480420B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1299807P 2007-12-12 2007-12-12

Publications (2)

Publication Number Publication Date
TW200949009A TW200949009A (en) 2009-12-01
TWI480420B true TWI480420B (zh) 2015-04-11

Family

ID=40754323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148577A TWI480420B (zh) 2007-12-12 2008-12-12 電鍍液分析及控制方法與設備

Country Status (7)

Country Link
US (1) US9128493B2 (enExample)
EP (1) EP2240626B1 (enExample)
JP (1) JP6104497B2 (enExample)
KR (1) KR101600413B1 (enExample)
CN (1) CN101896640B (enExample)
TW (1) TWI480420B (enExample)
WO (1) WO2009075885A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700398B (zh) * 2018-04-19 2020-08-01 台灣積體電路製造股份有限公司 電解液中化學濃度的控制方法及半導體設備

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057957A2 (en) 2004-11-23 2006-06-01 Entegris, Inc. System and method for a variable home position dispense system
US8083498B2 (en) * 2005-12-02 2011-12-27 Entegris, Inc. System and method for position control of a mechanical piston in a pump
WO2007067360A2 (en) * 2005-12-05 2007-06-14 Entegris, Inc. Error volume system and method for a pump
US7494265B2 (en) * 2006-03-01 2009-02-24 Entegris, Inc. System and method for controlled mixing of fluids via temperature
KR101600413B1 (ko) 2007-12-12 2016-03-21 램 리써치 코포레이션 도금 용액 분석 및 제어를 위한 방법 및 장치
US8805134B1 (en) 2012-02-17 2014-08-12 Soraa Laser Diode, Inc. Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices
US8427590B2 (en) * 2009-05-29 2013-04-23 Soraa, Inc. Laser based display method and system
US10108079B2 (en) * 2009-05-29 2018-10-23 Soraa Laser Diode, Inc. Laser light source for a vehicle
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
US9829780B2 (en) * 2009-05-29 2017-11-28 Soraa Laser Diode, Inc. Laser light source for a vehicle
JP2012533683A (ja) * 2009-07-16 2012-12-27 ラム リサーチ コーポレーション 無電解析出溶液およびプロセス制御
TWI504782B (zh) * 2009-07-28 2015-10-21 Lam Res Corp 無電沉積溶液及製程控制
US10394754B2 (en) 2010-03-08 2019-08-27 International Business Machines Corporation Indexing multiple types of data to facilitate rapid re-indexing of one or more types of data
JP5937876B2 (ja) * 2012-04-18 2016-06-22 名古屋メッキ工業株式会社 めっき繊維製造装置及び方法
US10145783B2 (en) * 2013-07-22 2018-12-04 Dean O. Allgeyer, Md, Inc. Infusion set and adapter for spectroscopic analysis of pharmaceuticals
US10145784B2 (en) * 2013-07-22 2018-12-04 Dean O. Allgeyer, Md, Inc. Infusion set and spectroscopic analyzer for analysis of pharmaceuticals
KR101901781B1 (ko) * 2014-05-12 2018-10-01 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US11437774B2 (en) 2015-08-19 2022-09-06 Kyocera Sld Laser, Inc. High-luminous flux laser-based white light source
CN106929832A (zh) * 2015-12-30 2017-07-07 凯基有限公司 聚乙酰胺或聚对苯二甲酸乙二酯基材的湿式金属化处理监测控制系统
US10590561B2 (en) 2016-10-26 2020-03-17 International Business Machines Corporation Continuous modification of organics in chemical baths
KR101905799B1 (ko) * 2016-11-03 2018-10-08 주식회사에이치티엔씨 용액 관리 시스템
CN106908295A (zh) * 2017-03-27 2017-06-30 浙江吉利汽车研究院有限公司 一种涂装工艺的氧化锆前处理检测方法
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US12152742B2 (en) 2019-01-18 2024-11-26 Kyocera Sld Laser, Inc. Laser-based light guide-coupled wide-spectrum light system
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
CN109944458B (zh) * 2019-03-22 2021-02-23 中国矿业大学 一种基于电渗技术的混凝土防锈、加固装置及方法
CN110218992A (zh) * 2019-05-08 2019-09-10 金驰 一种基于远程操控的钢材化学镀层系统及其工作方法
