TWI479514B - 抗硫化的晶片電阻及其製法 - Google Patents
抗硫化的晶片電阻及其製法 Download PDFInfo
- Publication number
- TWI479514B TWI479514B TW101136473A TW101136473A TWI479514B TW I479514 B TWI479514 B TW I479514B TW 101136473 A TW101136473 A TW 101136473A TW 101136473 A TW101136473 A TW 101136473A TW I479514 B TWI479514 B TW I479514B
- Authority
- TW
- Taiwan
- Prior art keywords
- vulcanization
- resistor
- protective coating
- outer non
- wafer resistor
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000005987 sulfurization reaction Methods 0.000 title 1
- 239000011253 protective coating Substances 0.000 claims description 52
- 238000007747 plating Methods 0.000 claims description 48
- 238000004073 vulcanization Methods 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 229910052709 silver Inorganic materials 0.000 claims description 32
- 239000004332 silver Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 29
- 239000000615 nonconductor Substances 0.000 claims description 23
- 238000004544 sputter deposition Methods 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 32
- 235000012431 wafers Nutrition 0.000 description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 28
- 229910052759 nickel Inorganic materials 0.000 description 16
- 230000008901 benefit Effects 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 8
- 239000000976 ink Substances 0.000 description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000003570 air Substances 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011195 cermet Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 241000212941 Glehnia Species 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 150000003464 sulfur compounds Chemical class 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89250307P | 2007-03-01 | 2007-03-01 | |
| US12/030,281 US7982582B2 (en) | 2007-03-01 | 2008-02-13 | Sulfuration resistant chip resistor and method for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201303912A TW201303912A (zh) | 2013-01-16 |
| TWI479514B true TWI479514B (zh) | 2015-04-01 |
Family
ID=39535523
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101136473A TWI479514B (zh) | 2007-03-01 | 2008-02-26 | 抗硫化的晶片電阻及其製法 |
| TW097106574A TWI423271B (zh) | 2007-03-01 | 2008-02-26 | 抗硫化的晶片電阻及其製法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097106574A TWI423271B (zh) | 2007-03-01 | 2008-02-26 | 抗硫化的晶片電阻及其製法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7982582B2 (enExample) |
| EP (1) | EP2130207B1 (enExample) |
| JP (4) | JP2010520624A (enExample) |
| CN (2) | CN101681705B (enExample) |
| TW (2) | TWI479514B (enExample) |
| WO (1) | WO2008109262A1 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7982582B2 (en) * | 2007-03-01 | 2011-07-19 | Vishay Intertechnology Inc. | Sulfuration resistant chip resistor and method for making same |
| CN103219964A (zh) | 2012-01-18 | 2013-07-24 | 新科实业有限公司 | 衰减器 |
| JP6227877B2 (ja) * | 2013-02-26 | 2017-11-08 | ローム株式会社 | チップ抵抗器、およびチップ抵抗器の製造方法 |
| CN104347208B (zh) * | 2013-07-31 | 2018-10-12 | 南京中兴新软件有限责任公司 | 一种电阻器制作方法、电阻器及电路 |
| JP6274789B2 (ja) * | 2013-08-30 | 2018-02-07 | ローム株式会社 | チップ抵抗器 |
| JP6386723B2 (ja) * | 2013-12-11 | 2018-09-05 | Koa株式会社 | 抵抗素子の製造方法 |
| TWI508109B (zh) * | 2013-12-25 | 2015-11-11 | Yageo Corp | Chip resistors |
| JP6326192B2 (ja) | 2014-03-19 | 2018-05-16 | Koa株式会社 | チップ抵抗器およびその製造法 |
