TWI472065B - 樹脂密封裝置 - Google Patents

樹脂密封裝置 Download PDF

Info

Publication number
TWI472065B
TWI472065B TW101128271A TW101128271A TWI472065B TW I472065 B TWI472065 B TW I472065B TW 101128271 A TW101128271 A TW 101128271A TW 101128271 A TW101128271 A TW 101128271A TW I472065 B TWI472065 B TW I472065B
Authority
TW
Taiwan
Prior art keywords
mold
film
resin
substrate
sealing device
Prior art date
Application number
TW101128271A
Other languages
English (en)
Chinese (zh)
Other versions
TW201316559A (zh
Inventor
Tomitaka Gotanda
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of TW201316559A publication Critical patent/TW201316559A/zh
Application granted granted Critical
Publication of TWI472065B publication Critical patent/TWI472065B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW101128271A 2011-10-07 2012-08-06 樹脂密封裝置 TWI472065B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011222722A JP5387646B2 (ja) 2011-10-07 2011-10-07 樹脂封止装置

Publications (2)

Publication Number Publication Date
TW201316559A TW201316559A (zh) 2013-04-16
TWI472065B true TWI472065B (zh) 2015-02-01

Family

ID=48022317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128271A TWI472065B (zh) 2011-10-07 2012-08-06 樹脂密封裝置

Country Status (4)

Country Link
JP (1) JP5387646B2 (ja)
KR (1) KR101417329B1 (ja)
CN (1) CN103035537B (ja)
TW (1) TWI472065B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814088B (zh) * 2020-11-25 2023-09-01 日商山田尖端科技股份有限公司 樹脂密封裝置及樹脂密封方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6104787B2 (ja) * 2013-12-18 2017-03-29 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
KR101690108B1 (ko) * 2015-10-19 2016-12-28 한미반도체 주식회사 컴프레션 몰딩장치
JP7175869B2 (ja) * 2019-10-03 2022-11-21 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形方法
JP7377189B2 (ja) * 2020-12-14 2023-11-09 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI251885B (en) * 2003-10-30 2006-03-21 Dai Ichi Seiko Co Ltd Resin sealing molding apparatus
TW200842994A (en) * 2007-03-19 2008-11-01 Fujitsu Ltd Resin sealing method, mold for resin sealing, and resin sealing apparatus
TWI338613B (en) * 2007-06-19 2011-03-11 Dai Ichi Seiko Co Ltd Resin sealing apparatus, moving member, and resin sealing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
JP2001291731A (ja) * 2000-04-10 2001-10-19 Mitsubishi Electric Corp 樹脂封止用金型、半導体製造装置及び半導体装置の製造方法
JP3967551B2 (ja) * 2001-02-08 2007-08-29 本田技研工業株式会社 電気二重層キャパシタ容器の蓋体
JP4204221B2 (ja) * 2001-11-30 2009-01-07 アピックヤマダ株式会社 圧縮成形装置
JP4971862B2 (ja) * 2007-04-16 2012-07-11 第一精工株式会社 樹脂封止装置及び樹脂封止方法
JP5038783B2 (ja) * 2007-06-06 2012-10-03 住友重機械工業株式会社 フィルム供給機構
JP4954012B2 (ja) * 2007-10-05 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形用金型
KR100920335B1 (ko) * 2009-04-29 2009-10-07 우리마이크론(주) 반도체 몰딩장치
JP4885260B2 (ja) * 2009-07-08 2012-02-29 第一精工株式会社 樹脂封止装置および樹脂封止方法
JP5403012B2 (ja) * 2011-08-11 2014-01-29 第一精工株式会社 樹脂封止装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI251885B (en) * 2003-10-30 2006-03-21 Dai Ichi Seiko Co Ltd Resin sealing molding apparatus
TW200842994A (en) * 2007-03-19 2008-11-01 Fujitsu Ltd Resin sealing method, mold for resin sealing, and resin sealing apparatus
TWI338613B (en) * 2007-06-19 2011-03-11 Dai Ichi Seiko Co Ltd Resin sealing apparatus, moving member, and resin sealing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814088B (zh) * 2020-11-25 2023-09-01 日商山田尖端科技股份有限公司 樹脂密封裝置及樹脂密封方法

Also Published As

Publication number Publication date
CN103035537A (zh) 2013-04-10
JP5387646B2 (ja) 2014-01-15
KR20130038135A (ko) 2013-04-17
TW201316559A (zh) 2013-04-16
JP2013084709A (ja) 2013-05-09
KR101417329B1 (ko) 2014-07-08
CN103035537B (zh) 2015-06-24

Similar Documents

Publication Publication Date Title
TWI472065B (zh) 樹脂密封裝置
WO2010038660A1 (ja) 電子部品の圧縮樹脂封止成形方法及びそのための装置
CN103182767A (zh) 树脂模塑方法及树脂模塑装置
WO2010047069A1 (ja) 圧縮成形方法及び装置
CN113232312B (zh) 一种坐具海绵自动定位粘合设备及其多层海绵板粘合方法
JP5403012B2 (ja) 樹脂封止装置
WO2018150670A1 (ja) 樹脂封止方法及び樹脂封止装置
CN102148171B (zh) 电子器件的模块化模塑组件
KR101842002B1 (ko) 솔더 커팅 장치
JP3609824B1 (ja) 樹脂封止成形装置
JP4153769B2 (ja) 樹脂封止装置
JP4204221B2 (ja) 圧縮成形装置
CN207308230U (zh) 一种定量点胶机
CN103021917B (zh) 一种物料系统
CN112706342B (zh) 树脂供给机构、树脂成形装置及树脂成形品的制造方法
KR100264239B1 (ko) 리드프레임 몰딩 시스템 및 몰딩 방법
CN203055880U (zh) 一种物料系统
JP4885260B2 (ja) 樹脂封止装置および樹脂封止方法
KR102381073B1 (ko) 방충제 제조용 스탬핑 및 인서팅 장치
CN220963258U (zh) 一种显示面板封装系统
KR100514975B1 (ko) 반도체 패키지 제조 방법 및 장치
JP7444452B2 (ja) 樹脂封止装置及びワーク搬送方法
WO2023105841A1 (ja) 樹脂封止装置及び封止金型
JPH0711968Y2 (ja) パッケージ用蓋体の自動成型装置におけるパッケージ用蓋体の切断、分離装置
KR20090083244A (ko) 칩 본딩 장비

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees