TWI471165B - 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 - Google Patents
長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 Download PDFInfo
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- TWI471165B TWI471165B TW99114870A TW99114870A TWI471165B TW I471165 B TWI471165 B TW I471165B TW 99114870 A TW99114870 A TW 99114870A TW 99114870 A TW99114870 A TW 99114870A TW I471165 B TWI471165 B TW I471165B
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- container
- adsorbent
- monomer
- cabinet
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
本發明一般係關於流體儲存與配送裝置，包括為長方體形狀的流體儲存與配送容器，以及包括此流體儲存與配送裝置的積體氣櫃組件。
近幾年來，以吸附劑為基礎的流體儲存與配送裝置已經使用於半導體製造應用中，以作為用於種種半導體製造單元操作的氣體供應。
此半導體製造操作的實例包括，卻不限於：離子植入，其使用氣體試劑，譬如三氟化硼、砷化氫、磷化氫與二硼烷；含金屬薄膜的化學蒸汽沈積，其係使用種種有機金屬先質試劑氣體；以及矽在絕緣體上(SOI)光電裝置結構的製造，其係利用矽來源試劑，譬如矽烷與矽烷鹽氣體。
在商業上可得到之以吸附劑為基礎的流體儲存與配送裝置，包括可從ATMI,Inc.(Danbury,CT)與Matheson Gas Products,Inc.(Parsippany,NJ)得到，商標SDS與SAGE的氣體來源系統。此系統基本上包括習知的高壓圓筒容器，其係作為固相物理吸附劑媒介所用的容器，該些媒介例如分子濾器(矽酸鋁)、活性碳或其他，對儲存在圓筒容器中並且選擇性地由其配送的流體具有吸附傾向之材料。圓筒容器以吸附劑顆粒之床部的形式來將吸附劑媒介吸住，而且該容器係以吸附氣體裝填，以致於它能夠以基本上非常低於此圓筒習知上儲存氣體所使用的壓力(例如，大約1500-5000托耳(torr)或甚至較高的壓力)而吸附性地留在吸附劑床部上。
因為此壓力程度允許明顯的氣體存貨從容器供應，所以習知技術高壓圓筒則使用實質的超大氣壓力以來儲存氣體。不過，此實質的氣體供應容量係伴隨高壓壓縮氣體儲存之危險與安全問題。因為加壓氣體能快速地釋放到容器周圍，所以在來自故障或損壞閥頭之氣體圓筒破裂或漏損事件中的高壓氣體圓筒，其係包含將氣體激烈排放到周圍環境的風險。這在譬如半導體製造的應用中特別有問題，在此處許多一般使用的試劑與潔淨氣體係為高毒性且對環境有危險，例如，當與大氣接觸時會發火或爆炸。
以上參考型態之以物理性吸附劑為基礎的氣體儲存與配送容器會達到氣體供應系統之安全與功用的實質改善，其乃因為該氣體能以低儲存氣壓而有利地維持於吸附劑床部上，例如400至700托耳的次大氣壓力，或以非常低於將氣體儲存在高壓壓縮氣體圓筒中的壓力。於是，在容器破損或閥頭故障的事件中，排入週遭環境的氣體比例係非常低，例如當在容器中吸附劑床部上所含有的氣體維持在次大氣壓力時的擴散排出。由於其提高的安全特徵，以吸附劑為基礎的氣體儲存與配送容器係相應地由比習知高壓壓縮氣體圓筒所需要之更簡單與成本更少的封鎖物(containment)所容納，以在輸送與使用期間內，監視並支援安全系統。
當使用以物理性吸附劑為基礎的氣體儲存與配送系統時，配送則藉由達成自固持於圓筒內部體積的物理吸附劑媒介去吸附(desorption)氣體而實施，使得該釋放的氣體接著可自容器流出。
去吸附可藉由壓力差而產生，藉此將比容器內部壓力低的壓力設置於容器外。另一選擇，或除此之外，去吸附可由加熱物理吸附劑媒介而產生，以打斷吸附氣體與物理吸附劑媒介之間的低結合鍵。因為仍進一步的配送形式，載體氣體可流經氣體圓筒容器的內部體積，以便將濃度差施加在吸附的氣體上，以影響吸附氣體之質量傳遞到載體氣流內，以接著從具有貫通流載體氣體的容器配送。
習知高壓壓縮氣體儲存與配送所使用，且迄今以物理性吸附劑為基礎的氣體儲存與配送系統所使用的氣體圓筒容器，其係以它的名稱，即基本上由鋼鐵或其它金屬合金來形成，具有上頸開口圓筒形容器來表示。閥頭組件係例如藉由焊接、銅銲或類似方法而耦合到頸開口，且包括流動控制閥於包含流動通道的閥頭塊中，主動閥元件係配置於流動通道中，其如期望地選擇性開啟與關閉，以使試劑流體自氣體圓筒容器的內部體積釋放流出。
該閥頭可能包括一手動輪、自動閥促動器或者其它結構性元件，以來操作該閥。該閥頭基本上是以排出面上的流體連接器來製造，或者以其他構件來裝置，以將例如流線、導管、歧管等耦合到閥頭，以使氣體能夠從容器流經閥頭與耦合到使用軌跡的流動路徑。該閥頭可能隨意地包括額外的通道與其中的孔洞，例如，以將該容器充填以吸附劑媒介，以將安裝吸附劑的床部充填以可吸附的氣體，以清洗該容器，以在預處理中將容器裡的吸附劑媒介烘乾，而且該閥頭可能整合或者耦合到合適的配送、監視、測試設備與控制裝置，以如期望地用來操作氣體儲存與配送系統。
