CN101896640B - 用于电镀液分析和控制的方法和设备 - Google Patents
用于电镀液分析和控制的方法和设备 Download PDFInfo
- Publication number
- CN101896640B CN101896640B CN200880121272.XA CN200880121272A CN101896640B CN 101896640 B CN101896640 B CN 101896640B CN 200880121272 A CN200880121272 A CN 200880121272A CN 101896640 B CN101896640 B CN 101896640B
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- China
- Prior art keywords
- solution
- dosage
- volume
- electroplate liquid
- reductive agent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
- G05D11/138—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture by sensing the concentration of the mixture, e.g. measuring pH value
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
- G01N2021/8416—Application to online plant, process monitoring and process controlling, not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemically Coating (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1299807P | 2007-12-12 | 2007-12-12 | |
| US61/012,998 | 2007-12-12 | ||
| PCT/US2008/013660 WO2009075885A2 (en) | 2007-12-12 | 2008-12-12 | Method and apparatus for plating solution analysis and control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101896640A CN101896640A (zh) | 2010-11-24 |
| CN101896640B true CN101896640B (zh) | 2012-02-01 |
Family
ID=40754323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880121272.XA Active CN101896640B (zh) | 2007-12-12 | 2008-12-12 | 用于电镀液分析和控制的方法和设备 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9128493B2 (enExample) |
| EP (1) | EP2240626B1 (enExample) |
| JP (1) | JP6104497B2 (enExample) |
| KR (1) | KR101600413B1 (enExample) |
| CN (1) | CN101896640B (enExample) |
| TW (1) | TWI480420B (enExample) |
| WO (1) | WO2009075885A2 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155992B (zh) | 2004-11-23 | 2013-02-20 | 恩特格里公司 | 用于可变原位置分配系统的系统和方法 |
| US8083498B2 (en) * | 2005-12-02 | 2011-12-27 | Entegris, Inc. | System and method for position control of a mechanical piston in a pump |
| US7897196B2 (en) * | 2005-12-05 | 2011-03-01 | Entegris, Inc. | Error volume system and method for a pump |
| US7494265B2 (en) * | 2006-03-01 | 2009-02-24 | Entegris, Inc. | System and method for controlled mixing of fluids via temperature |
| KR101600413B1 (ko) | 2007-12-12 | 2016-03-21 | 램 리써치 코포레이션 | 도금 용액 분석 및 제어를 위한 방법 및 장치 |
| US8805134B1 (en) | 2012-02-17 | 2014-08-12 | Soraa Laser Diode, Inc. | Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices |
| US9250044B1 (en) | 2009-05-29 | 2016-02-02 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser diode dazzling devices and methods of use |
| US9829780B2 (en) * | 2009-05-29 | 2017-11-28 | Soraa Laser Diode, Inc. | Laser light source for a vehicle |
| US10108079B2 (en) * | 2009-05-29 | 2018-10-23 | Soraa Laser Diode, Inc. | Laser light source for a vehicle |
| US8427590B2 (en) * | 2009-05-29 | 2013-04-23 | Soraa, Inc. | Laser based display method and system |
| WO2011008212A1 (en) * | 2009-07-16 | 2011-01-20 | Lam Research Corporation | Electroless deposition solutions and process control |
| TWI504782B (zh) * | 2009-07-28 | 2015-10-21 | Lam Res Corp | 無電沉積溶液及製程控制 |
| US10394754B2 (en) | 2010-03-08 | 2019-08-27 | International Business Machines Corporation | Indexing multiple types of data to facilitate rapid re-indexing of one or more types of data |
| JP5937876B2 (ja) * | 2012-04-18 | 2016-06-22 | 名古屋メッキ工業株式会社 | めっき繊維製造装置及び方法 |
| US10145784B2 (en) * | 2013-07-22 | 2018-12-04 | Dean O. Allgeyer, Md, Inc. | Infusion set and spectroscopic analyzer for analysis of pharmaceuticals |
| US10145783B2 (en) * | 2013-07-22 | 2018-12-04 | Dean O. Allgeyer, Md, Inc. | Infusion set and adapter for spectroscopic analysis of pharmaceuticals |
| KR101901781B1 (ko) * | 2014-05-12 | 2018-10-01 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US11437774B2 (en) | 2015-08-19 | 2022-09-06 | Kyocera Sld Laser, Inc. | High-luminous flux laser-based white light source |
| CN106929832A (zh) * | 2015-12-30 | 2017-07-07 | 凯基有限公司 | 聚乙酰胺或聚对苯二甲酸乙二酯基材的湿式金属化处理监测控制系统 |
| US10590561B2 (en) | 2016-10-26 | 2020-03-17 | International Business Machines Corporation | Continuous modification of organics in chemical baths |
| KR101905799B1 (ko) * | 2016-11-03 | 2018-10-08 | 주식회사에이치티엔씨 | 용액 관리 시스템 |
| CN106908295A (zh) * | 2017-03-27 | 2017-06-30 | 浙江吉利汽车研究院有限公司 | 一种涂装工艺的氧化锆前处理检测方法 |
