TWI707366B - 電阻元件 - Google Patents

電阻元件 Download PDF

Info

Publication number
TWI707366B
TWI707366B TW109109964A TW109109964A TWI707366B TW I707366 B TWI707366 B TW I707366B TW 109109964 A TW109109964 A TW 109109964A TW 109109964 A TW109109964 A TW 109109964A TW I707366 B TWI707366 B TW I707366B
Authority
TW
Taiwan
Prior art keywords
protective layer
layer
substrate
electrode
resistance element
Prior art date
Application number
TW109109964A
Other languages
English (en)
Other versions
TW202137246A (zh
Inventor
郭明杰
蔡宗祐
盧契佑
Original Assignee
光頡科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光頡科技股份有限公司 filed Critical 光頡科技股份有限公司
Priority to TW109109964A priority Critical patent/TWI707366B/zh
Priority to CN202010586089.XA priority patent/CN113450979B/zh
Priority to US16/929,952 priority patent/US11205531B2/en
Application granted granted Critical
Publication of TWI707366B publication Critical patent/TWI707366B/zh
Publication of TW202137246A publication Critical patent/TW202137246A/zh

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C3/00Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C3/00Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

本發明提供一種電阻元件,在電極周圍設置封閉的保護層,使水氣或硫氣滲入並與電極接觸的路徑增加,延緩水氣或硫氣與電極接觸反應,延長電阻元件的使用壽命。

Description

電阻元件
本發明是關於一種電阻元件,特別是有關一種在電極周圍設置保護層結構以減緩水氣或硫氣腐蝕的電阻元件。
一般電阻元件在銀電極上覆蓋一導體層,用以保護銀電極。然而,水氣或硫氣等容易從導體層與基板間的間隙侵入,如圖1所示,與銀電極反應,形成絕緣的硫化銀(Ag 2S),電阻值可能增加或失效。
本發明提供一種電阻元件,在電極周圍設置保護層,再將導電層覆蓋於保護層和電極上,延長水氣或硫氣接觸電極的入侵路徑,而可避免或減緩腐蝕的情況,延長電阻元件的使用壽命。
以下將詳述本發明之各實施例,並配合圖式作為例示,使讀者對本發明有較完整的瞭解。這些詳細說明可廣泛地施行於其它的實施例中,任何所述實施例的輕易替代、修改、等效變化皆應包含在本發明之範圍,本發明範圍應以申請專利範圍界定。特別注意的是,圖式僅為示意之用,並非代表元件實際之尺寸或數量,有些細節可能未完全繪出,以求圖式之簡潔。
請參考圖2,係為本發明實施例的電阻元件立體示意圖。此實施例中,電阻元件的電極11周圍設有保護層12。本發明電阻元件的基板10兩端設有電極11,基板10上電極11周圍設有保護層12。
接著參考圖3,係為圖2實施例的A-A’切線剖視圖。在此實施例中,二電極11周圍以一定的間距H設有保護層12,保護層12、二電極11以及部分電阻層上再覆蓋導體層13。
其中,圖中所繪出的硫/水氣路徑14相較於傳統的電阻元件較長,因此水氣或硫氣可被延緩與電極11接觸。可理解的,保護層12可以是複數個獨立條狀或鋸齒狀之結構,且呈由電極11為中心往外排列,進一步增加硫/水氣路徑14(圖未示),視實際需求調整。在其他實施例中,電極11可延伸至基板10下表面,同時,保護層12亦隨電極11沿伸至基板10下表面(圖未示)。
本發明利用保護層圍繞電極周圍,其保護層的結構可阻斷或延緩硫氣或水氣從導體層與基板間的間隙與電極接觸,而得以延長電阻元件的壽命。
10:基板 11:電極 12:保護層 13:導體層 14:硫/水氣路徑 15:電阻層 H:間距 A-A’:截面切線
圖1為習知的電阻元件側剖視圖。
圖2為本發明的電阻元件立體示意圖。
圖3為圖2的A-A’切線剖視圖。
10:基板
11:電極
12:保護層
13:導體層
14:硫/水氣路徑
H:間距

Claims (3)