上述型態的流體儲存與配送裝置係完整地描述於頒佈給GlennM. Tom與James V.McManus的美國專利第5,518,528號中，其之揭示乃於此以參考的方式併入本文。
已經使用於商業上之以物理性吸附劑為基礎的低壓氣體儲存與配送系統的容器，已連續為習知使用於高壓壓縮氣體儲存與配送裝置的重金屬圓筒型。在以吸附劑為基礎系統中之重金屬圓筒持久使用，係可歸因於許多因素。
此圓筒容器已經使用超過100年，其係並且一般由遍及全球的管理權所認可，以用來儲存、傳遞與配送氣體。這些容器可簡單地得到，並且可由大量製造商所大量製造。他們相對地便宜並且廣泛地被接受。
有關這些因素的事實是因為所儲存氣體的體積是壓力的函數，所以起因於他們最小區域(亦即圓形)截面形狀的圓筒容器則能夠以相對於其他幾何結構的最小應力與變形來容納所含氣體的升高壓力水平。以符合安全考量的最高壓力來使用此些容器則已常用，以將容器中的氣體存貨最大化。因為圓筒容器會為了高壓氣體負荷而「過度設計(overdesigned)」，所以此等容器已被視為安全封裝。再者，在包含有毒與危險氣體處，管理條例則已託管於此種安全封裝。
為了所有這些原因，重金屬圓筒容器已經為用於以物理性吸附劑為基礎之氣體儲存與傳送系統的標準封裝。除此因素外，此容器具有種種相關缺陷則是為人所認知的。由於他們過度設計的特徵，圓筒壁是厚的，而且由於以鋼或其它結構金屬製造，故此容器相對於較輕量之物品會具有明顯的重量，且因此花費輸送成本。再者，重圓筒容器係為垂直豎立延長形式，其具有一般>>1的長度對直徑比率，並因此龐大且笨重地不利於移動、安裝且改變。
因此，在此技藝中，則引人注目地需要一種新的且改善的以物理性吸附劑為基礎之氣體儲存與配送系統的封裝。
在一態樣中，本發明係關於一種流體儲存與配送裝置，其包含具有內部體積的流體儲存與配送容器，其中該內部容器包含吸收性地留住一流體的物理吸附劑，而且該流體可自該吸附劑釋放(desorbable)，以自該容器配送，而且一配送組件則耦合到該容器，以將自該容器釋放的流體配送，其中該流體儲存與配送容器係為長方體形式。
本發明的另一態樣係關於氣櫃組件，包含：一氣櫃，定義一密封的內部體積並且包括流動路徑於該內部體積內，其係配置來從該櫃配送氣體；以及一氣體源，配置於該氣櫃的內部體積並且以氣體供應的關係耦合到流動路徑，其中該氣體源包含長方體形式的至少一流體儲存與配送容器，各流體儲存與配送容器包含吸附性地吸住該氣體於其上的物理吸附劑，而且配送組件則耦合到該流體儲存與配送容器，以配送該氣體，從該容器流動到該流動路徑。
本發明的進一步態樣係關於一種減少氣櫃組件足跡(footprint)的方法，包含一氣櫃，該氣櫃包含一氣體源，該氣體源包括至少一氣體儲存與配送容器，該容器包含吸附性地吸住該氣體於上的一物理吸附劑，該方法包含將該各個至少一氣體儲存與配送容器提供作為具有長方體型式的容器。
本發明的仍進一步態樣係關於一種以低壓儲存並且配送氣體的方法，包含：製造具有長方體型式的容器；配置一物理吸附劑於對該氣體具有吸附傾向的容器中；填充該氣體到該容器，以吸附於該物理吸附劑上；以包含可促動閥的閥頭來將該容器密封，以將物理吸附劑與所吸附的氣體封住，並且將其與容器的外部環境隔離；將吸附到的氣體自物理吸附劑釋放，並且將閥頭中的促動閥促動，以將氣體從容器流經促動閥，以用於氣體配送。
在另一態樣中，本發明係關於一種在半導體製造設備的排氣洗滌器上減少流動負擔的方法，該製造設備包含一通氣的氣櫃，而通風的氣體則當操作氣櫃時會流經該氣櫃，該方法包含在通風氣體自氣櫃排出以前，將該通風氣體接觸氣櫃的洗滌媒介，以移除可洗滌的污染物，並且自氣櫃排出予以洗滌的通風氣體，從而將藉由該半導體製造設備的排氣洗滌器來處理排氣通風氣體的處理需求消除。
本發明的又另一態樣乃關於氣櫃組件，包含：一排氣的氣櫃，其定義一密封的內部體積並且包括於該內部體積內之流動路徑，其係配置以從該櫃配送製程氣體；一製程氣體源，配置在氣櫃內部體積並且以氣體供應到流動路徑的關係來耦合；一通風氣體源，配置以將通風氣體饋給到通風氣櫃；一通風氣體排氣口，用來排放來自通風氣櫃的通風氣體；以及一使用點(point-of-use)洗滌器，其係配置在通風氣櫃的內部體積，其係配置以在將通風氣體從通風氣櫃經由通風氣體出口而排出之前，將可洗滌的污染物自通風氣體移除。
本發明的其它態樣、特徵與具體實施例將由接踵而來之揭露與附加之申請專利範圍而更完整明瞭。
本發明係依據以物理性吸附劑為基礎之流體儲存與配送裝置可能使用具有長方體構造的流體儲存與配送容器來製造的揭露，至於釋放製程的性質與範圍，可在容器中之物理吸附劑媒介得到的封裝密度，以及包含半導體製造操作用之此種容器之流體儲存與配送裝置的效用上，本發明則具有令人驚訝與意外的優點。
借由解釋本發明流體儲存與配送裝置裡長方體構造容器之意想不到的優點為背景，使用長方體構造來作為以物理性吸附劑為基礎的流體儲存與配送系統則最初予以考慮為高度不利，其乃因為：(Ⅰ)假如容器各面是一隔開部份的話，那麼長方體容器則具有製造所需的六面與十二焊接線(相比之下，圓筒容器則可能在沒有由於管狀滾製鋼塊而產生縫的情形下形成)；(Ⅱ)與(Ⅰ)一致的，長方體構造容器的製造成本將令人希望實質高於相應的圓筒容器；(Ⅲ)一長方體構造，包含在相鄰垂直向牆壁接合處上的「尖銳」角落，其係提供在接合線上形成裂縫的可能性，其中相對於相應圓筒幾何結構的容器，吸附劑床部將不會對著該角落而「封裝」(其係缺乏此種角落，反而卻是畫出該容器之內部體積裡物理性吸附劑材料床部界線的最小截面面積形狀)；以及(Ⅳ)相對於「無縫」的圓筒容器，兩彼此垂直牆的交會處會產生一接合處，該接合處易受施加於上之壓力或力所引起的破裂影響。
不過，申請者已經發現到，長方體構造會導致一種容器，該容器在靠近相鄰牆交會處的接縫處，真的具有較不緊貼的封裝吸附劑床部區域，但其非為缺點，由於具有供空隙釋放或未吸附氣體用之自大部分吸附劑床部體積流出的較高氣體流傳導路徑，故此較低密度的吸附劑床部區域實際上則是有好處的。
再者，正好因為圓筒形容器是截面面積最小的構造，其具有外接牆壁區域的最小圓周範圍，而〝存在〞於圓筒狀容器之牆壁的吸附劑數量則予以最大化。相反之下，在長方體結構中，截面接附(鄰近)吸附劑床部之牆壁的圓周範圍比在圓筒容器中還大很多。因為連接吸附劑床部的牆壁表面具有非吸附性的特徵，所以長方體結構於是使排出該容器的氣體體積比排出對應尺寸大小之圓筒容器的氣體體積還高，而且在吸附床部外面邊緣上，長方體構造容器的會相稱地比圓筒狀容器的還多。結果，在牆壁區域脫去的氣體會比在吸附劑床部內部部份釋放的氣體，在其最初自吸附劑媒介脫去釋開(release)之後，更不能予以重新吸附。
再者，長方體構造具有特別的功效，以用來以整體形式吸住吸附劑，其係例如在J.D.Carruthers與本案共同申請且一同審理中的美國專利申請案「具有單體碳吸附劑的氣體儲存與配送系統」所揭露出的型態。如在此文章脈絡中使用的，「單體」意味著吸附劑媒介是單一或者像塊狀那樣的形式，對比於習知精細分割的形式，譬如珠子、顆粒、細粒、彈丸與類似物，其係一般以包含複數個此種珠子、顆粒、細粒、彈丸等等的床部形式來使用。因此，以複數個精細分割之物理性吸附劑元件的床部形式，活性吸附劑的空隙體積係在主部份空隙或者中間顆粒，如所預料的，其係根據吸附劑顆粒的尺寸、形狀與封裝密度而變化。相較之下，活性吸附劑的裂縫體積係成吸附劑材料固有的多孔以及可能在製程期間內可能形成於大塊吸附劑體部的裂縫形式。
在一具體實施例中，本發明係關於一長方體容器，其定義一密封的內部體積並且具有耦合到氣體配送組件的一孔洞，以用來將氣體自容器選擇性地排出。長方體容器包含合適形式的吸附劑媒介，例如提供充分容量給期望數量氣體的吸收保留，在脫去情況下提供良好的氣體脫去釋放，提供具有良好傾斜行為的良好作業容量(亦即，最初吸附氣體的高程度釋放)，以及對所關注氣體具有一適當吸附傾向的形式，以致於在其中氣體的儲存期間內，將低氣體壓力維持於該容器的內部體積。
物理吸附劑因此可以是分離的形式，例如小珠、彈丸、環、小片、小塊、圓筒狀擠物、微粒、立體形狀、模製幾何規則或不規則形狀、或者任何其它形式，該任何形式係當配置於長方體容器內部體積時，有用地施加到吸附劑媒介，其係在此應用來固定儲存於此容器裡並且從該容器選擇性地配送的氣體。
當以此分離形式來提供時的物理吸附劑，其係以此種形式質量的形式來使用，如吸附劑媒介的床部。以應用於該容器之特定形狀分離形式的質量傳送考量與封裝因素為基礎，此分離型式的尺寸可簡易地決定用在本發明特定目的使用之應用。
或者，物理吸附劑可能是單體形式，包含塊狀物、磚塊狀物、鑲嵌物、或尺寸與長方體容器相稱的類似形式吸附劑材料，以致使該容器包含一個或小數目，例如小於75，更佳地係小於20個分離的單體顆粒。在進一步的較佳態樣中，該容器包含不超過8個此種分離的單體顆粒，甚至更較佳地不超過四個此種顆粒，最佳地，該容器含有單一單體物理性吸附顆粒。
部署在該長方體容器中的單體顆粒提供一吸附劑質量(合計地，假設該吸附劑以複數個單體顆粒形式來提供的話)，該吸附劑質量在尺寸與形狀上符合長方體容器的內部體積，以致於單體顆粒的吸附劑質量佔長方體容器內部體積的至少60%，較佳地是從該容器內部體積的大約75%至大約95%。
假如以單一單體形式來提供的話，吸附劑媒介可能為了此種目的而形成於容器的原來位置裡，例如藉由為液體或其它可流動形式之有機樹脂的熱分解，而該容器則在該容器之有機樹脂熱分解以前填滿。
假如以複數個單體顆粒形式來交替提供的話，此些顆粒的每一個均具有在0.3倍與1.0倍此容器內部體積高度的長度，以及0.1倍與0.5倍容器矩形截面面積之間的截面面積。各單體元件較佳地具有將容器內部體積之體積使用最大化的長方體形狀，其中各單體元件可能水平與/或縱向地緊鄰、表面接觸該容器內部體積中相鄰的單體元件。或者，在某些情形中，吸附劑單體元件可期望為固體圓筒的形式，而個別的圓筒元件則裝載於內部體積內，以沿著他們所面對的側表面而切線地彼此緊鄰，並且至少在它們圓形截面端表面上面對面接觸地部份彼此緊鄰。
在本發明氣體儲存與配送裝置中氣體儲存與配送容器的長方體形狀，其係使該容器適應安裝與氣櫃中的封鎖，譬如在半導體製造設施中所廣泛使用者，其係將氣櫃中所浪費的體積最小化。這會達到與習知圓筒容器有關的實質好處，該些容器則藉由它們的圓形截面而產生鄰近牆壁以及氣櫃之其它長方體與方形元件的空間浪費，該些元件係鄰近或緊鄰氣體儲存與配送容器。
再者，當將複數個容器部署在氣櫃並且以並排方式來排列時，習知圓筒容器的圓形截面則會在氣櫃內部產生明顯的空間浪費，反之，本發明的長方體容器可以並排的關係來排列，而它們相鄰的側牆表面則彼此緊鄰接觸或者非常靠近，以將氣櫃內部所浪費空間的存在與數量最小化。
相對於習知圓筒狀容器，在本發明氣體儲存與配送裝置中的長方體容器因此則會達成氣櫃內未用過空間的明顯減少。結果，比起習知技術可能的圓筒容器，有更多的氣體可儲存在具有本發明容器之氣櫃的相同內部體積裡。這接著減少當操作氣櫃時，容器改變的頻率，其係進一步將當改變耗盡氣體供應容器時所消耗的操作時間減少，並且進一步減少氣櫃設備所有者的成本。圖1之長方體容器所填滿體積的空間為3.62公升，而在氣體盒中佔用相同物理位置的習知圓筒容器，其填滿體積的空間則僅僅為2.2公升。此外，相同供應氣體存貨的氣櫃則可使之更小，從而將對氣櫃安全所必需產生之通風所需要的氣櫃與氣流的足跡減少。
如在此所使用的，名稱「氣櫃」與「氣體細工傢俱(gas cabinetry)」指的是至少一氣體供應容器所使用的密封物。該密封物可裝置流動路徑，包括管道、歧管、氣門、質量流動控制器、壓力與溫度監視裝置，而且該密封室可能予以通風，其係包含來自密封室外部之潔淨乾燥空氣來源(CDA)的潔淨乾燥空氣流，而通風排氣則排放到部署密封室之設備的房屋排氣處理系統，或者不然的話，當作再循環流動氣體地處理以及再循環經過該密封室。
在具體應用中的密封室可能是半導體製程工具的元件部件，譬如在離子植入系統中的氣體盒。
該密封室可配置來容納一單一氣體供應容器，或者它可配置來容納一容器陣列，例如2或3或更多個容器，其中各個皆可部署來提供相同或不同的氣體，而且其中該容器可能以任何合適的方式而與流動路徑耦合，例如當將來自現有已準備容器的氣體耗盡時，與流動路徑所切換到之密封室的支援容器耦合，其乃藉由密封室中合適的監視與控制元件，譬如在一預定時間，或者在一個或更多個監視製程情況處於預定設定點範圍的時間內，連接到微處理器控制器並且配置以操作已準備容器的循環計時器。
在本發明氣體供應裝置中的長方體容器，其係可以任何適當的方式來製造，例如藉由薄層金屬的焊接或者薄層金屬塊的擠壓成形。該金屬可能為任何適當的型態，包括鋼、不鏽鋼、鋁、銅、黃銅、青銅或者其它金屬或金屬合金。或者，該容器可藉由類似技術或其它技術來形成，例如超音波焊接、熔化焊接、雷射焊接等等，其係源自聚合材料、陶瓷材料、玻璃與玻璃體材料，以及具有適合氣體儲存與配送容器之結構材料特色的合成材料，例如具有該容器之氣體封鎖作用的充分低滲透性。
該容器係適當地製造具有一孔洞於一面上，例如在該容器的頂面上，而該閥頭或者其它配送組件則可以密封(leak-tight)的方式連接到該容器頂面，例如藉由合適的焊接與密封技術以及該容器與該配送構件之特定材料所相稱的材料。在將該閥頭接合到該容器以前，該容器可經由該開口而充填以微粒狀的吸附劑，或者該容器可在附加最後牆壁元件之前以安裝單體形式的吸附劑來形成，或者該單體吸附劑可如先前所述地形成於原來的位置。
一旦安裝在容器後，吸附劑媒介則可立即地以其他方式來除氣(degassed)或者預先處理，譬如藉由熱處理、壓力化/去壓力化循環、或其它方法。該吸附劑氣體則在最後封裝以前充填到該容器，而且在此充填過程中的容器則可能譬如藉由階梯式地(step-wise)充填而冷卻或者熱處理，以將吸收的熱消散。
充填過的容器隨後則例如藉由閥頭的關閉而密封，之後，充填過的氣體供應容器則可適當地儲存、輸送或者使用。
現在參考圖式，圖1係為根據本發明具體實施例之長方體流體儲存與配送容器10的透視圖，其係具有焊接到該容器頂面的導管閥連接閥頭12與把柄14。在一特定具體實施例中的容器10係形成有焊接的鋼牆結構，其沿著該容器的垂直(縱向)軸係具有一方形截面。該容器的牆壁係為0.100英吋厚的碳鋼，而且該容器的內部體積則為3.62公升。把柄14係為1/4英吋的桿材料，其係形成為如圖所示的形狀，並且焊接在該容器10的個別端點上。
該導管閥連接閥頭12的配送閥係藉由11
/2
〞導管螺紋連接而與該容器10螺旋地嚙合。該閥頭可能具有任何合適數目的孔洞，例如單孔閥頭、雙孔閥頭、3孔閥頭等等。
圖2係為根據本發明另一具體實施例之長方體流體儲存與配送容器10的透視圖，其具有凸緣型閥連接閥頭12A與焊接到容器10頂面的把柄14。圖2的閥頭因而不同於圖1所示者，相對於圖1所示的導管型連接，其具有在圖2具體實施例中的凸緣型連接。圖2所示的凸緣型連接包含具有拴到容器10頂面之O環槽溝的凸緣元件。
圖1與圖2之具體實施例中的氣體儲存與配送容器的內部體積含有吸住吸附性氣體的物理吸附劑媒介，而當此電路耦合閥頭而且閥頭的閥開啟以使吸附性氣體脫出以及去吸附性氣體從容器排放到流動路徑與下游耗氣製程。吸附性氣體可從吸附性材料去吸附，而以任何適合的方式排出，包含例如以壓力調解的釋放、以熱調解的釋放及/或以濃度梯度調解的釋放。
下游的耗氣製程可能是任何合適的型態，例如半導體限於離子植入、藉由不同於離子植入、化學蒸汽沈積、反應性離子蝕刻、光阻殘餘物移除之摻雜。
