TWI479590B - 用於絲網印刷之短熱力曲線爐 - Google Patents

用於絲網印刷之短熱力曲線爐 Download PDF

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Publication number
TWI479590B
TWI479590B TW098118947A TW98118947A TWI479590B TW I479590 B TWI479590 B TW I479590B TW 098118947 A TW098118947 A TW 098118947A TW 98118947 A TW98118947 A TW 98118947A TW I479590 B TWI479590 B TW I479590B
Authority
TW
Taiwan
Prior art keywords
substrate
gas
heat exchange
processing
chamber
Prior art date
Application number
TW098118947A
Other languages
English (en)
Chinese (zh)
Other versions
TW201009990A (en
Inventor
巴契尼安德烈
Original Assignee
應用材料意大利有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080135 external-priority patent/ITUD20080135A1/it
Priority claimed from ITUD20080154 external-priority patent/ITUD20080154A1/it
Application filed by 應用材料意大利有限公司 filed Critical 應用材料意大利有限公司
Publication of TW201009990A publication Critical patent/TW201009990A/zh
Application granted granted Critical
Publication of TWI479590B publication Critical patent/TWI479590B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Drying Of Solid Materials (AREA)
  • Screen Printers (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
TW098118947A 2008-06-11 2009-06-06 用於絲網印刷之短熱力曲線爐 TWI479590B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
ITUD20080135 ITUD20080135A1 (it) 2008-06-11 2008-06-11 Forno a basso profilo termico per stampa serigrafica
ITUD20080154 ITUD20080154A1 (it) 2008-06-27 2008-06-27 Forno a basso profilo termico per stampa serigrafica
US12/240,955 US20090308860A1 (en) 2008-06-11 2008-09-29 Short thermal profile oven useful for screen printing
US12/273,442 US20090311439A1 (en) 2008-06-11 2008-11-18 Short Thermal Profile Oven Useful For Screen Printing

Publications (2)

Publication Number Publication Date
TW201009990A TW201009990A (en) 2010-03-01
TWI479590B true TWI479590B (zh) 2015-04-01

Family

ID=41151966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118947A TWI479590B (zh) 2008-06-11 2009-06-06 用於絲網印刷之短熱力曲線爐

Country Status (7)

Country Link
US (2) US20090308860A1 (https=)
EP (1) EP2301064B1 (https=)
JP (1) JP2011526734A (https=)
KR (1) KR20110030564A (https=)
CN (2) CN103227127A (https=)
TW (1) TWI479590B (https=)
WO (1) WO2009150070A1 (https=)

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US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
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KR102326995B1 (ko) * 2012-11-30 2021-11-16 카티바, 인크. 산업용 프린팅 시스템의 유지 방법
CN105900258A (zh) 2013-12-26 2016-08-24 科迪华公司 电子装置的热加工
KR102050152B1 (ko) 2014-01-21 2020-01-08 카티바, 인크. 전자 장치 인캡슐레이션을 위한 기기 및 기술
KR102390045B1 (ko) 2014-04-30 2022-04-22 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
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CN104527218B (zh) * 2014-12-24 2016-01-13 庄统壹 一种网版印刷机及利用该网版印刷机印刷的工艺方法
CN108604619A (zh) * 2016-02-22 2018-09-28 应用材料意大利有限公司 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法
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CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法
CN110534611A (zh) * 2018-05-25 2019-12-03 米亚索乐装备集成（福建）有限公司 一种用于片状电池的加热设备
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
KR102088778B1 (ko) * 2018-08-07 2020-03-13 김영택 수용성 잉크를 이용한 인쇄기의 열 건조장치
PT3725525T (pt) * 2019-04-18 2024-05-03 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
ES2988515T3 (es) * 2019-04-18 2024-11-20 Exentis Knowledge Gmbh Procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
HUE065483T2 (hu) * 2019-04-18 2024-05-28 Exentis Knowledge Gmbh Berendezés és eljárás háromdimenziós szitanyomó munkadarabok elõállítására
CN111186211B (zh) * 2020-02-04 2021-06-04 北部湾大学 一种用于陶瓷花纸印刷机的油墨干燥装置
CN114801452A (zh) * 2021-01-18 2022-07-29 博泽精密科技(苏州)有限公司 一种印刷机械自动上料机构
CN215305176U (zh) * 2021-06-15 2021-12-28 江门市新会恒隆家居创新用品有限公司 多士炉

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Also Published As

Publication number Publication date
TW201009990A (en) 2010-03-01
JP2011526734A (ja) 2011-10-13
EP2301064A1 (en) 2011-03-30
CN103227127A (zh) 2013-07-31
KR20110030564A (ko) 2011-03-23
US20090311439A1 (en) 2009-12-17
WO2009150070A1 (en) 2009-12-17
US20090308860A1 (en) 2009-12-17
CN102057462A (zh) 2011-05-11
CN102057462B (zh) 2013-05-15
EP2301064B1 (en) 2018-08-29

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