  1. 一種電阻元件,包含: 一基板; 一電阻層,設置於該基板的上表面; 一電極層,設置該基板的兩端,連接電阻層,形成二電極; 一保護層,以一間距設置於該電極層的周圍;以及 一導體層,實質覆蓋於該保護層及該電極層上。
  2. 如請求項1所述之電阻元件,其中該保護層為複數個獨立條狀或鋸齒狀之結構。
  3. 如請求項1所述之電阻元件,其中該電極層沿伸至該基板下表面,且該保護層亦隨該電極層延伸至該基板下表面。
TW109109964A 2020-03-25 2020-03-25 電阻元件 TWI707366B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW109109964A TWI707366B (zh) 2020-03-25 2020-03-25 電阻元件
CN202010586089.XA CN113450979B (zh) 2020-03-25 2020-06-24 芯片电阻组件
US16/929,952 US11205531B2 (en) 2020-03-25 2020-07-15 Resistor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109109964A TWI707366B (zh) 2020-03-25 2020-03-25 電阻元件

Publications (2)

Publication Number Publication Date
TWI707366B true TWI707366B (zh) 2020-10-11
TW202137246A TW202137246A (zh) 2021-10-01

Family

ID=74091730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109964A TWI707366B (zh) 2020-03-25 2020-03-25 電阻元件

Country Status (3)

Country Link
US (1) US11205531B2 (zh)
CN (1) CN113450979B (zh)
TW (1) TWI707366B (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999001876A1 (fr) * 1997-07-03 1999-01-14 Matsushita Electric Industrial Co., Ltd. Resistance et procede de fabrication
JP2005268300A (ja) * 2004-03-16 2005-09-29 Koa Corp チップ抵抗器およびその製造方法
KR100908345B1 (ko) * 2005-03-02 2009-07-20 로무 가부시키가이샤 칩 저항기와 그 제조 방법
US7982582B2 (en) * 2007-03-01 2011-07-19 Vishay Intertechnology Inc. Sulfuration resistant chip resistor and method for making same
JP5225598B2 (ja) * 2007-03-19 2013-07-03 コーア株式会社 電子部品およびその製造法
US20100134235A1 (en) * 2007-06-21 2010-06-03 Panasonic Corporation Esd protector and method of manufacturing the same
CN101740188A (zh) * 2009-12-31 2010-06-16 上海长园维安电子线路保护股份有限公司 表面贴装型的ptc热敏电阻器及其制备方法
WO2012114673A1 (ja) * 2011-02-24 2012-08-30 パナソニック株式会社 チップ抵抗器およびその製造方法
US20130154058A1 (en) * 2011-12-16 2013-06-20 International Business Machines Corporation High surface area filler for use in conformal coating compositions
US9997281B2 (en) * 2015-02-19 2018-06-12 Rohm Co., Ltd. Chip resistor and method for manufacturing the same
US10121573B2 (en) * 2016-01-06 2018-11-06 International Business Machines Corporation Epoxy-based resin system composition containing a latent functionality for polymer adhesion improvement to prevent sulfur related corrosion
TWM597500U (zh) * 2020-03-25 2020-06-21 光頡科技股份有限公司 電阻元件

Also Published As

Publication number Publication date
TW202137246A (zh) 2021-10-01
US11205531B2 (en) 2021-12-21
CN113450979B (zh) 2023-06-20
CN113450979A (zh) 2021-09-28
US20210304924A1 (en) 2021-09-30

Similar Documents

Publication Publication Date Title
KR102211863B1 (ko) 터치 패널 및 터치 패널의 제조 방법
TWI507940B (zh) 觸控面板及觸控顯示面板
CN104834398B (zh) 触摸面板以及制造触摸面板的方法
TWI483370B (zh) 觸控面板之電極陣列
US10754462B2 (en) Touch screen and touch display device
US20140138141A1 (en) Peripheral circuit structure
TWI613578B (zh) 觸控電極陣列和觸控顯示裝置
JP2022166270A (ja) チップ抵抗器
JP2016528525A (ja) アレイ基板、その製造方法及びフラットパネル表示装置
JP5115968B2 (ja) チップ抵抗器の製造方法およびチップ抵抗器
TWI707366B (zh) 電阻元件
US20180188841A1 (en) Touch screen and touch sensing assembly thereof
TWM597500U (zh) 電阻元件
TWI587193B (zh) 觸控面板
JP3993852B2 (ja) 対称構造を持つサーミスタ
TWI597633B (zh) 避免蝕刻線路顯露的觸控面板
JPWO2018061961A1 (ja) チップ抵抗器
JP2013179212A (ja) チップ抵抗器
TWI629624B (zh) 具靜電防護結構之面板
JP2021086837A (ja) チップ抵抗器
JP2017150830A (ja) 温度センサ
TWI272648B (en) Conductor/dielectric layer/conductor structure preventing dielectric layer deflective crack
TWM600000U (zh) 厚膜電阻元件
CN213659422U (zh) 触控结构和触控显示面板
US20220375657A1 (en) Chip resistor