九、發明說明： 【發日月所屬之技術領域】 發明領域 本發明係有關於樹脂密封骏置、移動構件及樹脂密封 方法。 發明背景 歷來，作為樹脂密封裝置，眾所周知者係將安裝有多 數半導體元件之基板以樹脂整個密封後，切斷為各個半導 體元件而獲致半導體裝置，即Μαρ(μ—α_ρ—_IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a resin sealing device, a moving member, and a resin sealing method. Background of the Invention As a resin sealing device, it has been known that a substrate on which a plurality of semiconductor elements are mounted is sealed with a resin as a whole, and then cut into individual semiconductor elements to obtain a semiconductor device, i.e., Μαρ(μ_α_ρ__
Method :矩陣排列封裝法)所採用者。 即’專利文獻1中揭示有-種如下述之構成，即，將於 多數㈣部中炼融之樹脂，由其上方開口部之捲曲而流動 於多數塾>1，並沿著模穴之長邊部分而經錢口充填於模 穴内，以進行樹脂密封。 又，專利文獻2係揭示一種如下述之構成，即，於墊片 收納熱硬化性樹脂片，且令柱塞於各墊片内往上移動，俾 讓薄片的炫融樹脂經漁口而充填於模六内。 進一步，專利文獻3係揭示—種如下述之構成，即，藉 由經切口部而將圓筒狀之樹脂塊供給於墊片，並讓構成墊 片底部之柱塞加以移動，以將熔融樹脂充填於模穴内。 【專利文獻1】日本專利公開公報特開2〇〇〇_12578號 【專利文獻2】日本專利公開公報特開平丨^“乂號 【專利文獻3】日本專利公開公報特平9_232354號 1338613 【明内穷^ 發明揭示 發明欲解決之問題 然而，於專利文獻1中，在捲曲、塾片及洗口固化之樹 脂全部都是不需要之樹脂。因此，有廢棄之樹脂量多之問題。Method : Matrix array encapsulation method). In other words, Patent Document 1 discloses a configuration in which a resin which is smelted in a plurality of (four) portions flows through a plurality of 塾>1 by the curl of the upper opening portion thereof, and is along the cavity. The long side portion is filled in the cavity through the money mouth for resin sealing. Further, Patent Document 2 discloses a configuration in which a thermosetting resin sheet is accommodated in a gasket, and the plunger is moved upward in each of the spacers, so that the molten resin of the sheet is filled through the fishing port. In the mold six. Further, Patent Document 3 discloses a configuration in which a cylindrical resin block is supplied to a gasket through a notch portion, and a plunger constituting a bottom portion of the gasket is moved to melt the resin. Filled in the cavity. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. The present invention discloses a problem to be solved by the invention. However, in Patent Document 1, all of the resins which are cured by crimping, blining and washing are unnecessary resins. Therefore, there is a problem in that the amount of resin discarded is large.
又，後者之樹脂密封裝置令，樹脂材料需直接供給至 塾片，因此需要有自練置“增加作業成本，且作業本 身繁雜。進而’略長方體形狀之樹脂片需另外加以準備。 即，市售之樹脂片的形狀係以圓柱形佔主流，並I略長方 形狀者。因此，必雌·末狀讀㈣料成形為略 長方體形狀以做錢脂片，故需要成形裝置且增加加工作 業時間專’導致成本增加。 進而，專利文獻3中，係構成為讓柱塞滑動地接於塾片 的内側面。因此，將由於長期使用而使得塾片内的殘留樹 15脂附著於柱塞的側面，而有妨礙順暢動作之虞。 因此，本發明之課題在於提供一種樹脂密封裝置，其係 樹脂材料之供給容易，可抑制樹脂密封後不需要之樹脂量而 低價格地成形，並且可長期地於良好狀態下加以使用^。 用以解決問題之手段 20 作為解決前述課題之手段，本發明之樹脂密封裝置係 包含有第1模具、及可相對於該第1模具接合與分離的第2模 具’且藉由將於財禍部中熔融之樹脂，經澆口而充填於以 前述兩模具所形成之模穴内，對於配設於前述兩模具内且 搭載有電子零件之基板進行樹脂密封成形者； 6 則述堆禍部係設置於、+ 間隔位於前述模穴之模具之任一者’並由以預定 朝向開口移動之移動構;:：且該凹部之底面係以可 前述移動構件係呈板狀，”構I 一 有至個與移動方向交又之=至少任一側面上，形成 内。仏、 之祕知係可經澆口而直接充填於模穴 的極！「祕4不需要之樹脂而加以硬化者，係包含澆口 的極小區域。因此， 於將溝部形成在移動構件的t制不需要之樹脂量。又，由 内的… 動構件的側面，故可於溝部回收坩堝部 樹月匕* ，並可長期地實現_動作。再者，將炫融 構二^~脂侵入的内面與移動 之間’亦可藉由溝部而加以回收。 於形成有前述掛禍部之握I . 15 通之樹脂供給通路， …’形成有與前述掛禍部連 於前職脂供給通路，配設有推麵給至該樹脂供給通 内之树脂_並將之供給至前料卿内之推_件. 20 :=構件上，形成於_供給通路側之侧 面^的溝和僅形成於與朝向前述樹脂供給通路之襲部 之連通口的移動區域相隔預定距離之退避區域内。 依此構成’可僅藉由設置㈣構件此_簡單的構成來 進行樹脂材料之供給。又，可相由推匈件進行推壓， 邊讓樹脂材料依次於樹脂供給通路、接著在坩堝a 一 ㈣’因此可實現順暢的充填動作。進而， 件其中一側面上的溝部係僅形成在退避區域内，因此可避 免來自樹脂供給通路之熔融樹脂直接流入溝部。 前述溝部宜至少由與前述移動區域鄰接之第丨凹部、及 與該第1凹部相隔預定距離的第2凹部所形成。 藉此構成，欲由樹脂供給通路侵入坩堝部之内面與移 動構件之側面__之樹脂，係可藉由第丨凹部而加以捕 捉。因此’縱或將形成於第丨凹部與第2凹部之間的平坦部 之尺寸抑制得較小，樹脂亦無法朝第2凹部侵入。由該結 果，可抑制因前述平坦部而無法回收之樹脂量。 _於前述移動構件上，於前述移動方向上宜並列設置有 寬度較前述溝部大之空間部。 錯此構成 ㈣疋無法猎由溝部而完全回收殘留於坩 禍部内的樹脂時，仍可藉由具有足夠大之區域(空間)的空間 部㈣實地進行回收。x，縱或頻繁地清掃移動構件，仍 可藉由空間部而長期地回收樹脂渣。 形成有與前述坩堝部連 於形成有前述掛禍部之模具 通之樹脂供給通路， 取剛返树月曰供給通路，配設有推壓 通路⑽則物機__=== 形成於前述軸構件且在料购旨供 ’ 的溝部係㈣在與細前雜賴給觀二^側之側面 口的移動區域相隔預定距離之退避區域 禍部，連通 離為至少二個凹部。 平坦邛，分 藉此構成，即便炼融樹脂流入凹部，亦可藉由平” 而阻止炫融樹脂流入鄰接之次一凹部。 又，作為解決前述課題之手段，本發明之移動構 構造係設置於第丨模具、及可相對於該第丨模具接合與 =模具之任一者上’且構成以預定間隔位於藉由前:兩 :部=Γ内之_部的底面，並藉由朝向前述坤 之開口移動，使前述坩堝部中熔融之樹脂，可經 而充填於前述模穴内者， 4口 戎移動構件之構造係呈板狀，且於至少任—側面上， I 3有至少_個與移動方向交叉之溝部。 進而 ’作為解決前述課題之手段，本發明之樹脂密 第係設置^模具 '及可相對於該第1模具接合與分離的 1具’且藉由將於_部愤融之樹脂，賤q而充 内^述兩模具所形成之模穴内，對於配設於前述兩模農 且搭載有電子零件之基板進行樹脂密封成形； 、 前述掛禍部係設置於前述模具之任一者 部分構成 有至少 _動構件係呈板狀，且於至少任一側面上， 個與移動方向交又之溝部； 形成 述樹脂密封方法包含有： 樹脂充填步驟，係佶前 充填位置 、^移動構件由待機位置移動至 1 寸恢位置回復步驟 内面的樹脂； 出：=使前述移動構件移—突 清掃步驟’係將接觸構件八 中移動至清掃位置之移動構件置於在前述移動步驟 於前_構件表面上的該接觸構件 一邱八拔+ 朝開口移動之移動構件其中 耗構成’因此可大幅地抑制不需要之樹脂量。又，讓 移動構件為板狀，且於至少任_ , 讓 與移動方向交又之溝部，gJh . ’形成至少-個 留樹# 可於溝部回收㈣部内的殘 9，並可長期地讓移動構件順暢動作。 【實施方式】 用以實施發明之最佳形態 以下參照添_式，說明本發 (第1實施態樣） ⑼樣。 (1下模具組1) 如第2圖及第3圖所示，下模具組i係如下 於滑板3之上方面，大致依次積層有筒形體4、下模具框L 及下模具支座6,且下模具支座6上設置有下模具模㈣7。 心8第圖所示，下模具組1係藉由讓滑板3可於設置在架 -板上往返移動地加以載置而可於上模具組2之下 置及側面位置之間往返移動。即，底板9之上方面設置 s月軌1G '滑板3係可往返移動地配置於該滑軌1〇上。滑 系藉由驅動第1伺服馬’經由滑輪"a及正時皮帶⑽ 而旋轉滾珠螺桿12，俾經螺帽13傳達動力而進行往返移動。 如第3圖所示，滑板3之上方面係配設有支撐板14。支 推板14與筒形體4之間，以及筒形體4與下模具框板5之間， 係分別配設有下模具隔熱板15a、15b。 ίο (1-1筒形體4) 如第3圖所示，筒形體4之上方面係形成有橫剖面為圓 形的凹部4a。活塞16係可升降地枚容於凹部如。又，凹部 4a的上方開口部係以活塞蓋17加以覆蓋而形成液室丨8。活 塞16係以沿著液室18内周面而升降的圓柱形狀之大徑部 15 19 ’以及由其上方面中央部突出之小徑部2〇所構成。大徑 部19係將液室18内分割為上液室18a及下液室18b。液體係 經由形成於凹部4a略中央部之壁面上的貫通孔2〇a，而供給 至上液室18a或加以排出。又，液體係經由形成於凹部4a下 端部壁面上之貫通孔19a ’而供給至下液室18b或加以排 20出。藉此，活塞16係可升降移動。活塞蓋π係於上端具有 鍔部之筒狀者，且前述活塞16之小徑部20係可滑動地貫通 中心之貫通孔。凹部4a之上端開口部附近的内周面係形成 有圓周溝。於圓周溝設置有未圖示之填料’防止來自上液 室18a之液體流出。 1338613 (1-2下模具框板5) 如第3圖所示，下模具框板5係形成有上下面連通之平 面視為矩形狀之開口部21，且連接體22係可升降地配置於 開口部21。連接體22係藉由上下兩片之連接板23a、23b而 5 挾持輔助隔熱板24之三明治構造。活塞16係與輔助隔熱板 24及連接板23b共同藉由未圖示之螺栓，來固定於連接板 23a而一體化。又’多數之連接桿25係藉由未圖示之螺栓而 0 連結於連接板23b之下方面。連接桿25係貫通筒形體4、支 樓板14及滑板3。多數之連接桿25係於下端部一體化，且該 10處設置有鉤狀之接頭27a。如第1圖所示，設置於滑動軸28 之上私部之鉤狀的接頭27b ’係僅由侧面而卡合於接頭 27a。藉此，驅動第2伺服馬達26時，可經由滑輪26a及正時 皮帶26b而讓滑動軸28加以升降，且可經由接頭27a、27b而 讓連接體22進行升降。又，前述接頭27a、27b並不限於鉤 15狀，亦可為其他構成。要點在於接頭27a、27b之構成只要 φ 係讓滑板3於水平方向滑動移動時，下模具模穴塊7在與上 模具模穴塊46相對向之對向位置加以連結，並在非對向位 置加以解除連結即可。 又，如第3圖所示，下模具框體5係内藏有下模具加熱 20益29及下換具測溫電阻器3〇。下模具加熱器29係藉由通電 而經下杈具支座6加熱下模具模穴塊7。對於下模具加熱器 29之通電控制’係、依藉由下模具測溫電阻器綱檢測出的 溫度而進行，以將下模具模穴塊7調溫至預定溫度。 (1-3下模具支座6) 12 5 如第2圓所不，τ模具支座6在下模具框體5之上方面， 成X成為矩形框狀方式加以螺轉固定的四個基體31而構 '於各基體31之兩端部係形成有階梯部川，並藉由短邊 敕土體1B之兩端部挾人長邊側基體^之兩端部，而提高 整體的剛性。 太如第3圖所禾，下模具模穴塊7係於下模具背板32在下 面體化之狀態’可升降地配置於下模具支座^之矩形框Further, the resin sealing device of the latter requires the resin material to be directly supplied to the cymbal sheet, so that it is necessary to have a self-construction "increasing the operation cost, and the operation itself is complicated. Further, the resin sheet having a slightly rectangular shape needs to be separately prepared. The shape of the resin sheet sold is mainly in the shape of a cylinder, and is slightly rectangular. Therefore, the material of the female and the final reading (four) is formed into a slightly rectangular shape to be used as a fat sheet, so that a forming apparatus is required and the processing time is increased. Further, in Patent Document 3, the plunger is slidably attached to the inner side surface of the cymbal sheet. Therefore, the residual tree 15 in the cymbal sheet adheres to the plunger due to long-term use. In view of the above, it is an object of the present invention to provide a resin sealing device which is easy to supply a resin material, can suppress the amount of resin which is not required after resin sealing, and can be molded at a low price, and can be used for a long period of time. Use in a good condition. Means for Solving the Problem 20 As a means for solving the above problems, the resin sealing device of the present invention is packaged. a second mold that includes a first mold and a second mold that can be joined and separated from the first mold, and is filled in a cavity formed by the two molds through a gate by a resin that is melted in the treasury. A resin sealing molding is performed on a substrate provided with the electronic component disposed in the two molds; 6 the stacking portion is disposed at any one of the molds at the interval of the cavity and is opened by a predetermined orientation Moving the moving structure;:: and the bottom surface of the concave portion is formed in a plate shape by the movable member, and the structure I is formed so as to intersect with the moving direction= at least one of the side surfaces to form the inner portion. The secret of 仏, the secret can be filled directly into the pole of the cavity through the gate! "The secret of the resin that is not required by the secret 4 is a very small area including the gate. Therefore, the groove portion is formed in the amount of resin which is not required for the moving member. Moreover, the side of the moving member is It is possible to recover the 树 树 匕 匕 , , , , , , , , , , , , , 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚 坩埚The resin supply passage of the grip portion I. 15 is connected to the front-loading grease supply passage and the resin supplied to the resin supply passage. 