吸著物氣體同樣亦可為任何合適的型態，經由實例包括，但未侷限於砷、磷化氫、三氟化氮、三氟化硼、三氯化硼、二硼氫化物、脂肪胺、四甲基矽烷、二矽乙烷、矽乙烷、鍺烷、有機金屬氣體狀試劑、硒化氫、碲酸氫與類似物。吸附性氣體在型態上可廣泛地改變，其係取決於所使用的物理吸附劑媒介以及使用脫去與配送氣體的最終目的應用。
吸著物氣體可以任何合適的壓力而容納於容器中，包括次大氣壓力、大氣壓力與超大氣壓力。所儲存流體的壓力可能是次大氣壓力，例如不超過700托耳的次大氣壓力，以用於本發明的摻雜與離子植入應用。例如，離子植入氣體，譬如砷、磷與三氟化硼，其係可能儲存在壓力範圍從約400到約700托耳的容器中。在本發明種種具體應用中，氣體可能儲存在實質大氣壓力或者低超大氣壓力，例如不超過約1500托耳之壓力的容器中。
圖3A-3B提供圖2所示長方體流體儲存與配送容器型態的前視圖，其係顯示該結構的詳情。圖3A顯示不具有一蓋子的一容器，其包含至少一牆壁17，該牆壁17限制一內含吸附劑材料16的內部體積。圖3B顯示圖3A的容器，其中該容器係由一具有相關的閥組件14的一蓋子封閉。如圖所示，氣體儲存與配送容器包含配置有物理吸附劑16的內部體積。物理吸附劑可能為任何適合的型態，包括碳、活性碳、金屬浸注碳、分子篩選(鋁矽酸鹽)材料、多孔矽、矽土、鋁、苯乙基二乙烯基苯聚合材料、吸著黏土、官能性燒結玻璃媒介等等。如圖3A-3B所示，物理性吸附劑16包含一凹洞19，其中該閥14的一向下延伸部份14A可被容納。
物理性吸附劑亦可以是適合在所應用之特定應用中氣體儲存與配送系統使用的任何適合形式。吸著物媒介可能是分離形式，譬如小珠、細粒、小丸等等，或者它可能是上述的單體形式。
該容器係裝置以凸緣型閥連接閥頭12A，其具有藉由O環密封物18而以漏出-緊密的方式而固定到該容器之頂部牆壁的凸緣元件，而且該把柄則藉由銲接到該容器的頂部牆壁而固定。
在長方體型儲存與配送容器結構的另一變化中，圖3顯示設置有隨意蓋13的容器。以圖式形式來描述的蓋子13，其係亦為長方體形狀，並且在蓋子的個別側面上設有開口15。當設有此蓋子時的容器，其係可在沒有圖3所示之把柄的情形下予以製造，或者，把柄可在蓋子13上予以製造。蓋子13上的開口15設一把柄結構，其係使全部的容器組件能夠手動地控制並且輸送，而且此些開口同樣能夠通到閥頭12A，例如以用來將配送線耦合到該閥頭的排氣口。
蓋子13可以任何適合的方式而固定到在圖3修改容器結構中的容器體部，例如藉由在容器體部與蓋子上的互補嚙合耦合元件，藉此蓋子與容器體部可機械式地彼此互連，例如插接型耦合、螺旋嚙合纏結耦合、機械結件耦合(閂鎖型耦合、螺栓及螺帽型耦合等等)、彈簧偏置壓縮配合耦合等等。
蓋子同樣提供使閥頭免於碰撞、接觸其它結構或體部的壓縮/拉緊力、以及擁有傷害閥頭或修補其實用性之潛力之與其它物件的其它互動。
該蓋子可進一步設有一把柄元件，焊接或不然連結到蓋子13，例如連結到其側表面，或者以其他方式固定到蓋子。
由於仍進一步的替代物，該容器組件可包括個別的蓋子與把柄元件，其係均個別地耦合到容器體部。
由於根據本發明所設計之流體儲存與配送裝置的具體實例，顯示且參考圖3而說明的裝置型態，其係以具有4.5英吋×4.5英吋截面的容器來製造。該容器的高度是12.3英吋，而該容器的牆壁與地板厚度則是0.188英吋。該容器係由焊接的盒管形成。該容器可以凸緣的O環密封頂板或者焊接的頂板來製造。
凸緣的O環密封頂板配置可以具有中間開口之適當厚度的頂板來實施，例如大約0.61英吋。例如Viton 彈性體的O環，其係繞著中間開口的周圍而放置，而且閥插入環隨後則固定在該開口的適當位置。該閥插入環包括一上碟部份，其係向下地依賴比上碟部份直徑還小的插塞部份，該插塞部份緊密地安裝在頂板的中心開口內，其具有O環在上碟部份下側與頂板上表面之間。
該容器蓋子具有一扭轉與鎖住機制，其具有一彈簧活塞鎖住鑰匙，其包括瘦長的細縫於蓋子底座以及三個肩狀的螺栓。當使用時，將蓋子底座的瘦長細縫在三個肩狀的螺栓上擠壓向下，轉動15度以嚙合螺栓，而且該鎖住插拴之後則避免進一步的轉動，並且將蓋子固定放置在容器上。或者，該容器蓋子具有一直接的附加物與兩個鎖住插拴。
蓋子側牆壁開口(圖3中的開口15)係為3英吋×3英吋的開口，而且塑膠手柄墊可固定到該開口的上緣，以促進該裝置手動控制的控制能力。
所顯示裝置的容器係為是拉製心床部(DOM)方形截面導管，其係可具有銳90角的圓角，方形截面的導管係由焊接的導管塊所形成，其具有消失在冷牽拉製程中的焊接。此冷牽拉製程的結果係為在一端關閉且在其相對端開啟的無縫方形截面導管。在將單體吸附劑插入於方形截面導管內部體積之後，頂板係銲接到牽引方形截面導管的開啟端。當蓋子為插接蓋設計時，頂板可具有一NPT螺紋，以容納閥頭組件與肩狀接腳，以容納該蓋子。
在所示裝置中的容器可由鍛造的鋁、鋼、或其它合適的結構材料來形成。該頂板可由相同或不同的結構材料來形成。
如上所述，根據本發明所設計的流體儲存與配送裝置，其係以對習知技術中所習知使用的圓筒容器提供實質改善的方式，而有用地配置於氣櫃中。至於習知氣櫃的長方體幾何結構，藉著它們的長方體形狀，本發明容器可以保角的方式而使用於氣櫃中。藉由符合氣櫃的形狀(亦即，具有與氣櫃側邊牆成面對面緊鄰，或者甚至鄰接的關係之流體儲存與配送裝置的牆壁)，在本發明的實施中係可避免歸屬於圓筒容器的「體積耗損」。
