TWI469198B - Substrate cleaning apparatus, substrate cleaning method, manufacturing apparatus of display device, and manufacturing method of display device - Google Patents

Substrate cleaning apparatus, substrate cleaning method, manufacturing apparatus of display device, and manufacturing method of display device Download PDF

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Publication number
TWI469198B
TWI469198B TW101104712A TW101104712A TWI469198B TW I469198 B TWI469198 B TW I469198B TW 101104712 A TW101104712 A TW 101104712A TW 101104712 A TW101104712 A TW 101104712A TW I469198 B TWI469198 B TW I469198B
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TW
Taiwan
Prior art keywords
substrate
cleaning
liquid
cleaned
oxide film
Prior art date
Application number
TW101104712A
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English (en)
Chinese (zh)
Other versions
TW201239972A (en
Inventor
寺門秀晃
安藤佳大
西部幸伸
廣瀨治道
山元良高
田中康一
田中潤一
Original Assignee
芝浦機械電子裝置股份有限公司
夏普股份有限公司
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Application filed by 芝浦機械電子裝置股份有限公司, 夏普股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201239972A publication Critical patent/TW201239972A/zh
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Publication of TWI469198B publication Critical patent/TWI469198B/zh

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Classifications

    • H10P72/0414—
    • H10P70/27—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW101104712A 2011-02-25 2012-02-14 Substrate cleaning apparatus, substrate cleaning method, manufacturing apparatus of display device, and manufacturing method of display device TWI469198B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011040170A JP5690168B2 (ja) 2011-02-25 2011-02-25 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法

Publications (2)

Publication Number Publication Date
TW201239972A TW201239972A (en) 2012-10-01
TWI469198B true TWI469198B (zh) 2015-01-11

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ID=46693302

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101104712A TWI469198B (zh) 2011-02-25 2012-02-14 Substrate cleaning apparatus, substrate cleaning method, manufacturing apparatus of display device, and manufacturing method of display device

Country Status (4)

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JP (1) JP5690168B2 (enExample)
KR (1) KR101373784B1 (enExample)
CN (1) CN102651327B (enExample)
TW (1) TWI469198B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065026A (ja) * 2012-09-10 2014-04-17 Panasonic Corp 表面処理装置及び表面処理方法
JP6329342B2 (ja) * 2013-06-07 2018-05-23 株式会社ダルトン 洗浄方法及び洗浄装置
JP6268410B2 (ja) * 2013-09-27 2018-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101607521B1 (ko) 2014-07-08 2016-03-31 세메스 주식회사 기판 처리 장치 및 방법
CN110544647A (zh) * 2018-11-06 2019-12-06 北京北方华创微电子装备有限公司 金属互连清洗装置及清洗方法
CN109616551B (zh) * 2018-11-19 2021-02-09 横店集团东磁股份有限公司 一种多晶表面有机物不良电池片返工工艺
CN110473773B (zh) * 2019-08-22 2022-03-22 北京北方华创微电子装备有限公司 晶圆清洗方法及晶圆清洗设备
KR102404528B1 (ko) * 2019-09-02 2022-06-02 세메스 주식회사 노즐, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
CN110676153A (zh) * 2019-09-20 2020-01-10 常州捷佳创精密机械有限公司 太阳能电池、臭氧溶液施加装置及太阳能电池的制备方法
JP2024134798A (ja) * 2023-03-22 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及びその装置
JP2024143699A (ja) * 2023-03-30 2024-10-11 高周波熱錬株式会社 キャリアフィルムの洗浄方法及び洗浄装置

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TW201145380A (en) * 2010-04-28 2011-12-16 Toshiba Kk Semiconductor substrate surface treatment method
TW201145379A (en) * 2010-03-09 2011-12-16 Tokyo Electron Ltd Substrate processing device, substrate processing method, and storage medium
TW201205674A (en) * 2010-06-08 2012-02-01 Hitachi Int Electric Inc Method of manufacturing a semiconductor device, method of cleaning a process vessel, and substrate processing apparatus

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JPH0226658A (ja) * 1988-07-15 1990-01-29 Matsushita Electric Works Ltd 微細気泡発生ノズル
JP2820275B2 (ja) * 1989-07-17 1998-11-05 富士通株式会社 洗浄装置
JP3660391B2 (ja) * 1994-05-27 2005-06-15 株式会社東芝 半導体装置の製造方法
JP2760418B2 (ja) * 1994-07-29 1998-05-28 住友シチックス株式会社 半導体ウエーハの洗浄液及びこれを用いた半導体ウエーハの洗浄方法
JP4208056B2 (ja) * 1997-06-13 2009-01-14 忠弘 大見 洗浄方法
JP2000040682A (ja) * 1998-07-23 2000-02-08 Sumitomo Metal Ind Ltd 半導体基板の洗浄方法及び洗浄装置
JP2000091291A (ja) * 1998-09-11 2000-03-31 Memc Kk シリコンウエハの洗浄方法
JP4675448B2 (ja) * 1999-06-01 2011-04-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体基板の洗浄方法
JP2001284316A (ja) * 2000-03-30 2001-10-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3998005B2 (ja) * 2004-04-30 2007-10-24 セイコーエプソン株式会社 液晶表示装置の製造装置
JP2006289240A (ja) * 2005-04-08 2006-10-26 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
JP2008098430A (ja) * 2006-10-12 2008-04-24 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2009000595A (ja) * 2007-06-19 2009-01-08 Dainippon Screen Mfg Co Ltd ウエット洗浄装置および基板洗浄システム
JP5540351B2 (ja) * 2008-02-07 2014-07-02 独立行政法人産業技術総合研究所 半導体ウエハの洗浄方法および洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201145379A (en) * 2010-03-09 2011-12-16 Tokyo Electron Ltd Substrate processing device, substrate processing method, and storage medium
TW201145380A (en) * 2010-04-28 2011-12-16 Toshiba Kk Semiconductor substrate surface treatment method
TW201205674A (en) * 2010-06-08 2012-02-01 Hitachi Int Electric Inc Method of manufacturing a semiconductor device, method of cleaning a process vessel, and substrate processing apparatus

Also Published As

Publication number Publication date
CN102651327B (zh) 2014-11-12
JP5690168B2 (ja) 2015-03-25
KR20120098412A (ko) 2012-09-05
TW201239972A (en) 2012-10-01
CN102651327A (zh) 2012-08-29
KR101373784B1 (ko) 2014-03-13
JP2012176353A (ja) 2012-09-13

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