20: = member, the groove formed on the side surface of the supply passage side and the movement region formed only at the communication port toward the attack portion of the resin supply passage are separated by a predetermined distance In the retreat area, the resin material can be supplied only by providing the simple structure of the (four) member. Further, the resin material can be pressed by the pusher, and the resin material can be sequentially supplied to the resin supply path. Then in 坩埚a one (four)' therefore Further, since the groove portion on one side of the member is formed only in the evacuation region, the molten resin from the resin supply passage can be prevented from directly flowing into the groove portion. The groove portion should preferably be at least adjacent to the movement region. The recessed portion and the second recessed portion are spaced apart from the first recessed portion by a predetermined distance. With this configuration, the resin that is to be invaded by the resin supply passage into the inner surface of the flange portion and the side surface of the moving member can be formed by the second recessed portion. Therefore, the size of the flat portion formed between the second concave portion and the second concave portion is suppressed to be small, and the resin cannot enter the second concave portion. As a result, the flat portion cannot be suppressed. The amount of resin to be recovered. _ In the moving member, it is preferable to arrange a space portion having a larger width than the groove portion in the moving direction. In this case, (4) when the resin remaining in the trouble portion cannot be completely recovered by the groove portion , can still be recovered in the field by the space part (4) with a large enough area (space). x, longitudinal or frequent cleaning of moving parts, still borrow The resin slag is recovered from the space portion for a long period of time. A resin supply passage that is connected to the mortise portion and is connected to the mold in which the smashing portion is formed is formed, and a returning stalk supply passage is provided, and a pressing passage (10) is disposed. __=== The groove portion (4) formed in the shaft member and which is intended to be supplied with a predetermined distance from the moving portion of the side surface of the front side The at least two concave portions are formed by flattening, and even if the molten resin flows into the concave portion, the molten resin can be prevented from flowing into the adjacent concave portion by the flat. Further, as means for solving the above-described problems, the mobile structure of the present invention is provided in the second die and on either the die bond and the die can be disposed on the first die at a predetermined interval: Two parts: the bottom surface of the _ part of the ,, and by moving toward the opening of the kun, the resin melted in the crotch portion can be filled in the cavity, and the structure of the four-port moving member is The plate is shaped, and on at least any of the sides, I 3 has at least one groove that intersects the moving direction. Further, as a means for solving the above-mentioned problems, the resin-tight system of the present invention is provided with a mold "and a mold which can be joined and separated with respect to the first mold, and the resin which will be melted in the _ part" In a cavity formed by the two molds, a resin-sealed molding is performed on a substrate on which the electronic components are mounted on the two molds; and the hook portion is provided in at least one of the molds. The moving member is in the shape of a plate, and on at least one of the sides, a groove portion intersecting with the moving direction; the resin sealing method is formed by the following steps: a resin filling step, a front filling position, and a moving member moving from the standby position Resin to the inner surface of the step recovery position; the output of the moving member is moved to the cleaning position, and the moving member that moves the contact member to the cleaning position is placed on the surface of the member before the moving step The contact member is a moving member that moves toward the opening, and the consumption thereof constitutes 'therefore, the amount of unnecessary resin can be greatly suppressed. In addition, the moving member is in the form of a plate, and at least _, the groove is intersected with the moving direction, gJh. 'Form at least one of the staying trees#. The residue 9 in the (four) portion can be recovered in the groove portion, and can be moved for a long time. The components move smoothly. [Embodiment] The best mode for carrying out the invention will be described below with reference to the addition of the formula (9). (1 lower mold set 1) As shown in Figs. 2 and 3, the lower mold set i is as follows on the upper surface of the slide plate 3, and the cylindrical body 4, the lower mold frame L, and the lower mold support 6 are laminated in this order. And the lower mold holder 6 is provided with a lower mold (4) 7. As shown in the figure of the center 8, the lower mold set 1 is reciprocally movable between the lower and upper side positions of the upper mold set 2 by allowing the slide plate 3 to be placed reciprocally on the frame-plate. That is, the upper portion of the bottom plate 9 is provided with a s-month rail 1G. The slider 3 is reciprocally disposed on the slide rail 1〇. The slide system rotates the ball screw 12 via the pulley "a and the timing belt (10) by driving the first servo horse, and transmits the power through the nut 13 to reciprocate. As shown in Fig. 3, the upper side of the slider 3 is provided with a support plate 14. The lower mold heat insulation panels 15a and 15b are disposed between the thrust plate 14 and the cylindrical body 4, and between the cylindrical body 4 and the lower mold frame plate 5. Ίο (1-1 cylindrical body 4) As shown in Fig. 3, the cylindrical body 4 is formed with a concave portion 4a having a circular cross section. The piston 16 can be lifted and lowered into the recess, for example. Further, the upper opening portion of the recessed portion 4a is covered with a piston cover 17 to form a liquid chamber 丨8. The piston 16 is composed of a cylindrical large-diameter portion 15 19 ' which rises and falls along the inner peripheral surface of the liquid chamber 18, and a small-diameter portion 2A which protrudes from the upper central portion thereof. The large diameter portion 19 divides the inside of the liquid chamber 18 into an upper liquid chamber 18a and a lower liquid chamber 18b. The liquid system is supplied to the upper liquid chamber 18a or discharged through the through hole 2〇a formed in the wall surface of the central portion of the recess 