| US11280021B2 (en) | 2018-04-19 | 2022-03-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of controlling chemical concentration in electrolyte and semiconductor apparatus |
| US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
| US11239637B2 (en) | 2018-12-21 | 2022-02-01 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
| US12000552B2 (en) | 2019-01-18 | 2024-06-04 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system for a vehicle |
| US12152742B2 (en) | 2019-01-18 | 2024-11-26 | Kyocera Sld Laser, Inc. | Laser-based light guide-coupled wide-spectrum light system |
| US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
| CN109944458B (zh) * | 2019-03-22 | 2021-02-23 | 中国矿业大学 | 一种基于电渗技术的混凝土防锈、加固装置及方法 |
| CN110218992A (zh) * | 2019-05-08 | 2019-09-10 | 金驰 | 一种基于远程操控的钢材化学镀层系统及其工作方法 |
| WO2021066415A1 (en) * | 2019-09-30 | 2021-04-08 | Korea Institute Of Materials Science | Cell for measuring concentration of additive breakdown production in plating solution |
| KR102112573B1 (ko) * | 2019-10-23 | 2020-05-19 | 한국지질자원연구원 | 다단 용매 추출 모니터링 시스템 |
| KR20240009345A (ko) * | 2022-07-13 | 2024-01-22 | 순천대학교 산학협력단 | 금속 박 연속도금장치, 금속 박 연속도금방법 및 연속도금 장치의 전해액 관리방법 |
| CN115821348A (zh) * | 2022-11-04 | 2023-03-21 | 宋伍荣 | 一种浸泡式金属拉链自动镀金装置 |
| CN117721513B (zh) * | 2024-02-18 | 2024-04-16 | 深圳市海里表面技术处理有限公司 | 基于光谱分析的自适应镀银方法及系统 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
| CN1793854A (zh) * | 2005-12-28 | 2006-06-28 | 浙江大学 | 用光谱技术测定污水化学需氧量的方法和系统 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4096301A (en) | 1976-02-19 | 1978-06-20 | Macdermid Incorporated | Apparatus and method for automatically maintaining an electroless copper plating bath |
| JPS5830538B2 (ja) * | 1977-03-07 | 1983-06-29 | 横河・ヒユ−レツト・パツカ−ド株式会社 | 温度補償されたLOSトランジスタ形pH計 |
| JP3099531B2 (ja) * | 1992-07-21 | 2000-10-16 | 日本ケミコン株式会社 | 無電解銅めっき浴自動管理システム |
| US5502388A (en) * | 1993-02-04 | 1996-03-26 | Hoechst Aktiengesellschaft | Method of measuring the pH value of a test solution with glass-electrode measuring cells and of simultaneously calibrating the measuring cells |
| JPH07110296A (ja) * | 1993-10-08 | 1995-04-25 | Dkk Corp | 濃度計 |
| US20040046121A1 (en) * | 2001-07-15 | 2004-03-11 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
| US20030049858A1 (en) * | 2001-07-15 | 2003-03-13 | Golden Josh H. | Method and system for analyte determination in metal plating baths |
| US6762832B2 (en) * | 2001-07-18 | 2004-07-13 | Air Liquide America, L.P. | Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy |
| KR100414550B1 (ko) * | 2001-09-20 | 2004-01-13 | 주식회사 아큐텍반도체기술 | 다성분 용액의 농도 분석 시스템 및 방법 |
| JP2003247077A (ja) * | 2002-02-20 | 2003-09-05 | Sony Corp | 無電解めっき方法及び無電解めっき装置 |
| JP3955771B2 (ja) * | 2002-03-06 | 2007-08-08 | 株式会社荏原製作所 | 化学処理液の濃度管理方法並びにこれを利用する濃度管理システムおよびめっき装置 |
| JP4109145B2 (ja) * | 2002-03-22 | 2008-07-02 | 三洋化成工業株式会社 | 高分子凝集剤及びその製造方法 |
| KR100909184B1 (ko) | 2004-03-11 | 2009-07-23 | 주식회사 동진쎄미켐 | 근적외선 분광기를 이용한 리쏘그래피 공정용 조성물의실시간 제어 시스템 및 제어 방법 |
| KR101600413B1 (ko) | 2007-12-12 | 2016-03-21 | 램 리써치 코포레이션 | 도금 용액 분석 및 제어를 위한 방법 및 장치 |
-
2008
- 2008-12-12 KR KR1020107015301A patent/KR101600413B1/ko active Active
- 2008-12-12 US US12/333,893 patent/US9128493B2/en active Active
- 2008-12-12 WO PCT/US2008/013660 patent/WO2009075885A2/en not_active Ceased
- 2008-12-12 TW TW097148577A patent/TWI480420B/zh not_active IP Right Cessation
- 2008-12-12 EP EP08859699.4A patent/EP2240626B1/en not_active Not-in-force
- 2008-12-12 CN CN200880121272.XA patent/CN101896640B/zh active Active
- 2008-12-12 JP JP2010537972A patent/JP6104497B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
| CN1793854A (zh) * | 2005-12-28 | 2006-06-28 | 浙江大学 | 用光谱技术测定污水化学需氧量的方法和系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090157229A1 (en) | 2009-06-18 |
| EP2240626B1 (en) | 2015-04-15 |
| JP6104497B2 (ja) | 2017-03-29 |
| CN101896640A (zh) | 2010-11-24 |
| TW200949009A (en) | 2009-12-01 |
| EP2240626A2 (en) | 2010-10-20 |
| WO2009075885A3 (en) | 2009-09-11 |
| TWI480420B (zh) | 2015-04-11 |
| WO2009075885A2 (en) | 2009-06-18 |
| KR101600413B1 (ko) | 2016-03-21 |
| JP2011506769A (ja) | 2011-03-03 |
| KR20100096239A (ko) | 2010-09-01 |
| US9128493B2 (en) | 2015-09-08 |
| EP2240626A4 (en) | 2014-04-16 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |