CN103227127A - 用于丝网印刷的短热力曲线炉 - Google Patents

用于丝网印刷的短热力曲线炉 Download PDF

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Publication number
CN103227127A
CN103227127A CN2013101388946A CN201310138894A CN103227127A CN 103227127 A CN103227127 A CN 103227127A CN 2013101388946 A CN2013101388946 A CN 2013101388946A CN 201310138894 A CN201310138894 A CN 201310138894A CN 103227127 A CN103227127 A CN 103227127A
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CN
China
Prior art keywords
substrate
gas
substrates
processing
conveyor
Prior art date
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Pending
Application number
CN2013101388946A
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English (en)
Chinese (zh)
Inventor
A·巴希尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Italia SRL
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Applied Materials Baccini SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080135 external-priority patent/ITUD20080135A1/it
Priority claimed from ITUD20080154 external-priority patent/ITUD20080154A1/it
Application filed by Applied Materials Baccini SpA filed Critical Applied Materials Baccini SpA
Publication of CN103227127A publication Critical patent/CN103227127A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Drying Of Solid Materials (AREA)
  • Screen Printers (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
CN2013101388946A 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉 Pending CN103227127A (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
IT2008A000135 2008-06-11
ITUD20080135 ITUD20080135A1 (it) 2008-06-11 2008-06-11 Forno a basso profilo termico per stampa serigrafica
ITUD20080154 ITUD20080154A1 (it) 2008-06-27 2008-06-27 Forno a basso profilo termico per stampa serigrafica
IT2008A000154 2008-06-27
US12/240,955 US20090308860A1 (en) 2008-06-11 2008-09-29 Short thermal profile oven useful for screen printing
US12/240,955 2008-09-29
US12/273,442 US20090311439A1 (en) 2008-06-11 2008-11-18 Short Thermal Profile Oven Useful For Screen Printing
US12/273,442 2008-11-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009801225813A Division CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Publications (1)

Publication Number Publication Date
CN103227127A true CN103227127A (zh) 2013-07-31

Family

ID=41151966

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2013101388946A Pending CN103227127A (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉
CN2009801225813A Expired - Fee Related CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009801225813A Expired - Fee Related CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Country Status (7)

Country Link
US (2) US20090308860A1 (https=)
EP (1) EP2301064B1 (https=)
JP (1) JP2011526734A (https=)
KR (1) KR20110030564A (https=)
CN (2) CN103227127A (https=)
TW (1) TWI479590B (https=)
WO (1) WO2009150070A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104441956A (zh) * 2014-12-10 2015-03-25 苏州互强工业设备有限公司 一种丝印烘干线
CN108878334A (zh) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 工件转移和印刷
CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101321604B (zh) * 2005-12-06 2011-09-14 武藏高科技有限公司 加工装置及加工方法
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
WO2011110231A1 (en) * 2010-03-12 2011-09-15 Q-Cells Se Method and in-line production system for the production of solar cells
US20120060758A1 (en) * 2011-03-24 2012-03-15 Primestar Solar, Inc. Dynamic system for variable heating or cooling of linearly conveyed substrates
US9589817B2 (en) * 2011-04-15 2017-03-07 Illinois Tool Works Inc. Dryer
KR102326995B1 (ko) * 2012-11-30 2021-11-16 카티바, 인크. 산업용 프린팅 시스템의 유지 방법
CN105900258A (zh) 2013-12-26 2016-08-24 科迪华公司 电子装置的热加工
KR102050152B1 (ko) 2014-01-21 2020-01-08 카티바, 인크. 전자 장치 인캡슐레이션을 위한 기기 및 기술
KR102390045B1 (ko) 2014-04-30 2022-04-22 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
US10458710B2 (en) 2014-11-07 2019-10-29 Illinois Tool Works Inc. Supply plenum for center-to-ends fiber oxidation oven
US10676847B2 (en) 2014-11-07 2020-06-09 Illinois Tool Works Inc. Discharge nozzle plate for center-to-ends fiber oxidation oven
CN104527218B (zh) * 2014-12-24 2016-01-13 庄统壹 一种网版印刷机及利用该网版印刷机印刷的工艺方法
CN108604619A (zh) * 2016-02-22 2018-09-28 应用材料意大利有限公司 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法
CN110534611A (zh) * 2018-05-25 2019-12-03 米亚索乐装备集成（福建）有限公司 一种用于片状电池的加热设备
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
KR102088778B1 (ko) * 2018-08-07 2020-03-13 김영택 수용성 잉크를 이용한 인쇄기의 열 건조장치
PT3725525T (pt) * 2019-04-18 2024-05-03 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
ES2988515T3 (es) * 2019-04-18 2024-11-20 Exentis Knowledge Gmbh Procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
HUE065483T2 (hu) * 2019-04-18 2024-05-28 Exentis Knowledge Gmbh Berendezés és eljárás háromdimenziós szitanyomó munkadarabok elõállítására
CN111186211B (zh) * 2020-02-04 2021-06-04 北部湾大学 一种用于陶瓷花纸印刷机的油墨干燥装置
CN114801452A (zh) * 2021-01-18 2022-07-29 博泽精密科技(苏州)有限公司 一种印刷机械自动上料机构
CN215305176U (zh) * 2021-06-15 2021-12-28 江门市新会恒隆家居创新用品有限公司 多士炉