4a. Further, the liquid system is supplied to the lower liquid chamber 18b or discharged through the through holes 19a' formed in the lower end wall surface of the recessed portion 4a. Thereby, the piston 16 can be moved up and down. The piston cover π is a tubular shape having a crotch portion at the upper end, and the small-diameter portion 20 of the piston 16 slidably penetrates the through hole of the center. The inner peripheral surface in the vicinity of the upper end opening portion of the recessed portion 4a is formed with a circumferential groove. A filler (not shown) is provided in the circumferential groove to prevent the liquid from the upper liquid chamber 18a from flowing out. 1338613 (1-2 lower mold frame plate 5) As shown in Fig. 3, the lower mold frame plate 5 is formed with an opening portion 21 having a rectangular shape in a plane communicating with the upper and lower surfaces, and the connecting body 22 is vertically movable. Opening portion 21. The connecting body 22 holds the sandwich structure of the auxiliary heat insulating panel 24 by the upper and lower connecting plates 23a and 23b. The piston 16 is integrated with the auxiliary heat insulating plate 24 and the connecting plate 23b by bolts (not shown) to the connecting plate 23a. Further, the plurality of connecting rods 25 are connected to the lower side of the connecting plate 23b by bolts (not shown). The connecting rod 25 passes through the tubular body 4, the floor panel 14, and the slide plate 3. Most of the connecting rods 25 are integrated at the lower end portion, and the hook portion 27a is provided at the ten places. As shown in Fig. 1, the hook-shaped joint 27b' provided on the private portion of the slide shaft 28 is engaged with the joint 27a only by the side surface. As a result, when the second servo motor 26 is driven, the slide shaft 28 can be moved up and down via the pulley 26a and the timing belt 26b, and the connecting body 22 can be moved up and down via the joints 27a and 27b. Further, the joints 27a and 27b are not limited to the hook shape, and may have other configurations. The point is that the joints 27a, 27b are configured such that when the yoke slides the slide plate 3 in the horizontal direction, the lower mold cavity block 7 is joined at an opposite position to the upper mold cavity block 46, and is in a non-opposing position. Can be unlinked. Further, as shown in Fig. 3, the lower mold frame 5 houses a lower mold heating 20 and a lower temperature measuring resistor 3 。. The lower mold heater 29 heats the lower mold cavity block 7 via the lower cookware holder 6 by energization. The energization control of the lower mold heater 29 is performed in accordance with the temperature detected by the lower mold temperature measuring resistor to adjust the lower mold cavity block 7 to a predetermined temperature. (1-3 lower mold holder 6) 12 5 As the second circle does not, the τ mold holder 6 is on the lower mold frame 5, and the X becomes a rectangular frame-like four base body 31 which is screwed and fixed. The structure of each of the base members 31 is formed with a stepped portion, and both ends of the short side alumina body 1B are joined to both end portions of the long side base body to improve the overall rigidity. Too much as in Fig. 3, the lower mold cavity block 7 is in a state in which the lower mold back plate 32 is in the lower state, and is disposed in a rectangular frame which is vertically movable to the lower mold support.
於下模具背板32之下方面，係經由下模具支撐插腳B 10 15 配設有連接板34，且下模具背板取連接板_藉由下 〜、連接插腳35而加以連結。又’前述連接體如系藉由未 =螺栓，而固定於連接板34之下方面。再者，定位插 ^36係分別突出設置於下模具模穴塊7之上方面中的三 处，且可藉由卡合於形成在基板上之定位孔而讓基板戰 立。進而’下模具組塊37係分別設置於下模具模穴塊7之上 方面中的三處。下模具組塊37係利用在與後述之上模呈… 的定位上。 、”、 (2上模具組2) 如第4圖及第5Α圖所示’上模具組2係大致上將上模具 框板39固定於上模具夾板38之下方面，且上模具槽4〇係可 拆取地安裝於該處。X，如第7圖所示，上模具夹板％及上 模具框板39係由側緣部大大地内切，於兩端形成朝側部突 出的柄部39a。 (2-1上模具框板39) 上模具框板39係經由上模具隔熱板41而固定於上模具 13 夾板38。上模具框板39係内藏有上模具加熱器“及上模具 測溫電阻器43。此處，係以三列而配置上模具加熱器42， 於各上模具加熱器42之間，且由側面每隔内側二處（總共四 處）便配置—上模具測溫電阻器43。 又，如第7圖所示，上模具槽擋止塊44及上模具槽導承 塊45，係Μ於上模具框板39之下方面而構成上模具組。 模/、槽擋止塊44係沿著上模具框板39之下方面的—邊而 乂配置。上模具槽導承塊45係由上模具槽擋止塊44之兩 Ρ乃別於直角沿著上模具槽39下方面之兩邊而加以配 置於各上模具槽導承塊45之相對向面，係形成有沿著其 長向方向之突條的導引部45a。導引部45a係用以支撐後述 之上模具模穴塊46。 (2-2上模具槽40) 如第5A圖及第5B圖所示，上模具槽4〇係上模具模穴塊 46與樹脂供給塊47 —體化之構成。 (2~2-1上模具模穴塊46) -欠、，上模具模六塊46係由下方面緣部連續形成澆口 48、其 :平面視矩形狀之凹處49。液口 48可採用側涛口、薄膜途 =等各種形態（此錢使用_堯口）。凹處49在關閉模呈 又：係與配置於下模具組1之上方面的基板7〇構成模穴。、 ^4圖所示’上模具纽塊5〇係與設置於前述下模具模 46b係之下模具組塊37對應，分別設置於上模具模穴塊仏。 用以讓上模具組塊50定位之凹部。 如第5A圖所示，於上模具模穴塊46之上方面，係配置 ^38613 乃丄供具支撐插 53。、所〜板 MW模穴體46之約略中心線的五處，以及與：置:沿著 :個角落對應總計為十六處之位置。未圖示=處49的 =出板Μ及插腳板531_貫通上模I:: __ ’讓頂出銷的前端面與凹處49之表面^’㈣ 往上移動。再者，插腳板53係藉由未圖=平面地 10 向下方側之力。藉此，開放模具時，插腳予朝 之勢能而朝下移動，以利用頂出銷而將凹處4= 由彈著 品押出。 处49内之樹脂製 又，如第5B圖所示，邊缴66係固定於上權 之側面。邊墩66係將形成於其側面之突 ：、八6 形成在上模繼想46之端面的漢部 15位，並藉由未圖示之螺栓而固定兩構件。 又、 • (2_2-2樹脂供給塊47) 如第4圖、第5A圖及第5B圖所示，樹脂供給塊ο包含 冑支座54、套筒塊55、套筒56、柱塞扣及柱塞片^。 冑筒座54係在讓其側面與前述上模具模穴塊％之側面 20相接觸之狀態而加以固定。詳言之，如第5B圖所示，將形 成於套筒座54之突條54a，嵌合進形成於固定在上模具模穴 塊46兩端之邊墩66上的溝部66a内，並藉由未圖示之螺栓而 固定兩構件。於套筒座54之側面，在與上模具模穴塊46之 各凹處49對應的位置，係分別形成有溝狀的凹部54c。且該 15 凹部54c與上模具模穴祕的側面構成叫部π。又，於構 成凹部5蚊壁面的中心'，係形成有連通孔54d，且嵌合有 後述之套筒56。再者，於套筒座54使用粉末冶金高速鋼(硬 度：HRC3程度）。 5 纟塞板6〇係於时網部％中升降，如後述，降下時係將 於增禍部59内炼融之樹脂押出模穴。如第15圖所示，柱塞 板60係矩形板狀，且於其下端面附近部分形成有在四側面 連續之溝部60a。該溝部6〇a係用以回收成形時所產生的樹 脂逢。第18圖所示例中，於單面（即供給樹脂塊關之面。 1〇以下稱樹脂供給面pl)，相對於套筒56之中心孔(連通口：以 XI表示内徑尺寸）的移動區域E1(於第18〇))圖中以二點虛線 之斜線表示），清部6〇a係形成在兩側僅相隔預定尺寸χ2之 位置（退避區域E2)。又，溝部6〇a係相對於前述移動方向而 並列設置於三處》並列設置溝部60a之範圍，係相較於柱塞 15板60位在待機位置時之下端面，與套筒座54之上方面之間 的尺寸Y1更短的尺寸Y2(譬如Υ2$Υ1χ2/3)。 又’如第5Α圖所示’柱塞板60之上端連結部60b係連結 於柱塞桿61。柱塞桿61係藉由等壓裝置62而降下，並壓下 柱塞板60。柱塞板60將坩堝部59内的熔融樹脂壓出並朝模 20 穴内充填。此時’熔融樹脂之填充壓力為預設的一定值。 又，於柱塞板60使用高速鋼(硬度：HRC59程度）。 套筒塊55係安裝於套筒座54之側面。即，如第5B圖所 示，和與前述模穴塊46固定時相同地，讓形成於套筒塊55 之突條55a，嵌合於形成在套筒座54之溝部54b内精確地定 16 1338613 位，並藉由未圖示之螺栓來固定兩構件。於套筒塊55，係 形成有與前述套筒座54之連通孔54d相連之連通孔说，且 套筒56嵌合於該處。又，與各連通孔相連通之樹脂投入口 63 ’係分卿成於㈣塊55之上方面。此處，經樹脂投入 5 口 63而技入圓柱狀之樹脂。惟，亦可藉由改變套筒56 之内周面形狀而投入長方體形狀的樹脂塊。又，所供給之 樹脂亦可為顆粒狀。 套筒56係圓筒狀，且散合於前述套筒座54及前述套筒 塊55之連通孔54d、55b。於套筒56，在嵌合於前述連通孔 10 54d、55b之狀態，形成有與樹脂投入口 63相連通之開口部 56a。又，凸緣部56係與開口部56a相鄰接而形成。凸緣部 56b係上下經切裁，且嵌合於套筒座54之連通孔54d時係 定位在形成於該連通孔54d之開口部分的溝部54e内，而可 進行開口部56a與樹脂投入口 63之定位。又，於套筒％使用 15 粉末冶金高速鋼(硬度：HRC68程度）> 柱塞桿57係藉由安裝於設置在上模具組2側部之托座 64上的氣壓紅65，而可在水平方向上往返移動。 如第14圖所示，柱塞片58係圓柱狀且固定於柱塞桿57 之前端，並可沿前述套筒56之内周面而往返移動。於柱塞 20片58前端部附近的外周面，係形成有與前述柱塞板6〇之溝 部為相同功用（樹脂渣之回收）之環狀溝58a。此處，於柱塞 片58使用燒結碳化物(硬度：HRC74程度）。 又，若取代前述氣壓虹65而藉由伺服馬達進行往返移 動，係可調整柱塞片58之移動速度，故可因應樹脂之種類 17 (譬如炫融溫度、熱硬化速度之差異）的適切速度，將樹脂供 給於襲部59内並加以㈣。又，藉由舰馬達而讓柱塞 片58之前端面與柱塞板6〇之前端側面相抵接時，若設置扭 矩限制，係可防止妨礙柱塞板6〇動作之壓力作用。 前述上模具組2係如後述地加以組裝。 即’經上核具隔熱板41而將上模具框板外固定於前述 上模具炎板38，進而，©定上模具槽擋止塊44及上模具槽 導承塊45。且’如第9圖所示’於形成在上模具槽導承塊45 之間的由側部插人上模具槽4Qe上模具卿可藉由 形成於上杈具槽導承塊45之導引部45a，而邊導引導溝 40a，邊順暢地進行水平移動。若可使其水平移動並定位於 預定位置，係可藉由螺旋拴緊等而固定上模具槽4〇。 又’於則述套筒56、套筒座54、柱塞片％及柱塞板6〇 選定具有高硬度之材料’係為提高耐磨耗性，只要是高硬 度者便不限定前述材料。 再者’可以熱導電率低之材料構成套筒座54，並可讓 套筒座54為包含隔熱材之三明治構造。藉此構造，可抑制 給予套筒56内之樹脂材料的熱影響。具體言之，模穴與掛 蜗部59之㈣可給予約2Gt之溫度差1，可阻止炫融樹 脂在填充於模Μ之前便P錢熱硬化，而可有效防止於洗 〇之樹脂阻塞或未填充等的成形不良產生。 進而，若直接於模穴塊46與套筒54設置加熱器，可進 行更進一步之細腻溫度控制。 (動作） 說明由前述構成而組成之 其次，參照第1圖至第9圖 樹脂密封裝置的動作。 預先於上模具加熱器42及下模具加熱㈣通電，藉 此’可將上模具模穴塊46與下模具模穴塊了加埶至田 5度:且驅動第2舰馬軌，讓下模具組i相對於上模具2 而往下移動，讓模具為開放狀。接著，藉由驅動第1伺服馬 達Π，讓下模具組i由上模具組2的正下方位置而往前方側 (第1圖中的右側)移動(此時，亦可藉由未圖示之潔淨裝置來 清潔上模具組2(主要為成形面)）。進—步，藉由未圖示之装 10載機等而供給安裝有半導體元件之基板7〇,並將之安裝於下 楔具模穴塊7之上方面。此時，將基板7〇之定位孔卡合於下 模具模穴塊7之定位插腳36。藉此，可正確地將基板％定位。 若基板70加以置放，則反向驅動第1伺服馬達^，讓下 模具組1移動到上模具組2的正下方位置。且藉由反向驅動 15第2舰馬達26，經連接桿加讓下模具模穴塊？往上移 動。接著，將液體供給於下液室18b，並由上液室心排出液 體，藉此可以預定勤而讓活塞16上升賴賴具。藉此， 基板70係挾持於下模具模穴塊7與上模具模穴塊杯之間。 其次，如第10(a)圖至第1〇(d)圖所示，藉由未圖示之樹 20脂材料供給單元等，經形成於樹脂供給塊47之套筒塊55上 的樹脂投入口 63而供給樹脂塊(此時，所供給之樹脂塊可使 用一般市售之圓柱狀者）。所供給之樹脂塊係位在套筒56 内。因此，驅動氣壓缸65可讓柱塞桿57水平移動，並藉由 设置於其别端之柱塞片58而推壓樹脂塊。經推壓之樹脂塊 1338613 係於套筒56⑽動且達至㈣部59。 套筒56内’接著时蜗部_，均藉由加熱器而充分加 熱因此Μ月曰塊開始炫融。熔融樹脂係受到柱塞片％推壓 而真滿时禍459。柱塞片58係在前端面的一部分與柱塞板 5 60之别端側面相抵接之時點停止移動。 