US20220389606A1 (en) * 2019-09-30 2022-12-08 Korea Institute Of Materials Science Cell for measuring concentration of additive breakdown production in plating solution
KR102112573B1 (ko) * 2019-10-23 2020-05-19 한국지질자원연구원 다단 용매 추출 모니터링 시스템
KR20230160110A (ko) 2022-05-16 2023-11-23 삼성전자주식회사 배치 타입 여과 장치
KR102933693B1 (ko) * 2022-07-13 2026-03-04 국립순천대학교산학협력단 금속 박 연속도금장치, 금속 박 연속도금방법 및 연속도금 장치의 전해액 관리방법
CN115821348A (zh) * 2022-11-04 2023-03-21 宋伍荣 一种浸泡式金属拉链自动镀金装置
CN117783043A (zh) * 2023-12-01 2024-03-29 河钢工业技术服务有限公司 一种基于近红外技术的电镀液成分在线检测系统和检测方法
CN117721513B (zh) * 2024-02-18 2024-04-16 深圳市海里表面技术处理有限公司 基于光谱分析的自适应镀银方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US20040218173A1 (en) * 2001-07-18 2004-11-04 Fisher Matthew L Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy
CN1793854A (zh) * 2005-12-28 2006-06-28 浙江大学 用光谱技术测定污水化学需氧量的方法和系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
JPS5830538B2 (ja) * 1977-03-07 1983-06-29 横河・ヒユ−レツト・パツカ−ド株式会社 温度補償されたLOSトランジスタ形pH計
JP3099531B2 (ja) 1992-07-21 2000-10-16 日本ケミコン株式会社 無電解銅めっき浴自動管理システム
US5502388A (en) * 1993-02-04 1996-03-26 Hoechst Aktiengesellschaft Method of measuring the pH value of a test solution with glass-electrode measuring cells and of simultaneously calibrating the measuring cells
JPH07110296A (ja) * 1993-10-08 1995-04-25 Dkk Corp 濃度計
US20040046121A1 (en) * 2001-07-15 2004-03-11 Golden Josh H. Method and system for analyte determination in metal plating baths
US20030049858A1 (en) * 2001-07-15 2003-03-13 Golden Josh H. Method and system for analyte determination in metal plating baths
KR100414550B1 (ko) 2001-09-20 2004-01-13 주식회사 아큐텍반도체기술 다성분 용액의 농도 분석 시스템 및 방법
JP2003247077A (ja) 2002-02-20 2003-09-05 Sony Corp 無電解めっき方法及び無電解めっき装置
JP3955771B2 (ja) 2002-03-06 2007-08-08 株式会社荏原製作所 化学処理液の濃度管理方法並びにこれを利用する濃度管理システムおよびめっき装置
JP4109145B2 (ja) * 2002-03-22 2008-07-02 三洋化成工業株式会社 高分子凝集剤及びその製造方法
KR100909184B1 (ko) * 2004-03-11 2009-07-23 주식회사 동진쎄미켐 근적외선 분광기를 이용한 리쏘그래피 공정용 조성물의실시간 제어 시스템 및 제어 방법
KR101600413B1 (ko) 2007-12-12 2016-03-21 램 리써치 코포레이션 도금 용액 분석 및 제어를 위한 방법 및 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US20040218173A1 (en) * 2001-07-18 2004-11-04 Fisher Matthew L Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy
CN1793854A (zh) * 2005-12-28 2006-06-28 浙江大学 用光谱技术测定污水化学需氧量的方法和系统

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700398B (zh) * 2018-04-19 2020-08-01 台灣積體電路製造股份有限公司 電解液中化學濃度的控制方法及半導體設備
US11280021B2 (en) 2018-04-19 2022-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method of controlling chemical concentration in electrolyte and semiconductor apparatus
US11668019B2 (en) 2018-04-19 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method of controlling chemical concentration in electrolyte
US12157952B2 (en) 2018-04-19 2024-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Method of controlling chemical concentration in electrolyte

Also Published As

Publication number Publication date
US20090157229A1 (en) 2009-06-18
JP6104497B2 (ja) 2017-03-29
JP2011506769A (ja) 2011-03-03
KR20100096239A (ko) 2010-09-01
CN101896640A (zh) 2010-11-24
CN101896640B (zh) 2012-02-01
EP2240626B1 (en) 2015-04-15
WO2009075885A2 (en) 2009-06-18
WO2009075885A3 (en) 2009-09-11
US9128493B2 (en) 2015-09-08
TW200949009A (en) 2009-12-01
EP2240626A2 (en) 2010-10-20
KR101600413B1 (ko) 2016-03-21
EP2240626A4 (en) 2014-04-16

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