圖4係為根據本發明進一步態樣所設計之氣櫃組件的概略圖式，其係包含具有內部體積30的氣櫃20，其中配置有長方體氣體儲存與配送容器50與52，以作為根據本發明所建構之個別氣體儲存與配送裝置的元件。
包括氣體儲存與配送容器50的氣體儲存與配送裝置具有一閥頭48，其係與自動閥促動器44耦合，並且可操作，以開啟閥頭48中的閥，以將來自容器50之予以釋放的吸著物氣體流入連接到歧管線24的分支排氣線34。
自動閥促動器44係由信號輸送線46連接到中央處理單元(CPU)58，其係可能包含一般目的的可程式電腦，其係可程式化地配置以經由某目的之自動閥促動器44的促動，而在氣櫃系統的預定操作期間內，實施將氣體從容器50配送之操作，以及藉由在線46中輸送到自動閥促動器44的適當信號而關掉在閥頭48中的氣體流控制閥。
因此，從容器50配送的氣體會經由閥頭48與排氣線34而流動到與氣體流配送調節器36耦合的歧管線24，其係並且最後排氣到與氣體流配送調節器36耦合的排氣線38中。氣體流配送調制器36係藉由信號傳輸線60而耦合到CPU58，以根據下游的耗氣製程的氣體需求來調制氣體流配送調節器36(未示於圖4)。
圖4氣櫃組件亦可包括相應配置的氣體儲存與配送容器52，其係裝置以藉由信號輸送線66而耦合到CPU58的閥頭54與自動閥促動器56，藉此來自容器52的氣體可用與上述包含容器50之氣體儲存與配送裝置的相同方式而選擇性地在分支排氣線22上流動到與氣體流配送調節器36耦合的歧管線24。
在圖4的氣櫃組件中，氣體儲存與配送容器50與52係以彼此並排相鄰的關係來排列，容器50係對著氣櫃20的邊牆而鄰接地安放，而且兩容器50與52對著氣櫃20的背牆鄰接地安放。
當使用本發明以物理性吸附劑為基礎的氣體儲存與配送系統時，氣櫃組件可藉由將基本上用來使來自氣櫃之排氣流動到半導體製造設備排氣系統的導管刪除而能材料性地簡化，該組件基本上包括大型洗滌器，用來處理該設備的排氣氣流。因為本發明之以物理性吸附劑為基礎的氣體儲存與配送系統是一低壓氣體供應系統，所以從氣櫃中受損或故障閥頭、耦合件等等的潛在排氣率則會最小化，而且譬如經過櫃子內部體積之CDA的旋刮氣體流動率，其係可與使用習知技術高壓圓筒之氣櫃系統有關地顯著降低。
在本發明另一態樣中，以物理性吸附劑為基礎的氣體儲存與配送系統的提高安全性可利用來排除到排氣洗滌系統的管道，並且適當地使用氣櫃本身的簡單使用點洗滌器，以確保將從氣櫃中所排出排氣的任何低程度污染物移除。
此使用點洗滌器的說明性具體實施例係圖式地顯示於圖4的氣櫃系統。如圖所示，進氣線25將CDA或任何旋刮氣體輸送到氣櫃20內，以清淨氣櫃的內部體積30，以致於氣櫃中任何有毒或危險的污染物能夠從內部體積排掉，並且不會積聚到接近明確危險成分之極限值(TLV)的任何程度，該些明確危險成分可能牽連進包含氣櫃之氣體源容器的氣體配送操作。
該氣櫃係裝置在具有使用點氣體洗滌器61的櫃子20內部體積30裡，該洗滌器吸收來自內部體積30的排氣並且使之與合適的洗滌媒介接觸，例如與氣體污染種類起反應的化學吸附物，以移除到可檢測與有毒的濃度以下。氣體洗滌器61可能如所示地牆裝在櫃子的邊牆上。與洗滌器媒介接觸的氣體係從排氣排出線63的櫃子20排出。
雖然概略性地圖示是為了使顯示與說明容易，但是將理解到的是，該洗滌器可以任何適合的方式來部署，例如以一小洗滌器單元在氣櫃之氣板文氏管裝置的入口(低壓側)上。在排氣排出線63上的氣體可能通到房屋排氣的導管，越過房屋排氣洗滌器，並從而減少房屋洗滌器上的氣體負擔，而至於從氣櫃排出的氣體特徵卻能維持高度安全。
在使用於圖4具體實施例的使用點洗滌器中，洗滌器可裝置以終端檢測器，以確定洗滌器材料的終點(亦即是，起因於在氣櫃廣泛使用之反應性消耗洗滌器材料的排氣方法)。種種型態的終點檢測則可予以應用。
在第一型態的終點檢測器中，當洗滌器是當它接觸氣體櫃排氣的目標污染物種類時改變顏色之型態的時候，觀測玻璃可予以併入洗滌器中，例如藉由將其安裝在洗滌器罩室或容器的窗戶開口中。最初洗滌器媒介的耗盡可由氣櫃操作者視覺上操作，而且以新鮮洗滌器媒介來取代耗盡材料之洗滌器媒介的改變，其係可有效地安排當作經由視覺玻璃來例行檢測洗滌器媒介的部分程式。
第二種終端檢測器使用一比色法感應器，以自動地檢測洗滌器媒介的色彩變化並且促動一警報器或者報導，以通知操作個人改變洗滌器的需要。感應器亦可配置以關掉氣櫃中的流動閥，以避免操作重新開始，直到洗滌器媒介改變為止。
毒性氣體偵測器(TGM)，其係亦可在決定終點的第三方法中，整合入洗滌器單元的體部。此方法能在使用點洗滌器單元中所使用的洗滌器媒介接觸到目標氣體污染物種類而沒有顯示顏色改變之處有用地使用。
第四端點決定技術應用一可程式邏輯控制器(PLC)單元，以計算自從安裝洗滌器單元起之氣體儲存與配送容器的改變數目，並且促動警報或播報構件，以提供表示改變洗滌器單元之需求的輸出。PLC單元可配置以算出洗滌器所接觸到、來自單一氣體儲存與配送容器以及來自輸入洗滌器媒介容量的氣體量，而在洗滌器媒介耗盡之前進行的氣體儲存與配送容器改變的數目則可予以決定。
將理解到的是，本發明的合成物與方法可能以符合其中廣泛揭露的寬廣改變方式來實施。於是，當在此已經參考特定特徵、態樣與具體實施例，而將本發明說明於其中時，將令人理解到的是，本發明並沒有受到限制，但卻容許以其他改變、修改與具體實施例來實施。於是，本發明傾向於廣泛地解釋為包含在本發明申請專利範圍內的所有此種變化、更改與具體實施例。