爾後，藉由驅動等壓裝置62，經柱塞桿61而讓柱塞板 60由待機位置降下。此時，前述柱塞# 58之前端面，係相 φ 對於柱塞板60之側面而正確地定位。因此，樹脂不會殘留 於柱塞片58之前端面，可完全地壓下。 10 由該結果，坩堝部59内之熔融樹脂係經澆口 48而朝模 穴内填充。柱塞板60在其前端面降下至高於澆口深度的充 填位置之時點停止。並且讓熔融樹脂熱硬化，而獲得樹脂 成形品。 之後，讓柱塞板60略微上升，分離熱硬化且附著之樹 15脂。又，將液體供給於上液室18a，由下液室18b排出液體 • 且讓下模具組1下降，使模具為開放狀。成形品縱或欲保持 於上模具模穴塊46之凹處4·9，仍因藉由彈簣而給予勢能之 頂出銷而壓下’因此可確實地往下模具模穴塊7之上方面排 出。接著，以未圖示之載卸單元等而保持成形品，並朝外 20 部搬出。 附著且殘留於坩堝部59内面之樹脂以及壓下柱塞板6〇 時’侵入坩堝部59之内面與柱塞板6〇之外面間的熔融樹 脂，係回收至形成於前述柱塞板60上之溝部60a内。惟，本 實施態樣中，形成於樹脂供給面P1之溝部60a，相對於寬度 20 1338613 尺寸XI在套筒56之中心孔移動的區域，即移動區域El，係 形成於僅相隔預定尺寸X2之退避區域E2。因此，柱塞板6〇 升降時，由套筒56之中心孔所供給之樹脂材料不會直接流 入溝部60a ’而可長期地以溝部6〇a進行樹脂回收。 5 又’藉由前述柱塞板60之溝部60a而回收之樹脂，亦可 藉由潔淨裝置而適宜地加以清掃。即，於該清掃動作中， 係驅動等愿裝置62，並讓柱塞板60由填充位置進一步降下Below the lower mold backing plate 32, a connecting plate 34 is disposed via the lower mold supporting pin B 10 15 , and the lower mold backing plate takes the connecting plate _ by the lower to connecting pin 35 to be joined. Further, the aforementioned connecting body is fixed to the lower side of the connecting plate 34 by not being bolted. Further, the positioning inserts 36 are respectively protruded from three of the upper mold cavity blocks 7, and the substrates can be erected by being engaged with the positioning holes formed on the substrate. Further, the lower mold blocks 37 are respectively disposed at three of the upper mold cavity blocks 7. The lower mold block 37 is used for positioning on the upper mold, which will be described later. ", (2 upper mold set 2) As shown in Fig. 4 and Fig. 5', the upper mold set 2 substantially fixes the upper mold frame plate 39 below the upper mold clamp 38, and the upper mold groove 4〇 Removably mounted thereto. X, as shown in Fig. 7, the upper mold plate % and the upper mold frame plate 39 are largely inscribed by the side edge portions, and the handle portions 39a projecting toward the side portions are formed at both ends. (2-1 Upper Mold Frame Plate 39) The upper mold frame plate 39 is fixed to the upper mold 13 by the upper mold heat insulating plate 41. The upper mold frame plate 39 contains the upper mold heater "and the upper mold". Temperature measuring resistor 43. Here, the upper mold heater 42 is disposed in three rows, between the upper mold heaters 42, and the upper mold temperature measuring resistor 43 is disposed from the inner side at two inner sides (four in total). Further, as shown in Fig. 7, the upper mold groove stopper 44 and the upper mold groove guide block 45 are formed below the upper mold frame plate 39 to constitute the upper mold group. The mold/slot stop block 44 is disposed along the side of the upper mold frame plate 39. The upper mold groove guide block 45 is disposed on the opposite side of each upper mold groove guide block 45 by two sides of the upper mold groove stop block 44, which are disposed at right angles along the lower side of the upper mold groove 39. A guide portion 45a is formed with a ridge along its longitudinal direction. The guide portion 45a is for supporting the upper mold cavity block 46 which will be described later. (2-2 Upper Mold Groove 40) As shown in Figs. 5A and 5B, the upper mold groove 4 is formed by the upper mold cavity block 46 and the resin supply block 47. (2~2-1 upper mold cavity block 46) - Under, the upper mold die six 46 pieces are continuously formed by the lower edge portion of the gate 48, which is a rectangular concave portion 49 in plan view. The liquid port 48 can be used in various forms such as side vents, film path = (this money is used _ 尧 mouth). The recess 49 is formed in the closing mold and is formed in a cavity 7 on the substrate 7 disposed on the lower mold group 1. The upper mold block 5 所示 shown in Fig. 4 corresponds to the mold block 37 disposed under the lower mold half 46b, and is respectively disposed on the upper mold cavity block 仏. A recess for positioning the upper mold block 50. As shown in Fig. 5A, on the upper mold cavity block 46, the ^38613 is provided as a support insert 53. The five points of the approximate centerline of the MW cavity body 46, and the:: along: the corner corresponds to a total of sixteen locations. Not shown = at position 49 = exit plate Μ and pin plate 531_ penetrate the upper die I:: __ ' Let the front end face of the ejector pin and the surface ^' (4) of the recess 49 move upward. Further, the pin plate 53 is biased downward by the side of the flat surface 10 . Thereby, when the mold is opened, the pin is moved downward toward the potential energy to push the recess 4 = by the ejector pin. In the case of the resin in the place 49, as shown in Fig. 5B, the 66-series is attached to the side of the upper right. The side pier 66 is formed on the side surface thereof, and the octagonal portion 6 is formed at the 15th position of the Han part of the end surface of the upper mold imaginary 46, and the two members are fixed by bolts (not shown). Further, (2_2-2 resin supply block 47) As shown in Fig. 4, Fig. 5A and Fig. 5B, the resin supply block ο includes a crucible holder 54, a sleeve block 55, a sleeve 56, and a plunger buckle. Plunger sheet ^. The cylinder base 54 is fixed in a state in which the side surface thereof is in contact with the side surface 20 of the upper mold cavity block. In detail, as shown in FIG. 5B, the protrusion 54a formed on the sleeve seat 54 is fitted into the groove portion 66a formed on the side pier 66 fixed to both ends of the upper mold cavity block 46, and is borrowed. The two members are fixed by bolts (not shown). On the side surface of the sleeve holder 54, a groove-like recess 54c is formed at a position corresponding to each recess 49 of the upper mold cavity block 46. And the side surface of the 15 concave portion 54c and the upper mold cavity is called a portion π. Further, a communication hole 54d is formed in the center ' of the mosquito wall surface constituting the recessed portion 5, and a sleeve 56 to be described later is fitted. Further, powder metallurgy high speed steel (hardness: HRC3 degree) is used for the sleeve seat 54. 5 The sluice plate 6 is lifted and lowered in the net portion %. As will be described later, when it is lowered, the resin which is smelted in the septic portion 59 is pushed out of the cavity. As shown in Fig. 15, the ram plate 60 has a rectangular plate shape, and a groove portion 60a continuous on the four side faces is formed in the vicinity of the lower end surface thereof. The groove portion 6a is used to recover the resin generated during molding. In the example shown in Fig. 18, the movement of the center hole (communication port: XI indicates the inner diameter dimension) with respect to the sleeve 56 on the one side (that is, the surface on which the resin block is closed) is referred to as the resin supply surface pl. The area E1 (in the figure 18) is indicated by a two-dot chain line), and the clear part 6〇a is formed at a position separated by a predetermined size χ2 on both sides (retraction area E2). Further, the groove portions 6〇a are arranged side by side in three positions with respect to the moving direction. The range of the groove portions 60a is arranged side by side, compared with the lower end surface of the plunger 15 plate 60 at the standby position, and the sleeve seat 54 The dimension Y1 between the upper sides is a shorter dimension Y2 (such as Υ2$Υ1χ2/3). Further, as shown in Fig. 5, the upper end connecting portion 60b of the plunger plate 60 is coupled to the plunger rod 61. The plunger rod 61 is lowered by the equal pressure device 62 and the plunger plate 60 is depressed. The ram plate 60 presses the molten resin in the crotch portion 59 and fills the cavity of the die 20. At this time, the filling pressure of the molten resin is a predetermined constant value. Further, high speed steel (hardness: HRC 59) is used for the ram plate 60. The sleeve block 55 is attached to the side of the sleeve seat 54. That is, as shown in Fig. 5B, the protrusion 55a formed in the sleeve block 55 is fitted into the groove portion 54b formed in the sleeve seat 54 precisely as in the case of fixing the cavity block 46. 