| US9336931B2 (en) | 2014-06-06 | 2016-05-10 | Yageo Corporation | Chip resistor |
| JP6373723B2 (ja) * | 2014-10-31 | 2018-08-15 | Koa株式会社 | チップ抵抗器 |
| US9818512B2 (en) | 2014-12-08 | 2017-11-14 | Vishay Dale Electronics, Llc | Thermally sprayed thin film resistor and method of making |
| JP6398749B2 (ja) * | 2015-01-28 | 2018-10-03 | 三菱マテリアル株式会社 | 抵抗器及び抵抗器の製造方法 |
| WO2016153116A1 (ko) * | 2015-03-23 | 2016-09-29 | 조인셋 주식회사 | 내 환경성이 향상된 탄성 전기접촉단자 및 그 제조 방법 |
| KR101883040B1 (ko) * | 2016-01-08 | 2018-07-27 | 삼성전기주식회사 | 칩 저항 소자 |
| JP2017168817A (ja) * | 2016-03-15 | 2017-09-21 | ローム株式会社 | チップ抵抗器およびその製造方法 |
| TWI598878B (zh) * | 2016-05-24 | 2017-09-11 | 宇瞻科技股份有限公司 | 抗硫化之記憶體儲存裝置 |
| CN105931663B (zh) * | 2016-05-24 | 2019-03-01 | 宇瞻科技股份有限公司 | 抗硫化的内存存储装置 |
| TWI620318B (zh) * | 2016-08-10 | 2018-04-01 | Wafer resistor device and method of manufacturing same | |
| KR102527724B1 (ko) * | 2016-11-15 | 2023-05-02 | 삼성전기주식회사 | 칩 저항 소자 및 칩 저항 소자 어셈블리 |
| CN108231308B (zh) * | 2016-12-21 | 2020-03-24 | 李文熙 | 铝端电极芯片电阻器的制造方法 |
| DE112017006585T5 (de) | 2016-12-27 | 2019-09-12 | Rohm Co., Ltd. | Chip-widerstand und verfahren zu seiner herstellung |
| TWI605476B (zh) * | 2017-02-06 | 2017-11-11 | Anti-vulcanization chip resistor and its manufacturing method | |
| CN108399992B (zh) * | 2017-02-08 | 2019-12-27 | 东莞华科电子有限公司 | 抗硫化的晶片电阻及其制法 |
| CN107331486A (zh) * | 2017-06-28 | 2017-11-07 | 中国振华集团云科电子有限公司 | 抗硫化电阻器及其制备方法 |
| DE112018005181B4 (de) | 2017-11-02 | 2025-04-10 | Rohm Co., Ltd. | Chip-widerstand |
| CN107946075B (zh) * | 2017-11-18 | 2024-01-30 | 湖南艾华集团股份有限公司 | 叠层电容器 |
| KR102160500B1 (ko) * | 2018-07-11 | 2020-09-28 | 주식회사 테토스 | 기판 측면부 배선 형성 방법 |
| CN109148065B (zh) * | 2018-08-21 | 2020-02-18 | 广东风华高新科技股份有限公司 | 一种抗硫化片式电阻器及其制造方法 |
| US11600410B2 (en) | 2018-08-23 | 2023-03-07 | Mitsubishi Materials Corporation | Thermistor with protective film and manufacturing method thereof |
| US11056630B2 (en) | 2019-02-13 | 2021-07-06 | Samsung Electronics Co., Ltd. | Display module having glass substrate on which side wirings are formed and manufacturing method of the same |
| TWI707366B (zh) * | 2020-03-25 | 2020-10-11 | 光頡科技股份有限公司 | 電阻元件 |
| US20240023241A1 (en) * | 2020-11-17 | 2024-01-18 | Kyocera Corporation | Circuit substrate and electronic device |
| CN113972045B (zh) * | 2021-10-26 | 2023-11-03 | 江西昶龙科技有限公司 | 一种制备抗硫化厚膜晶片电阻的方法 |
| JP2023114299A (ja) * | 2022-02-04 | 2023-08-17 | Koa株式会社 | チップ抵抗器 |
| CN119137687A (zh) * | 2022-05-11 | 2024-12-13 | Koa株式会社 | 片式电阻器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW434586B (en) * | 1998-01-20 | 2001-05-16 | Matsushita Electric Industrial Co Ltd | Resistor |
| CN1524275A (zh) * | 2001-11-28 | 2004-08-25 | ��ķ�ɷ�����˾ | 芯片电阻器及其制造方法 |
| CN1178230C (zh) * | 1998-08-18 | 2004-12-01 | 罗姆股份有限公司 | 贴片式电阻器及其制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5135098A (ja) * | 1974-09-20 | 1976-03-25 | Toray Industries | Denkiteikotai |
| JP3282424B2 (ja) | 1995-01-20 | 2002-05-13 | 松下電器産業株式会社 | 角形薄膜チップ抵抗器の製造方法 |
| JPH11195505A (ja) * | 1997-12-26 | 1999-07-21 | E I Du Pont De Nemours & Co | 厚膜抵抗体及びその製造方法 |
| JPH11204304A (ja) * | 1998-01-08 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
| JP2000299203A (ja) * | 1999-04-15 | 2000-10-24 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
