CN101681705B - 抗硫化芯片电阻器及其制造方法 - Google Patents

抗硫化芯片电阻器及其制造方法 Download PDF

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Publication number
CN101681705B
CN101681705B CN200880010666.8A CN200880010666A CN101681705B CN 101681705 B CN101681705 B CN 101681705B CN 200880010666 A CN200880010666 A CN 200880010666A CN 101681705 B CN101681705 B CN 101681705B
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China
Prior art keywords
top end
resistive element
end electrodes
external protection
sulfuration
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CN200880010666.8A
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Chinese (zh)
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CN101681705A (zh
Inventor
M·贝尔曼
L·阿赫特曼
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Vishay Intertechnology Inc
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Vishay Intertechnology Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
CN200880010666.8A 2007-03-01 2008-02-21 抗硫化芯片电阻器及其制造方法 Active CN101681705B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US89250307P 2007-03-01 2007-03-01
US60/892,503 2007-03-01
PCT/US2008/054557 WO2008109262A1 (en) 2007-03-01 2008-02-21 Sulfuration resistant chip resistor and method for making same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110443555.XA Division CN102682938B (zh) 2007-03-01 2008-02-21 抗硫化芯片电阻器及其制造方法

Publications (2)

Publication Number Publication Date
CN101681705A CN101681705A (zh) 2010-03-24
CN101681705B true CN101681705B (zh) 2012-02-15

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CN200880010666.8A Active CN101681705B (zh) 2007-03-01 2008-02-21 抗硫化芯片电阻器及其制造方法
CN201110443555.XA Active CN102682938B (zh) 2007-03-01 2008-02-21 抗硫化芯片电阻器及其制造方法

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CN201110443555.XA Active CN102682938B (zh) 2007-03-01 2008-02-21 抗硫化芯片电阻器及其制造方法

Country Status (6)