1338613 position, and the two members are fixed by bolts not shown. The sleeve block 55 is formed with a communication hole which is connected to the communication hole 54d of the sleeve holder 54, and the sleeve 56 is fitted thereto. Further, the resin inlet port 63' which communicates with each of the communication holes is formed in the upper portion of the (four) block 55. Here, a cylindrical resin is introduced into the resin by putting 5 ports 63 into the resin. However, it is also possible to insert a resin block having a rectangular parallelepiped shape by changing the inner peripheral surface shape of the sleeve 56. Further, the resin to be supplied may be in the form of pellets. The sleeve 56 is cylindrical and is interspersed with the sleeves 54 and the communication holes 54d and 55b of the sleeve block 55. In the sleeve 56, the opening 56a communicating with the resin inlet 63 is formed in a state of being fitted to the communication holes 1054d and 55b. Further, the flange portion 56 is formed adjacent to the opening portion 56a. The flange portion 56b is cut up and down, and is fitted in the groove portion 54e formed in the opening portion of the communication hole 54d when being fitted into the communication hole 54d of the sleeve seat 54, and the opening portion 56a and the resin inlet port can be opened. 63 positioning. Further, 15 powder metallurgy high speed steel (hardness: HRC 68 degree) is used for the sleeve %> The plunger rod 57 is attached to the pressure red 65 provided on the bracket 64 provided on the side of the upper mold set 2, Move back and forth in the horizontal direction. As shown in Fig. 14, the plunger piece 58 is cylindrical and fixed to the front end of the plunger rod 57, and is reciprocally movable along the inner circumferential surface of the sleeve 56. An annular groove 58a having the same function as the groove of the ram plate 6 (recovering resin slag) is formed on the outer peripheral surface of the tip end portion of the plunger 20 piece 58. Here, cemented carbide (hardness: HRC74) is used for the ram sheet 58. Further, if the servo motor is reciprocated instead of the air pressure rainbow 65, the moving speed of the plunger piece 58 can be adjusted, so that the appropriate speed of the resin type 17 (such as the difference between the melting temperature and the heat hardening speed) can be used. The resin is supplied to the attack portion 59 and is supplied (4). Further, when the front end surface of the ram sheet 58 is brought into contact with the front end surface of the ram plate 6 藉 by the ship motor, if a torque limit is provided, the pressure action which hinders the squeezing operation of the ram plate 6 can be prevented. The upper mold set 2 is assembled as will be described later. That is, the upper mold frame plate is externally fixed to the upper mold plate 38 by the upper core heat shield plate 41, and the mold groove stop block 44 and the upper mold groove guide block 45 are fixed. And 'as shown in FIG. 9', the mold is formed on the upper mold groove 4Qe formed by the upper mold groove guide block 45, and can be guided by the upper cooker guide block 45. The portion 45a is guided by the guide groove 40a while smoothly moving horizontally. If it can be horizontally moved and positioned at a predetermined position, the upper mold groove 4 can be fixed by screwing or the like. Further, the sleeve 56, the sleeve seat 54, the nip piece %, and the ram plate 6 选定 are selected to have high hardness. The wear resistance is improved, and the material is not limited as long as it is high in hardness. Further, the sleeve can be formed of a material having a low thermal conductivity, and the sleeve holder 54 can be a sandwich structure including a heat insulating material. With this configuration, the thermal influence of the resin material in the sleeve 56 can be suppressed. Specifically, the (4) of the cavity and the hanging worm 59 can give a temperature difference of about 2 Gt1, which can prevent the molten resin from being hard-hardened before being filled in the die, and can effectively prevent the resin from being clogged or blocked. A molding failure such as unfilling occurs. Further, if the heater is provided directly to the cavity block 46 and the sleeve 54, further fine temperature control can be performed. (Operation) The description will be made up of the above-described configuration. Next, the operation of the resin sealing device of Figs. 1 to 9 will be referred to. The electric heater 42 and the lower mold are heated in advance (4), so that the upper mold cavity block 46 and the lower mold cavity block can be twisted to the field 5 degrees: and the second ship track is driven, and the lower mold is driven. The group i moves downward relative to the upper mold 2 to make the mold open. Then, by driving the first servo motor Π, the lower die set i is moved to the front side (the right side in the first drawing) from the position immediately below the upper die set 2 (in this case, not shown) The cleaning device cleans the upper mold set 2 (mainly the forming surface). Further, the substrate 7A on which the semiconductor element is mounted is supplied by a 10-carrier or the like (not shown), and is mounted on the lower wedge mold cavity block 7. At this time, the positioning holes of the substrate 7 are engaged with the positioning pins 36 of the lower mold cavity block 7. Thereby, the substrate % can be correctly positioned. When the substrate 70 is placed, the first servo motor 2 is driven in the reverse direction, and the lower mold set 1 is moved to a position directly below the upper mold set 2. And by driving the 15th ship motor 26 in the reverse direction, the lower mold cavity is added via the connecting rod. Move up. Next, the liquid is supplied to the lower liquid chamber 18b, and the liquid is discharged from the upper liquid chamber, whereby the piston 16 can be advanced to allow the piston 16 to rise. Thereby, the substrate 70 is held between the lower mold cavity block 7 and the upper mold cavity cup. Next, as shown in Fig. 10(a) to Fig. 1(d), the resin is formed on the sleeve block 55 of the resin supply block 47 by the resin 20 supply unit or the like (not shown). The resin block is supplied to the port 63 (in this case, a generally commercially available cylindrical member can be used as the resin block to be supplied). The supplied resin block is seated in the sleeve 56. Therefore, the driving pneumatic cylinder 65 allows the plunger rod 57 to move horizontally, and pushes the resin block by the plunger piece 58 provided at the other end thereof. The pushed resin block 1338613 is attached to the sleeve 56 (10) and reaches the (four) portion 59. Inside the sleeve 56, the worm _ is then sufficiently heated by the heater so that the smashing block begins to smash. The molten resin is pressed by the plunger piece % and is 459 when it is full. The plunger piece 58 stops moving when a part of the front end face abuts against the other end faces of the ram plate 5 60. Thereafter, the plunger plate 60 is lowered from the standby position by the plunger rod 61 by driving the equal pressure device 62. At this time, the front end face of