| JP3967040B2 (ja) | 1999-07-05 | 2007-08-29 | ローム株式会社 | 多連のチップ型抵抗器の構造 |
| JP2001110601A (ja) | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
| JP2001143905A (ja) * | 1999-11-17 | 2001-05-25 | Murata Mfg Co Ltd | チップ型サーミスタの製造方法 |
| JP4722318B2 (ja) * | 2000-06-05 | 2011-07-13 | ローム株式会社 | チップ抵抗器 |
| JP2002184602A (ja) * | 2000-12-13 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 角形チップ抵抗器 |
| JP3958532B2 (ja) * | 2001-04-16 | 2007-08-15 | ローム株式会社 | チップ抵抗器の製造方法 |
| JP3935687B2 (ja) | 2001-06-20 | 2007-06-27 | アルプス電気株式会社 | 薄膜抵抗素子およびその製造方法 |
| JP4204029B2 (ja) * | 2001-11-30 | 2009-01-07 | ローム株式会社 | チップ抵抗器 |
| KR20030052196A (ko) * | 2001-12-20 | 2003-06-26 | 삼성전기주식회사 | 박막 칩 저항기 및 그 제조방법 |
| JP2004259864A (ja) * | 2003-02-25 | 2004-09-16 | Rohm Co Ltd | チップ抵抗器 |
| JP2005191406A (ja) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | チップ抵抗器およびその製造方法 |
| JP2005268302A (ja) * | 2004-03-16 | 2005-09-29 | Koa Corp | チップ抵抗器およびその製造方法 |
| JP2006024767A (ja) * | 2004-07-08 | 2006-01-26 | Koa Corp | チップ抵抗器の製造方法 |
| JP4909077B2 (ja) | 2004-09-15 | 2012-04-04 | パナソニック株式会社 | チップ抵抗器 |
| JP4841914B2 (ja) * | 2005-09-21 | 2011-12-21 | コーア株式会社 | チップ抵抗器 |
| US7982582B2 (en) | 2007-03-01 | 2011-07-19 | Vishay Intertechnology Inc. | Sulfuration resistant chip resistor and method for making same |
-
2008
- 2008-02-13 US US12/030,281 patent/US7982582B2/en active Active
- 2008-02-21 EP EP08730372.3A patent/EP2130207B1/en active Active
- 2008-02-21 WO PCT/US2008/054557 patent/WO2008109262A1/en not_active Ceased
- 2008-02-21 CN CN200880010666.8A patent/CN101681705B/zh active Active
- 2008-02-21 JP JP2009552007A patent/JP2010520624A/ja active Pending
- 2008-02-21 CN CN201110443555.XA patent/CN102682938B/zh active Active
- 2008-02-26 TW TW101136473A patent/TWI479514B/zh active
- 2008-02-26 TW TW097106574A patent/TWI423271B/zh active
-
2011
- 2011-07-18 US US13/185,065 patent/US8514051B2/en active Active
-
2012
- 2012-12-25 JP JP2012280566A patent/JP2013080952A/ja active Pending
-
2013
- 2013-06-26 JP JP2013133754A patent/JP2013219387A/ja active Pending
- 2013-08-19 US US13/970,011 patent/US8957756B2/en active Active
-
2016
- 2016-05-06 JP JP2016093075A patent/JP6546118B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW434586B (en) * | 1998-01-20 | 2001-05-16 | Matsushita Electric Industrial Co Ltd | Resistor |
| CN1178230C (zh) * | 1998-08-18 | 2004-12-01 | 罗姆股份有限公司 | 贴片式电阻器及其制备方法 |
| CN1524275A (zh) * | 2001-11-28 | 2004-08-25 | ��ķ�ɷ�����˾ | 芯片电阻器及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7982582B2 (en) | 2011-07-19 |
| JP2013080952A (ja) | 2013-05-02 |
| US20130335191A1 (en) | 2013-12-19 |
| JP2013219387A (ja) | 2013-10-24 |
| US20120126934A1 (en) | 2012-05-24 |
| CN102682938A (zh) | 2012-09-19 |
| HK1142715A1 (en) | 2010-12-10 |
| JP6546118B2 (ja) | 2019-07-17 |
| US8514051B2 (en) | 2013-08-20 |
| TWI423271B (zh) | 2014-01-11 |
| JP2010520624A (ja) | 2010-06-10 |
| JP2016157980A (ja) | 2016-09-01 |
| TW201303912A (zh) | 2013-01-16 |
| TW200901234A (en) | 2009-01-01 |
| CN101681705A (zh) | 2010-03-24 |
| CN101681705B (zh) | 2012-02-15 |
| WO2008109262A1 (en) | 2008-09-12 |
| EP2130207A1 (en) | 2009-12-09 |
| CN102682938B (zh) | 2016-06-15 |
| US20080211619A1 (en) | 2008-09-04 |
| US8957756B2 (en) | 2015-02-17 |
| EP2130207B1 (en) | 2018-09-05 |
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