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545131A (en) * 1982-03-17 1985-10-08 Svecia Silkscreen Maskiner Ab Drier intended to dry print on a material
JPH01262069A (ja) * 1988-04-13 1989-10-18 Matsushita Electric Ind Co Ltd 基板の加熱装置及び加熱方法
US4951401A (en) * 1988-09-16 1990-08-28 Senju Metal Industry Co., Ltd. Solder reflow apparatus
US5261165A (en) * 1990-11-16 1993-11-16 Setsuo Tate Drying method and device for coated layer
US5467912A (en) * 1992-11-27 1995-11-21 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus for soldering electronic parts to circuit substrate
CN1252893A (zh) * 1997-12-26 2000-05-10 精工爱普生株式会社 氧化硅膜的制造方法、半导体装置的制造方法、半导体装置、显示装置和红外光照射装置
US20030108349A1 (en) * 2001-12-10 2003-06-12 Kouzou Kanagawa Substrate processing apparatus
JP2004181483A (ja) * 2002-12-03 2004-07-02 Senju Metal Ind Co Ltd リフロー炉
US20060130750A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US20080012499A1 (en) * 2006-06-26 2008-01-17 Thermal Processing Solutions, Inc. Rapid Thermal Firing IR Conveyor Furnace Having High Intensity Heating Section

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3216127A (en) * 1962-02-09 1965-11-09 Universal Oil Prod Co Coating oven with catalytic incineration of volatiles
US3961569A (en) * 1974-08-15 1976-06-08 The United States Of America As Represented By The Secretary Of The Army Apparatus for continuous microwave sterilization of food in pouches
US3924569A (en) * 1974-08-28 1975-12-09 Goodyear Tire & Rubber Apparatus for treating tire cord fabric
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
US4753735A (en) * 1985-03-11 1988-06-28 Allied-Signal Inc. Solvent and apparatus and method for cleaning and drying surfaces of non absorbent articles
US4694586A (en) * 1985-05-17 1987-09-22 David Reznik Apparatus and method for drying and curing coated substrates
CH671231A5 (https=) * 1985-07-24 1989-08-15 Basf Ag
US4757759A (en) * 1986-03-05 1988-07-19 Tam Ceramics, Inc. Multilayer ceramic bar printing and assembling apparatus
DE3633106A1 (de) * 1986-09-30 1988-03-31 Pagendarm Beschichtungstechnik Verfahren und vorrichtung zum beschichten eines bewegten traegermaterials mit einem ein loesemittel enthaltenden beschichtungsmittel
US4798007A (en) * 1987-05-28 1989-01-17 Eichenlaub John E Explosion-proof, pollution-free infrared dryer
DE8817120U1 (de) * 1988-04-07 1993-02-04 Vits Maschinenbau Gmbh, 4018 Langenfeld Vorrichtung zur Wärmebehandlung und/oder Trocknung einer Materialbahn
US5883362A (en) * 1988-05-19 1999-03-16 Quadlux, Inc. Apparatus and method for regulating cooking time in a lightwave oven
US5263265A (en) * 1989-10-23 1993-11-23 Despatch Industries Convection/radiation material treatment oven
IT1252949B (it) * 1991-09-30 1995-07-06 Gisulfo Baccini Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento
JPH0694369A (ja) * 1992-09-14 1994-04-05 Tdk Corp 焼成炉用雰囲気ガス制御装置
JP3226651B2 (ja) * 1993-02-02 2001-11-05 千住金属工業株式会社 リフロー炉およびリフロー炉用冷却装置
JPH0899610A (ja) * 1994-09-30 1996-04-16 Tsutsunaka Plast Ind Co Ltd 防曇性能を有する合成樹脂製窓材およびその製造方法
JP2718007B2 (ja) * 1995-06-06 1998-02-25 太陽インキ製造株式会社 アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法
EP0890068A1 (en) * 1996-03-29 1999-01-13 Minnesota Mining And Manufacturing Company Apparatus and method for drying a coating on a substrate employing multiple drying subzones
JP3754841B2 (ja) * 1998-06-11 2006-03-15 キヤノン株式会社 光起電力素子およびその製造方法
JP2000238233A (ja) * 1999-02-23 2000-09-05 Fuji Mach Mfg Co Ltd スクリーン検査方法，装置およびスクリーン印刷機
CA2271401C (en) * 1999-02-23 2008-07-29 Tesco Corporation Drilling with casing
JP3934281B2 (ja) * 1999-07-02 2007-06-20 三菱電機株式会社 コンベア炉
KR100671986B1 (ko) * 1999-07-12 2007-01-23 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 알칼리현상형 광경화성 조성물 및 이를 사용하여 얻을 수 있는 소성물(燒成物) 패턴
CN1211807C (zh) * 2000-02-21 2005-07-20 东洋油墨制造株式会社 活化高能射线束硬化型导电糊、导体电路基片的制造方法及装置以及非接触式id及其制造方法
CN1237085C (zh) * 2000-09-20 2006-01-18 太阳油墨制造株式会社 含有羧基的感光性树脂、含该树脂的可碱显影的光固化性·热固化性组合物及其固化物
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
JP2004140120A (ja) * 2002-10-16 2004-05-13 Canon Inc 多結晶シリコン基板
JP4042592B2 (ja) * 2003-03-05 2008-02-06 ウシオ電機株式会社 加熱装置
EP2610568A1 (en) * 2003-03-26 2013-07-03 Fujifilm Corporation Drying method for a coating layer
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
US7485410B2 (en) * 2004-06-30 2009-02-03 Canon Kabushiki Kaisha Method of manufacturing thick dielectric pattern and method of manufacturing image displaying apparatus
KR101071004B1 (ko) * 2004-12-22 2011-10-06 가부시키가이샤 소쿠도 통합 열 장치
FR2886577B1 (fr) * 2005-06-06 2008-12-26 Mach Dubuit Soc Par Actions Si Machine et dispositif d'impression par serigraphie
JP4319647B2 (ja) * 2005-06-30 2009-08-26 株式会社タムラ古河マシナリー リフロー炉
JP4622705B2 (ja) * 2005-07-01 2011-02-02 パナソニック株式会社 パネルスイッチ用可動接点体
WO2007136598A2 (en) * 2006-05-19 2007-11-29 Nu-Vu Food Service Systems Combination conveyor oven
KR100856411B1 (ko) * 2006-12-01 2008-09-04 삼성전자주식회사 조도 보상 방법 및 그 장치와 그 방법을 기록한 컴퓨터로 읽을 수 있는 기록매체
US7851727B2 (en) * 2007-05-16 2010-12-14 Prince Castle LLC Method of controlling an oven with hybrid heating sources
ITUD20080136A1 (it) * 2008-06-13 2009-12-14 Baccini S P A Impianto per la lavorazione di piastre per circuiti elettronici
IT1392993B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica
IT1392991B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento di stampa serigrafica autoregolantesi
IT1392992B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo
US8828776B2 (en) * 2009-04-16 2014-09-09 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
US8039289B2 (en) * 2009-04-16 2011-10-18 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
IT1394811B1 (it) * 2009-07-08 2012-07-13 Applied Materials Inc Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati
IT1398433B1 (it) * 2009-09-03 2013-02-22 Applied Materials Inc Apparato e procedimento per la lavorazione di un substrato