the plunger #58 is correctly positioned with respect to the side surface of the ram plate 60. Therefore, the resin does not remain on the front end face of the plunger piece 58, and can be completely depressed. From this result, the molten resin in the crotch portion 59 is filled into the cavity through the gate 48. The ram plate 60 is stopped at a point where the front end face thereof is lowered to a filling position higher than the gate depth. Further, the molten resin is thermally hardened to obtain a resin molded article. Thereafter, the ram plate 60 is slightly raised to separate the heat-hardened and adhered tree grease. Further, the liquid is supplied to the upper liquid chamber 18a, the liquid is discharged from the lower liquid chamber 18b, and the lower mold group 1 is lowered to open the mold. The formed product is longitudinally or intended to be held in the recess 4·9 of the upper mold cavity block 46, and is still pressed by the ejector pin of the potential energy by the magazine. Therefore, it can be surely lowered onto the lower mold cavity block 7. Exhausted. Then, the molded article is held by a loading/unloading unit or the like (not shown), and is carried out toward the outer 20 portions. The resin adhered to the inner surface of the crotch portion 59 and the molten resin between the inner surface of the intrusion crotch portion 59 and the outer surface of the plunger plate 6 when the plunger plate 6 is pressed are recovered to be formed on the plunger plate 60. Inside the groove portion 60a. However, in the present embodiment, the groove portion 60a formed on the resin supply surface P1 is formed in a region where the dimension XI of the sleeve 56 moves in the center hole of the sleeve 56 with respect to the width 20 1338613, that is, the movement region El is formed only by the predetermined size X2. Retreat area E2. Therefore, when the ram plate 6 is moved up and down, the resin material supplied from the center hole of the sleeve 56 does not directly flow into the groove portion 60a', and the resin can be recovered by the groove portion 6a for a long period of time. Further, the resin recovered by the groove portion 60a of the ram plate 60 may be appropriately cleaned by a cleaning device. That is, in the cleaning operation, the device 62 is driven and the plunger plate 60 is further lowered from the filling position.
而定位於清掃位置。且，藉由第17圖所示之潔淨裝置71， 由柱塞板60之表面（包含溝部60a)而除去樹脂。潔淨裝置71 ίο係上方面有開口，且於下方面連接有吸引槽74之箱體72 内，讓一對刷體73對向地加以收容者。依此潔淨裝置71， 藉由旋轉驅動刷體73，係可讓刷體73滑動地接觸於箱體72 内降下而至之柱塞板60的表面，且由柱塞板6〇之溝部6〇a等 刷除樹脂。又，刷除下之樹脂係經吸引槽74而吸引至未圖 15 示之吸引裝置。 又，回收至柱塞片58之溝部58a的樹脂，亦可藉由驅動 氣壓缸65而讓柱塞片58後退，而加以回收。 再者’需清掃模具表面等時，可藉由驅動第⑽服馬達 20 1卜經滾柄桿12沿科油喊下模餘丨於水平方向上 ㈣。藉此，可讓下模馳丨由上模具組2的下方位置往側 邠移動，故易於進行清掃等作業。 40 ^進仃Μ形狀不同之成形時，亦可取下上模具槽 ::包含有上模具模穴塊46之上模具槽4〇替換即可，前 吴具才果穴塊46係形成有可用以形成對應之模穴的凹處 21 1338613 者。藉此，可共用上模具槽40以外的構成構件，故可僅替 換上模具槽40並以便宜之價格來處理各種成形品之加工。 且上模具槽40之交換，係由側部插入形成於上模具槽導承 塊45之間的空間内，且可僅以導引部來導引導溝並加以滑 5 動，故可迅速地應對。 再者’前述實施態樣中’柱塞片58之前進位置，係、< 前端面之一部分與柱塞板60側部相抵接之位置（第丨前進位 置）’但亦可如第16(a)圖所示’在1mm〜2mm前方之位置（第 2位置）停止。此時，柱塞板60之側面，並不需譬如與枝塞 10 片58前端面之一部分相抵接般地加以降下。 且，讓硬化樹脂附著於柱塞片58之前端面，進行第二 次以後的成形時，係可以硬化樹脂之前端面推壓樹脂材料 而將之供給至掛塌部59。依此’柱塞板6〇之側面並不會滑 動地接觸於柱塞片58之前端面，可防止因兩構件間的磨耗 15 所造成的損傷，而可長時間地維持良好狀態。如此，讓硬 化樹脂附著於柱塞片58之前端面的構成中，亦可於才主塞片 58之前端面設置凹凸形狀’或形成作為切除下部之凹部及 切口等，而提高硬化樹脂的附著強度。 又，附著在柱塞片58前端面之硬化樹脂在每—次的成 20形結束時，亦可藉由柱塞板60而加以剝除。即，對桂塞片 58的前端面施行塗覆並進行鏡面加工，藉此，可易於剥除 附著之硬化樹脂。且，如第16(b)圖所示，讓柱塞片58由第2 位置前進到第1位置並降下柱塞板6〇 ’藉此，可去除附著之 硬化樹脂。此時，可開啟模具，回收藉由潔淨裝置71而去 22 1338613 除之硬化樹脂。 再者’刚述實施態樣中，係於上模具形成漁口48、構 成模穴之凹處49，並由設置於上模具之坩堝部％填充樹 脂，但亦可如第13圖所示，將該等構件設置於下模具。 5 (第2實施態樣） 第19圖係顯第2實施態樣之枝塞板8〇之例。此柱塞板 80中，形成於樹脂供給面pi之溝部81係第丨凹部81a及第2凹 部81b所構成，前述第1凹部81a係形成於由前述移動區域 E1，僅距較前述第1實施態樣中之尺寸χ2短的預定尺寸χ3 1〇之位置’進而前述第2凹部81b係形成於由該第1凹部81a僅 相隔預定尺寸X4之位置者。該等凹部係分別形成於前述移 動區域E1的兩側。又，第2凹部8lb係與於剩餘的三側面中 連續之溝部相連。再者，前述溝部81係並列設置於柱塞板 80之升降方向的三處，且其並列設置方向的尺寸γ3，係與 15前述第1實施態樣相同地，較尺寸Y1短地而加以設定。 依前述構成之柱塞板80，進行升降時，係可藉由溝部 81而回收殘留於坩堝部59内面之樹脂。 此時’移動區域E1中，係經套筒56之中心孔而滑動地 接觸於熔融樹脂或固化之樹脂，因此樹脂殘渣不會殘留， 20惟’無法藉由移動區域E1與第1凹部81a間之區域（第19圖中 以尺寸X3所示部分之平坦部），以及第1凹部81a與第2凹部 8lb(第19圖中以尺寸χ4所示部分之平坦部）間之區域加以 回收’而恐有樹脂殘渣殘留於坩堝部59内面之虞。 因此，第2實施態樣中，係藉由盡可能地縮短前述尺寸 23 1338613 X 來抑制無法藉由平坦部進行回收而有殘留之虞的 樹月曰殘/查s惟，若尺寸幻、χ4縮得過短樹脂易由移動 區域k入第1凹部81a，或由第1凹部81a侵入第2凹部 *使付t成平坦部之意義消失因此需為可某程度阻 止樹脂侵人之尺寸。譬如前述尺寸幻係可妓為能夠將朝 向第1凹。P8U之樹脂侵入量，抑制到可接著以潔淨裝置71 加以清掃之容許範圍。 (第3實施態樣） 10 第2嶋顯示第3實施態樣之柱塞板9。之例。此柱塞板 化成於樹脂供給面ρι之溝部91，係由第^凹部仏、 =911>及第3凹部仏組成。分別形成於移動區域E1與 凹部913之間、各凹部9U與91b之間、91b與9U之間的 區域(第20中以尺寸興91c之間的 鋸皆 所不部分的平坦部），係配置成 15 部，純i ’分別形成於並列設置之各溝部91之前述平坦 狀。、=板9〇之升降方向’係配置成至少於-處不重疊 凹部m於樹脂供給面π之溝部9丨中，位在兩端之各 ^第3凹，)，係形成為於柱塞板9〇之剩餘三側面連續 20 而糊似狀置雜塞板％之升降方向 -处’，、並列設置方向的尺寸γ4，係與前 及第2實施態樣相同地，設定為較尺寸们短。實匕樣 依前述第3實施態樣之柱塞板9()，形成於各凹部門之平 坦部，由於在柱塞板9〇之升降方向不重複，因此^是對 ^樹脂供給面P丨，仍可以任—者之凹部而回收殘留於㈣ 。⑼内面之樹脂殘渔。又，移動區域E1與第i凹部仏之間 24 1338613 的尺寸X3，係與前述第2實施態樣相同地較短地設定尺寸， 藉此，可抑制無法回收之樹脂殘漬量。 (第4實施態樣） 第21圖係顯示第4實施態樣之柱塞板1〇〇之例。此柱塞 5 板1〇〇中，於樹脂供給面P1係形成有溝部101與空間部102。 且溝部101係與前述第1實施態樣相同地，以第1凹部10U及 第2凹部l〇lb構成，第2凹部101b於剩餘之三面亦連續地形 成。空間部102係連通樹脂供給面P1及其背面。於柱塞板1〇〇 之背面’係形成有連通前述空間部群之多數條溝部（未圖 10 示）。溝部101與空間部102之寬度尺寸Y5(柱塞板1〇〇之升降 方向的長度），係與前述第1至第3實施態樣相同地，較尺寸 Υ1短地加以設定。 依前述第4實施態樣之柱塞板100，即便是無法完全藉 由溝部101回收的樹脂殘渣’仍可確實地藉由空間部102加 15以回收。空間部1〇2之佔有空間，因相較於溝部1〇1係極大， 因此相較於前述各實施態樣，柱塞板1〇〇之清掃係可以充分 的時間間隔來進行。 又’前述各實施態樣之柱塞板60、80、90、1〇〇中，係 構造成於其升降方向的三處並列設置溝部6〇a、81、91 ' 20 101 ’但其數量不限於三處，一處或二處抑或四處以上均無 妨。即，可配合使用之樹脂的特性而適宜地增減。譬如若 為黏性低的樹脂，宜增加溝部之數量（譬如五列）。 再者，前述實施態樣中，形成於柱塞板、90、1 〇〇 之樹脂供給面P1的溝部，係僅形成於退避區域，但若形成 25 1338613 於各凹部之間的平坦部係形成於退避區域，第1凹部81a、 91a、101a亦可靠近移動區域El或其中一部分位在移動區域 内。此對於熔融樹脂之黏性高而不易流動之情況係為有 效。依此，第1凹部在移動區域E1側之形成精確度即不需太 5 過高，可價格低廉地加以製作。And positioned in the cleaning position. Further, the resin is removed from the surface (including the groove portion 60a) of the ram plate 60 by the cleaning device 71 shown in Fig. 17. The cleaning device 71 has an opening, and is connected to the casing 72 of the suction groove 74 in the lower side, and the pair of brush bodies 73 are accommodated in the opposite direction. According to the cleaning device 71, by rotating the brush body 73, the brush body 73 is slidably contacted with the surface of the plunger plate 60 which is lowered into the casing 72, and the groove portion 6 of the plunger plate 6 is closed. a, etc. to remove the resin. Further, the brushed resin is sucked by the suction groove 74 to the suction device not shown in Fig. 15. Further, the resin recovered in the groove portion 58a of the plunger piece 58 can be recovered by driving the pneumatic cylinder 65 to retract the plunger piece 58. Furthermore, when the surface of the mold or the like needs to be cleaned, the motor can be driven in the horizontal direction by driving the (10) service motor 20 1 through the handle bar 12 (4). Thereby, the lower mold can be moved to the side by the lower position of the upper mold set 2, so that it is easy to perform cleaning and the like. 40 ^ When the shape of the inlet is different, the upper mold groove can also be removed: the mold groove 4 is replaced by the upper mold cavity block 46, and the front Wujicao hole block 46 is formed to be used. Form a recess 21 1338613 of the corresponding cavity. Thereby, the constituent members other than the upper mold groove 40 can be shared, so that only the mold groove 40 can be replaced and the processing of various molded articles can be handled at a low price. And the exchange of the upper mold groove 40 is inserted into the space formed between the upper mold groove guide blocks 45 by the side portions, and the guide groove can be guided and guided by the guide portion, so that it can be quickly responded . Further, in the foregoing embodiment, the position of the plunger piece 58 is advanced, and the position of the front end surface abuts against the side portion of the ram plate 60 (the third