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US (3) US7982582B2 (enExample)
EP (1) EP2130207B1 (enExample)
JP (4) JP2010520624A (enExample)
CN (2) CN101681705B (enExample)
TW (2) TWI479514B (enExample)
WO (1) WO2008109262A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7982582B2 (en) * 2007-03-01 2011-07-19 Vishay Intertechnology Inc. Sulfuration resistant chip resistor and method for making same
CN103219964A (zh) 2012-01-18 2013-07-24 新科实业有限公司 衰减器
JP6227877B2 (ja) * 2013-02-26 2017-11-08 ローム株式会社 チップ抵抗器、およびチップ抵抗器の製造方法
CN104347208B (zh) * 2013-07-31 2018-10-12 南京中兴新软件有限责任公司 一种电阻器制作方法、电阻器及电路
JP6274789B2 (ja) * 2013-08-30 2018-02-07 ローム株式会社 チップ抵抗器
JP6386723B2 (ja) * 2013-12-11 2018-09-05 Koa株式会社 抵抗素子の製造方法
TWI508109B (zh) * 2013-12-25 2015-11-11 Yageo Corp Chip resistors
JP6326192B2 (ja) 2014-03-19 2018-05-16 Koa株式会社 チップ抵抗器およびその製造法
US9336931B2 (en) 2014-06-06 2016-05-10 Yageo Corporation Chip resistor
JP6373723B2 (ja) * 2014-10-31 2018-08-15 Koa株式会社 チップ抵抗器
US9818512B2 (en) 2014-12-08 2017-11-14 Vishay Dale Electronics, Llc Thermally sprayed thin film resistor and method of making
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
WO2016153116A1 (ko) * 2015-03-23 2016-09-29 조인셋 주식회사 내 환경성이 향상된 탄성 전기접촉단자 및 그 제조 방법
KR101883040B1 (ko) * 2016-01-08 2018-07-27 삼성전기주식회사 칩 저항 소자
JP2017168817A (ja) * 2016-03-15 2017-09-21 ローム株式会社 チップ抵抗器およびその製造方法
TWI598878B (zh) * 2016-05-24 2017-09-11 宇瞻科技股份有限公司 抗硫化之記憶體儲存裝置
CN105931663B (zh) * 2016-05-24 2019-03-01 宇瞻科技股份有限公司 抗硫化的内存存储装置
TWI620318B (zh) * 2016-08-10 2018-04-01 Wafer resistor device and method of manufacturing same
KR102527724B1 (ko) * 2016-11-15 2023-05-02 삼성전기주식회사 칩 저항 소자 및 칩 저항 소자 어셈블리
CN108231308B (zh) * 2016-12-21 2020-03-24 李文熙 铝端电极芯片电阻器的制造方法
DE112017006585T5 (de) 2016-12-27 2019-09-12 Rohm Co., Ltd. Chip-widerstand und verfahren zu seiner herstellung
TWI605476B (zh) * 2017-02-06 2017-11-11 Anti-vulcanization chip resistor and its manufacturing method
CN108399992B (zh) * 2017-02-08 2019-12-27 东莞华科电子有限公司 抗硫化的晶片电阻及其制法
CN107331486A (zh) * 2017-06-28 2017-11-07 中国振华集团云科电子有限公司 抗硫化电阻器及其制备方法
DE112018005181B4 (de) 2017-11-02 2025-04-10 Rohm Co., Ltd. Chip-widerstand
CN107946075B (zh) * 2017-11-18 2024-01-30 湖南艾华集团股份有限公司 叠层电容器
KR102160500B1 (ko) * 2018-07-11 2020-09-28 주식회사 테토스 기판 측면부 배선 형성 방법
CN109148065B (zh) * 2018-08-21 2020-02-18 广东风华高新科技股份有限公司 一种抗硫化片式电阻器及其制造方法
US11600410B2 (en) 2018-08-23 2023-03-07 Mitsubishi Materials Corporation Thermistor with protective film and manufacturing method thereof
US11056630B2 (en) 2019-02-13 2021-07-06 Samsung Electronics Co., Ltd. Display module having glass substrate on which side wirings are formed and manufacturing method of the same
TWI707366B (zh) * 2020-03-25 2020-10-11 光頡科技股份有限公司 電阻元件
US20240023241A1 (en) * 2020-11-17 2024-01-18 Kyocera Corporation Circuit substrate and electronic device
CN113972045B (zh) * 2021-10-26 2023-11-03 江西昶龙科技有限公司 一种制备抗硫化厚膜晶片电阻的方法
JP2023114299A (ja) * 2022-02-04 2023-08-17 Koa株式会社 チップ抵抗器
CN119137687A (zh) * 2022-05-11 2024-12-13 Koa株式会社 片式电阻器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201290B1 (en) * 1998-01-08 2001-03-13 Matsushita Electric Industrial Co., Ltd. Resistor having moisture resistant layer
CN1216385C (zh) * 2001-06-20 2005-08-24 阿尔卑斯电气株式会社 薄膜电阻元件及其制造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5135098A (ja) * 1974-09-20 1976-03-25 Toray Industries Denkiteikotai
JP3282424B2 (ja) 1995-01-20 2002-05-13 松下電器産業株式会社 角形薄膜チップ抵抗器の製造方法
JPH11195505A (ja) * 1997-12-26 1999-07-21 E I Du Pont De Nemours & Co 厚膜抵抗体及びその製造方法
JPH11204301A (ja) 1998-01-20 1999-07-30 Matsushita Electric Ind Co Ltd 抵抗器
JP3852649B2 (ja) 1998-08-18 2006-12-06 ローム株式会社 チップ抵抗器の製造方法
JP2000299203A (ja) * 1999-04-15 2000-10-24 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
JP3967040B2 (ja) 1999-07-05 2007-08-29 ローム株式会社 多連のチップ型抵抗器の構造
JP2001110601A (ja) 1999-10-14 2001-04-20 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
JP2001143905A (ja) * 1999-11-17 2001-05-25 Murata Mfg Co Ltd チップ型サーミスタの製造方法
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
JP2002184602A (ja) * 2000-12-13 2002-06-28 Matsushita Electric Ind Co Ltd 角形チップ抵抗器
JP3958532B2 (ja) * 2001-04-16 2007-08-15 ローム株式会社 チップ抵抗器の製造方法
CN100351956C (zh) * 2001-11-28 2007-11-28 罗姆股份有限公司 芯片电阻器及其制造方法
JP4204029B2 (ja) * 2001-11-30 2009-01-07 ローム株式会社 チップ抵抗器
KR20030052196A (ko) * 2001-12-20 2003-06-26 삼성전기주식회사 박막 칩 저항기 및 그 제조방법
JP2004259864A (ja) * 2003-02-25 2004-09-16 Rohm Co Ltd チップ抵抗器
JP2005191406A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd チップ抵抗器およびその製造方法
JP2005268302A (ja) * 2004-03-16 2005-09-29 Koa Corp チップ抵抗器およびその製造方法
JP2006024767A (ja) * 2004-07-08 2006-01-26 Koa Corp チップ抵抗器の製造方法
JP4909077B2 (ja) 2004-09-15 2012-04-04 パナソニック株式会社 チップ抵抗器
JP4841914B2 (ja) * 2005-09-21 2011-12-21 コーア株式会社 チップ抵抗器
US7982582B2 (en) 2007-03-01 2011-07-19 Vishay Intertechnology Inc. Sulfuration resistant chip resistor and method for making same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201290B1 (en) * 1998-01-08 2001-03-13 Matsushita Electric Industrial Co., Ltd. Resistor having moisture resistant layer
CN1216385C (zh) * 2001-06-20 2005-08-24 阿尔卑斯电气株式会社 薄膜电阻元件及其制造方法

Also Published As

Publication number Publication date
US7982582B2 (en) 2011-07-19
TWI479514B (zh) 2015-04-01
JP2013080952A (ja) 2013-05-02
US20130335191A1 (en) 2013-12-19
JP2013219387A (ja) 2013-10-24
US20120126934A1 (en) 2012-05-24
CN102682938A (zh) 2012-09-19
HK1142715A1 (en) 2010-12-10
JP6546118B2 (ja) 2019-07-17
US8514051B2 (en) 2013-08-20
TWI423271B (zh) 2014-01-11
JP2010520624A (ja) 2010-06-10
JP2016157980A (ja) 2016-09-01
TW201303912A (zh) 2013-01-16
TW200901234A (en) 2009-01-01
CN101681705A (zh) 2010-03-24
WO2008109262A1 (en) 2008-09-12
EP2130207A1 (en) 2009-12-09
CN102682938B (zh) 2016-06-15
US20080211619A1 (en) 2008-09-04
US8957756B2 (en) 2015-02-17
EP2130207B1 (en) 2018-09-05

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