10．．．長方體流體儲存與配送容器
12．．．導管閥連接閥頭
12A．．．凸緣型閥連接閥頭
13．．．蓋子
14．．．把柄
14A．．．一向下延伸部份
15．．．開口
16．．．吸附劑材料
17．．．牆壁
19．．．凹洞
20．．．氣櫃
22．．．歧管線
24．．．歧管線
25．．．進氣線
30．．．內部體積
34．．．排氣線
36．．．氣體流配送調節器
38．．．排氣線
44．．．自動閥促動器
46．．．信號輸送線
48．．．閥頭
50、52．．．長方體氣體儲存與配送容器
54．．．閥頭
56．．．自動閥促動器
58．．．中央處理單元(CPU)
60．．．信號傳輸線
61．．．使用點氣體洗滌器
63．．．排氣排出線
66．．．信號輸送線
圖1係為根據本發明一具體實施例之長方體流體儲存與配送容器以及導管閥連接的透視圖。
圖2係為根據本發明一具體實施例之長方體流體儲存與配送容器以及凸緣型閥連接的透視圖。
圖3A係為圖2所示型態之長方體流體儲存與配送容器的一部份之前視截面圖，該容器包含吸附劑材料而不具有蓋子。圖3B提供和圖3A相同的視圖，該容器係由一蓋子加以封閉，該蓋子具有一相關的閥組件，其包含自該蓋子向下延伸的部份。
圖4係為根據本發明進一步態樣之氣櫃組件的略圖，其具有根據本發明之多重長方體流體儲存與配送容器配置於其中。
10．．．長方體流體儲存與配送容器
12．．．導管閥連接閥頭
14．．．把柄
Claims (25)
- 一種長方體形狀或固體圓筒形狀的單體吸附劑，該單體吸附劑具有多孔性而適於吸附性地吸住氣體於其上，及在釋放的情況下自其上將氣體釋放性地釋開。
- 如申請專利範圍第1項所述之單體吸附劑，該單體吸附劑具有吸附於其上的流體。
- 如申請專利範圍第1項所述之單體吸附劑，該單體吸附劑包含：一熱解材料(pyrolyzed material)。
- 如申請專利範圍第3項所述之單體吸附劑，其中該熱解材料包含碳。
- 如申請專利範圍第1項所述之單體吸附劑，該單體吸附劑被容納於一流體儲存與配送容器。
- 如申請專利範圍第5項所述之單體吸附劑，其中該單體吸附劑佔該流體儲存與配送容器的內部體積的60%至約95%。
- 一種流體-吸附劑的互相作用製程(fluid-adsorbent interactive process)，該製程包含：吸附在該吸附劑上的氣體及/或釋放來自該吸附劑上的氣體，其中該吸附劑包含申請專利範圍第1項之該單體吸附劑。
- 如申請專利範圍第7項所述之製程，其中該製程進一步包含：使用該氣體於半導體製造。
- 如申請專利範圍第7項所述之製程，其中該單體吸附劑係在一容器中，且佔該容器的內部體積的60%至約95%。
- 一種氣櫃，該氣櫃適於在其中容納如申請專利範圍第5項和第6項之任一項的至少一流體儲存與配送容器。
- 如申請專利範圍第10項所述之氣櫃，具有一長方體幾何，而其中該至少一流體儲存與配送容器的一壁，與該氣櫃的一壁具有互相面對關係或鄰接關係。
- 如申請專利範圍第10項所述之氣櫃，其中該至少一流體儲存與配送容器包含一氣體，該氣體係由砷(arsine)、磷化氫(phosphine)、硒化氫(hydrogen selenide)、碲酸氫(hydrogen telluride)、三氟化氮(nitrogen trifluoride)、三氟化硼(boron trifluoride)、三氯化硼(boron trichloride)、二硼氫化物(diborane)、三甲基矽烷(trimethysilane)、四甲基矽烷(tetramethylsilane)、二矽烷(disilane)、矽烷(silane)、鍺烷(germane)與有機金屬氣體狀試劑(organometallic gaseous reagents)組成的群組選出。
- 一種製造一氣體源套件之方法，包含以下步驟：導入一吸附性材料至一容器的一內部體積，該容器的第一端口封閉，且其一第二端口打開；以及在導入該吸附性材料至該容器的該內部體積後，焊接一頂板元件至該容器的該第二端口，以封閉該內部體積。
- 如申請專利範圍第13項所述之方法，進一步包含以下步驟：固定一流體配送組件至該頂板元件。
- 如申請專利範圍第14項所述之方法，進一步包含以下步驟：裝填一氣體至該氣體源套件以用於該吸附性材料上的吸附。
- 如申請專利範圍第13、14，或15項所述之方法，其中該吸附性材料係單體形式。
- 如申請專利範圍第16項所述之方法，其中該吸附性材料係一熱解材料。
- 如申請專利範圍第17項所述之方法，其中該熱解材料包含碳。
- 如申請專利範圍第16項所述之方法，其中該容器係一無縫隙容器。
- 一種製造一氣體源套件之方法，該方法包含以下步驟：焊接一頂板元件至一容器的一開口端，及經由在該頂板元件的一開口，導入一吸附性材料至該容器的一內部體積。
- 如申請專利範圍第20項所述之方法，進一步包含以下步驟：固定一流體配送組件至在該頂板元件的該開口。
- 如申請專利範圍第21項所述之方法，進一步包含以下步驟：裝填一氣體至該氣體源套件以用於該吸附性材料上的吸附。
- 如申請專利範圍第20、21，或22項所述之方法，其中該吸附性材料係一熱解材料。
- 如申請專利範圍第23項所述之方法，其中該熱解材料包含碳。