forward position), but may also be as the 16th ( a) The position shown in the figure is stopped at the position (second position) in front of 1 mm to 2 mm. At this time, the side surface of the ram plate 60 does not need to be lowered as if it is abutting against a portion of the front end surface of the blade piece 58. Further, when the hardened resin is adhered to the front end surface of the plunger piece 58, and the second and subsequent moldings are performed, the resin material is pressed against the end surface before the resin is cured, and is supplied to the collapsed portion 59. Accordingly, the side surface of the plunger plate 6 is not slidably contacted with the front end surface of the plunger piece 58, and damage due to abrasion between the two members can be prevented, and the state can be maintained for a long period of time. In the configuration in which the hardened resin is adhered to the front end surface of the plunger piece 58, the concave-convex shape or the concave portion and the slit as the cut-off lower portion may be formed on the end surface of the main plug piece 58 to improve the adhesion strength of the cured resin. Further, the hardened resin adhering to the front end surface of the plunger piece 58 can be peeled off by the ram plate 60 at the end of every 20 formation. That is, the front end surface of the cassia plug 58 is coated and mirror-finished, whereby the adhered hardened resin can be easily peeled off. Further, as shown in Fig. 16(b), the plunger piece 58 is advanced from the second position to the first position and the plunger plate 6'' is lowered, whereby the adhered hardened resin can be removed. At this time, the mold can be opened, and the hardened resin is removed by the cleaning device 71 to remove it. Further, in the embodiment, the upper mold forms the fishing port 48, the concave portion 49 constituting the cavity, and the resin is filled in the crotch portion of the upper mold, but as shown in Fig. 13, These members are placed in the lower mold. 5 (Second Embodiment) Fig. 19 shows an example of a branching plate 8 of the second embodiment. In the ram plate 80, the groove portion 81 formed in the resin supply surface pi is formed by the second recessed portion 81a and the second recessed portion 81b, and the first recessed portion 81a is formed in the movable region E1, and is only slightly longer than the first embodiment. In the aspect, the predetermined size of the dimension χ2 is short, and the position of the first recessed portion 81b is formed at a position separated by the predetermined size X4 by the first recessed portion 81a. The recesses are formed on both sides of the moving area E1, respectively. Further, the second recessed portion 8lb is connected to the continuous groove portion of the remaining three side faces. Further, the groove portions 81 are arranged in parallel at three places in the vertical direction of the ram plate 80, and the dimension γ3 in the direction in which the louver plates 80 are arranged in parallel is set to be shorter than the size Y1 as in the first embodiment. . When the ejector plate 80 having the above configuration is lifted and lowered, the resin remaining on the inner surface of the dam portion 59 can be recovered by the groove portion 81. At this time, in the moving region E1, the molten resin or the cured resin is slidably contacted through the center hole of the sleeve 56, so that the resin residue does not remain, and 20 cannot be separated by the moving region E1 and the first recess 81a. The region (the flat portion of the portion indicated by the dimension X3 in Fig. 19) and the region between the first recessed portion 81a and the second recessed portion 81b (the flat portion of the portion indicated by the dimension χ4 in Fig. 19) are recovered. There is a fear that the resin residue remains on the inner surface of the crotch portion 59. Therefore, in the second embodiment, by reducing the size 23 1338613 X as much as possible, it is possible to suppress the stagnation of the shackles that cannot be recovered by the flat portion, and if the size is illusory, χ4 When the resin is shrunk too short, it is easy to enter the first concave portion 81a from the moving region k, or the first concave portion 81a enters the second concave portion*, so that the meaning of the flat portion is eliminated. Therefore, it is necessary to prevent the resin from invading to some extent. For example, the aforementioned size illusion can be made to be toward the first concave. The amount of resin intrusion of P8U is suppressed to the allowable range in which it can be cleaned by the cleaning device 71. (Third embodiment) 10 The second embodiment shows the ram plate 9 of the third embodiment. An example. The nip plate is formed in the groove portion 91 of the resin supply surface ρ, and is composed of a second concave portion =, =911> and a third concave portion 。. A region formed between the moving region E1 and the concave portion 913, between the concave portions 9U and 91b, and between 91b and 9U (the flat portion in the 20th portion of the saw with a size of 91c) In the 15th portion, pure i' is formed in the flat shape of each of the groove portions 91 arranged in parallel. ???==================================================================================================== The remaining three sides of the plate 9 are continuous 20, and the lifting direction of the plug plate is in the same direction, and the dimension γ4 in the direction of the parallel arrangement is set to be the same as the size of the front and the second embodiment. short. The plunger plate 9 () according to the third embodiment described above is formed in the flat portion of each concave portion, and since the lifting direction of the plunger plate 9 is not repeated, the resin supply surface P is , can still be used as a recess, and the residue remains in (4). (9) Residual fish fishing on the inside. Further, the dimension X3 between the moving region E1 and the i-th recessed portion 24 1338613 is set to be shorter in the same manner as in the second embodiment described above, whereby the amount of resin residue that cannot be recovered can be suppressed. (Fourth embodiment) Fig. 21 is a view showing an example of the plunger plate 1 of the fourth embodiment. In the plunger 5, the groove portion 101 and the space portion 102 are formed on the resin supply surface P1. Further, the groove portion 101 is formed by the first recessed portion 10U and the second recessed portion 10b as in the first embodiment, and the second recessed portion 101b is continuously formed on the remaining three sides. The space portion 102 communicates with the resin supply surface P1 and its back surface. A plurality of groove portions (not shown) that communicate with the space portion group are formed on the back surface of the ram plate 1A. The width dimension Y5 of the groove portion 101 and the space portion 102 (the length in the direction in which the plunger plate 1 is moved up and down) is set shorter than the size Υ1 in the same manner as in the first to third embodiments. According to the ram plate 100 of the fourth embodiment described above, even the resin residue "which cannot be completely recovered by the groove portion 101" can be reliably recovered by the space portion 102. Since the space occupied by the space portion 1〇2 is extremely large compared to the groove portion 1〇1, the cleaning of the ram plate 1〇〇 can be performed at a sufficient time interval as compared with the above-described respective embodiments. Further, in the ram plates 60, 80, 90, and 1 of the above-described respective embodiments, the grooves 6 〇 a, 81, 91 ' 20 101 ' are arranged in parallel at three places in the lifting direction. Limited to three, one or two or more than four. That is, it can be suitably increased or decreased in accordance with the characteristics of the resin to be used. For example, if the resin is low in viscosity, it is advisable to increase the number of grooves (for example, five columns). Further, in the above-described embodiment, the groove portion formed on the resin supply surface P1 of the ram plate, 90, and 1 is formed only in the retracted region, but the flat portion formed between the respective recesses is formed by forming 25 1338613. In the retreat area, the first recesses 81a, 91a, 101a may also be located near the moving area E1 or a part thereof in the moving area. This is effective for the case where the viscosity of the molten resin is high and it is not easy to flow. Accordingly, the accuracy of the formation of the first concave portion on the side of the moving region E1 is not too high, and can be produced inexpensively.