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545131A (en) * 1982-03-17 1985-10-08 Svecia Silkscreen Maskiner Ab Drier intended to dry print on a material
JPH01262069A (ja) * 1988-04-13 1989-10-18 Matsushita Electric Ind Co Ltd 基板の加熱装置及び加熱方法
US4951401A (en) * 1988-09-16 1990-08-28 Senju Metal Industry Co., Ltd. Solder reflow apparatus
US5261165A (en) * 1990-11-16 1993-11-16 Setsuo Tate Drying method and device for coated layer
US5467912A (en) * 1992-11-27 1995-11-21 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus for soldering electronic parts to circuit substrate
CN1252893A (zh) * 1997-12-26 2000-05-10 精工爱普生株式会社 氧化硅膜的制造方法、半导体装置的制造方法、半导体装置、显示装置和红外光照射装置
US20030108349A1 (en) * 2001-12-10 2003-06-12 Kouzou Kanagawa Substrate processing apparatus
JP2004181483A (ja) * 2002-12-03 2004-07-02 Senju Metal Ind Co Ltd リフロー炉
US20060130750A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US20080012499A1 (en) * 2006-06-26 2008-01-17 Thermal Processing Solutions, Inc. Rapid Thermal Firing IR Conveyor Furnace Having High Intensity Heating Section

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104441956A (zh) * 2014-12-10 2015-03-25 苏州互强工业设备有限公司 一种丝印烘干线
CN108878334A (zh) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 工件转移和印刷
CN108878334B (zh) * 2017-05-16 2023-05-09 先进装配系统新加坡有限公司 工件转移和印刷
CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法

Also Published As

Publication number Publication date
TW201009990A (en) 2010-03-01
JP2011526734A (ja) 2011-10-13
EP2301064A1 (en) 2011-03-30
KR20110030564A (ko) 2011-03-23
TWI479590B (zh) 2015-04-01
US20090311439A1 (en) 2009-12-17
WO2009150070A1 (en) 2009-12-17
US20090308860A1 (en) 2009-12-17
CN102057462A (zh) 2011-05-11
CN102057462B (zh) 2013-05-15
EP2301064B1 (en) 2018-08-29

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Application publication date: 20130731