- 如申請專利範圍第20項所述之方法，該容器係一無縫隙容器。
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| TW96129730A TWI330238B (en) | 2002-12-09 | 2003-11-24 | Fluid storage and dispensing vessel,fluid storage and dispensing apparatus, gas cabinet assembly,semiconductor manufacturing process,and method of fabricating a gas source package |
| TW92132880A TWI326750B (en) | 2002-12-09 | 2003-11-24 | Rectangular parallelpiped fluid storage and dispensing apparatus, gas cabinet assembly,method of reducing footprint of a gas cabinet assembly,method of providing or using a vessel for storing and/or dispensing a gas at low pressure,and method of reducing |
| TW99120878A TWI442970B (zh) | 2002-12-09 | 2003-11-24 | 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 |
| TW103142215A TWI618569B (zh) | 2002-12-09 | 2003-11-24 | 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 |
| TW99114870A TWI471165B (zh) | 2002-12-09 | 2003-11-24 | 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 |
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| TW96129730A TWI330238B (en) | 2002-12-09 | 2003-11-24 | Fluid storage and dispensing vessel,fluid storage and dispensing apparatus, gas cabinet assembly,semiconductor manufacturing process,and method of fabricating a gas source package |
| TW92132880A TWI326750B (en) | 2002-12-09 | 2003-11-24 | Rectangular parallelpiped fluid storage and dispensing apparatus, gas cabinet assembly,method of reducing footprint of a gas cabinet assembly,method of providing or using a vessel for storing and/or dispensing a gas at low pressure,and method of reducing |
| TW99120878A TWI442970B (zh) | 2002-12-09 | 2003-11-24 | 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 |
| TW103142215A TWI618569B (zh) | 2002-12-09 | 2003-11-24 | 長方體形狀的單體吸附劑、流體－吸附劑的互相作用製程、氣櫃、及製造氣體源套件之方法 |
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| US (6) | US6991671B2 (zh) |
| EP (2) | EP1569737A4 (zh) |
| JP (4) | JP2006512542A (zh) |
| KR (2) | KR101129787B1 (zh) |
| CN (2) | CN100482318C (zh) |
| AU (1) | AU2003293070A1 (zh) |
| MY (1) | MY149780A (zh) |
| SG (4) | SG10201509509PA (zh) |
| TW (5) | TWI330238B (zh) |
| WO (1) | WO2004052487A2 (zh) |
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