【圖式簡單說明J 第1圖係顯示第1實施態樣之樹脂密封裝置之整體構成 的正面剖面圖。 第2圖係下模具組的平面圖。 10 第3圖係第2圖之正面剖面圖。 第4圖係上模具組的底面圖。 第5A圖係第4圖之正面剖面圖。 第5B圖係第4圖之部分分解立體圖。 第6圖係第4圖之側面剖面圖。 15 第7圖係上模具組之底面圖。 第8圖係第7圖之側面圖。 第9圖係顯示將上模具槽安裝於第7圖之上模具組的狀 態之正面圖。 第10(a)〜（d)圖係顯示對於模穴之樹脂充填動作的剖 20 面圖。 第11圖係顯示樹脂密封狀態之部分剖面圖。 第12圖係藉由第11圖之模穴而形成之成形品的立體圖。 第13圖係包含顯示其他形態之模穴部分的預定區域之 剖面圖。 26 1338613 第14圖係顯示柱塞片之前端部分的立體圖。 第15圖係顯示柱塞板之前端部分的立體圖。 第16(a)、（b)圖係顯示以其他方法進行對於模穴的樹脂 充填動作之剖面圖。 5 第17(a)、（b)圖係顯示於第1圖所示之樹脂密封裝置可 採用的潔淨裝置之概略圖。 第18(a)、（b)圖係包含顯示第1實施態樣之柱塞板例的 坩堝部該部分的剖面圖。 第19圖係包含顯示第2實施態樣之柱塞板例的坩堝部 10 該部分的剖面圖。 第20圖係包含顯示第3實施態樣之柱塞板例的坩堝部 該部分的剖面圖。 第21圖係包含顯示第4實施態樣之柱塞板例的坩堝部 該部分的剖面圖。 15 【主要元件符號說明】 1.. .下模具組 2.. .上模具組 3.. .滑板 4.. .筒形體 4a...凹部 5.. .下模具框板 6.. .下模具支座 7.. .下模具模穴塊 8.. .架台 9.. .底板 10.. .滑軌 11.. .第1伺服馬達 11a...滑輪 lib...正時皮帶 12.. .滾珠螺桿 13.. .螺帽 14.. .支撐板 15a，15b...下模具隔熱板 16.. .活塞 17.. .活塞蓋 27 1338613BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front cross-sectional view showing the overall configuration of a resin sealing device according to a first embodiment. Figure 2 is a plan view of the lower mold set. 10 Figure 3 is a front cross-sectional view of Figure 2. Figure 4 is a bottom view of the mold set. Figure 5A is a front cross-sectional view of Figure 4. Fig. 5B is a partially exploded perspective view of Fig. 4. Figure 6 is a side cross-sectional view of Figure 4. 15 Figure 7 is a bottom view of the mold set. Figure 8 is a side view of Figure 7. Fig. 9 is a front elevational view showing the state in which the upper mold groove is mounted on the mold set on the seventh drawing. Figures 10(a) to (d) show a cross-sectional view of the resin filling operation for the cavity. Figure 11 is a partial cross-sectional view showing the sealed state of the resin. Fig. 12 is a perspective view of a molded article formed by the cavity of Fig. 11. Fig. 13 is a cross-sectional view showing a predetermined region showing a cavity portion of another form. 26 1338613 Figure 14 is a perspective view showing the front end portion of the plunger piece. Fig. 15 is a perspective view showing the front end portion of the ram plate. Fig. 16 (a) and (b) are cross-sectional views showing the resin filling operation for the cavity by another method. 5 (a) and (b) are schematic views showing a cleaning device which can be used in the resin sealing device shown in Fig. 1. Figs. 18(a) and (b) are cross-sectional views showing the portion of the crotch portion showing the example of the plunger plate of the first embodiment. Fig. 19 is a cross-sectional view showing the portion of the crotch portion 10 showing the example of the plunger plate of the second embodiment. Fig. 20 is a cross-sectional view showing the portion of the crotch portion showing the example of the plunger plate of the third embodiment. Fig. 21 is a cross-sectional view showing the portion of the crotch portion showing the example of the plunger plate of the fourth embodiment. 15 [Description of main component symbols] 1.. Lower die set 2.. Upper die set 3.. Slider 4.. Cartridge 4a... Recessed part 5.. Lower mold frame board 6.. Mold support 7.. Lower mold cavity block 8.. Rack 9: Bottom plate 10.. Slide rail 11... 1st servo motor 11a... Pulley lib... Timing belt 12. .. Ball screw 13.. Nut 14.. Support plate 15a, 15b... Lower mold insulation board 16.. Piston 17. Piston cover 27 1338613
18.. .液室 18a—L液室 18b...下液室 19.. .大徑部 19a...貫通孔 20.. .小徑部 20a...貫通孔 21.. .開口部 22.. .連接體 23a，23b...連接板 24.. .輔助隔熱板 25.. .連接桿 26.. .第2伺服馬達 26a...滑輪 26b—時皮帶 27a,27b...接頭 28.. .滑動軸 29.. .下模具加熱器 30.. .下模具測溫電阻器 31.. .基體 3 la...階梯部 31A...長邊側基體 31B...短邊側基體 32.. .下模具背板 33.. .下模具支撐插腳 34.. .連接板 35.. .下模具連接插腳 36.. .定位插腳 37…下模具組塊 38.. .上模具夾板 39.. .上模具框板 39a...柄部 40…上模具槽 40a...導溝 41.. .上模具隔熱板 42.. .上模具加熱器 43.. .上模具測溫電阻器 44.. .上模具槽擋止塊 45.. .上模具槽導承塊 45a...導引部 46.. .上模具模穴塊 46a...溝部 46b...凹部 47.. .樹脂供給塊 48.. .澆口 49.. .凹處 50.. .上模具組塊 51.. .上模具支撐插腳 52.. .頂出板 53.. .插腳板 54.. .套筒座 54a...突條 28 1338613 54b...溝部 71...潔淨裝置 54c·.·凹部 72...箱體 54d...連通孔 73...刷體 54e...溝部 74...吸引槽 55...套筒塊 80...柱塞板 55a...突條 81…溝部 55b...連通孔 81a...第1凹部 56…套筒 81b···第2凹部 56a...開口部 90...柱塞板 56b...凸緣部 91…溝部 57...柱塞桿 91a...第1凹部 58...柱塞片 91b...第2凹部 58a...環狀清 91c...第3凹部 59...坩堝部 100...柱塞板 60...柱塞板 101...溝部 60a...溝部 101a…第1凹部 60b...連結部 101b…第2凹部 61...柱塞桿 102...空間部 62...等壓裝置 E1...移動區域 63...樹脂投入口 E2...退避區域 64...托座 M...樹脂材料 65...氣壓缸 P1...樹脂供給面 66...邊墩 Xl,X2,X3,X4...K-t 66a·.·溝部 Y1，Y2，Y3，Y4,Y5...尺寸 70...基板 2918. The liquid chamber 18a - L liquid chamber 18b ... the lower liquid chamber 19 .. the large diameter portion 19 a ... through hole 20 .. the small diameter portion 20 a ... through hole 21.. 22. Connecting body 23a, 23b... connecting plate 24.. auxiliary heat insulating plate 25.. connecting rod 26... second servo motor 26a... pulley 26b-time belt 27a, 27b.. .Connector 28.. Slide shaft 29.. Lower mold heater 30.. Lower mold temperature measuring resistor 31.. Base 3 la... Step portion 31A... Long side base body 31B... Short side base body 32.. Lower mold back plate 33.. Lower mold support pin 34.. Connection plate 35.. Lower mold connection pin 36.. Positioning pin 37... Lower mold block 38.. Upper mold clamping plate 39.. Upper mold frame plate 39a... Handle 40... Upper mold groove 40a... Guide groove 41.. Upper mold heat insulation plate 42.. Upper mold heater 43.. Mold temperature measuring resistor 44.. Upper mold groove stop block 45.. Upper mold groove guide block 45a... Guide portion 46.. Upper mold cavity block 46a... Groove portion 46b... Recessed portion 47.. resin supply block 48.. gates 49.. recess 50.. upper mold block 51.. upper mold support pin 52.. ejector plate 53.. pin plate 54 .. .Sleeve seat 54a...strip 2 8 1338613 54b...groove 71...cleaning device 54c·.recess 72...box 54d...communication hole 73...brush 54e...groove 74...suction slot 55.. The sleeve block 80...the ram plate 55a...the ridge 81...the groove portion 55b...the communication hole 81a...the first recess 56...the sleeve 81b·the second recess 56a...the opening 90... plunger plate 56b... flange portion 91... groove portion 57: plunger rod 91a... first recess 58... plunger piece 91b... second recess 58a... ring Clearance 91c...third recess 59...ankle 100...plunger plate 60...plunger plate 101...groove portion 60a...groove portion 101a...first recess 60b...connection portion 101b...second recess 61...plunger rod 102...space portion 62...equal pressure device E1...moving region 63...resin input port E2...retraction region 64...support M...resin material 65...pneumatic cylinder P1...resin supply surface 66...side pier Xl,X2,X3,X4...Kt 66a·.·groove Y1,Y2,Y3,Y4,Y5 ...size 70...substrate 29