TWI464820B - 用以將半導體晶片安裝於基板上之方法 - Google Patents

用以將半導體晶片安裝於基板上之方法 Download PDF

Info

Publication number
TWI464820B
TWI464820B TW097138530A TW97138530A TWI464820B TW I464820 B TWI464820 B TW I464820B TW 097138530 A TW097138530 A TW 097138530A TW 97138530 A TW97138530 A TW 97138530A TW I464820 B TWI464820 B TW I464820B
Authority
TW
Taiwan
Prior art keywords
camera
coordinate system
image
semiconductor wafer
mark
Prior art date
Application number
TW097138530A
Other languages
English (en)
Chinese (zh)
Other versions
TW200929425A (en
Inventor
史提芬貝勒
派屈克布勒辛
Original Assignee
歐瑞康組件設備史坦胡森有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐瑞康組件設備史坦胡森有限公司 filed Critical 歐瑞康組件設備史坦胡森有限公司
Publication of TW200929425A publication Critical patent/TW200929425A/zh
Application granted granted Critical
Publication of TWI464820B publication Critical patent/TWI464820B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097138530A 2007-10-09 2008-10-07 用以將半導體晶片安裝於基板上之方法 TWI464820B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH01136/08A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.

Publications (2)

Publication Number Publication Date
TW200929425A TW200929425A (en) 2009-07-01
TWI464820B true TWI464820B (zh) 2014-12-11

Family

ID=40908817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097138530A TWI464820B (zh) 2007-10-09 2008-10-07 用以將半導體晶片安裝於基板上之方法

Country Status (7)

Country Link
JP (1) JP5258068B2 (https=)
KR (1) KR101503556B1 (https=)
CN (1) CN101861637B (https=)
CH (1) CH698334B1 (https=)
DE (1) DE112008002467B4 (https=)
MY (1) MY155097A (https=)
TW (1) TWI464820B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
KR20170030548A (ko) * 2014-06-11 2017-03-17 유니버셜 인스트루먼츠 코퍼레이션 정확도를 확립, 확인 및/또는 관리하기 위한 테스트 디바이스
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
KR102196105B1 (ko) * 2016-02-01 2020-12-30 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
CN110612258B (zh) * 2017-05-11 2021-06-15 村田机械株式会社 输送系统以及输送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置
CN116528580A (zh) * 2023-05-09 2023-08-01 深圳康桥信息科技有限责任公司 自适应高精度芯片贴片装置及其贴片方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
US20050210667A1 (en) * 2004-03-26 2005-09-29 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59813989D1 (de) 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
JP4046030B2 (ja) * 2002-08-30 2008-02-13 株式会社村田製作所 部品装着方法および部品装着装置
DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
DE50304286D1 (de) 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Halbleiter-Montageeinrichtung
CH696103A5 (de) 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
WO2006079617A1 (en) * 2005-01-26 2006-08-03 Abb Ab Device and method for calibrating the center point of a tool mounted on a robot by means of a camera
JP2007173801A (ja) 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法
EP2126645B1 (de) * 2006-12-22 2012-07-04 Kulicke & Soffa Die Bonding GmbH Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
US20050210667A1 (en) * 2004-03-26 2005-09-29 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method

Also Published As

Publication number Publication date
CH698334B1 (de) 2011-07-29
CN101861637B (zh) 2012-07-18
HK1144235A1 (en) 2011-02-02
KR101503556B1 (ko) 2015-03-17
DE112008002467T5 (de) 2010-08-26
MY155097A (en) 2015-09-15
CN101861637A (zh) 2010-10-13
CH698334A1 (de) 2009-07-15
JP2010541293A (ja) 2010-12-24
JP5258068B2 (ja) 2013-08-07
KR20100085027A (ko) 2010-07-28
TW200929425A (en) 2009-07-01
DE112008002467B4 (de) 2013-08-22

Similar Documents

Publication Publication Date Title
TWI464820B (zh) 用以將半導體晶片安裝於基板上之方法
US8133823B2 (en) Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
US11924974B2 (en) Apparatus for mounting components on a substrate
US7597234B2 (en) Method for mounting a flip chip on a substrate
TWI775198B (zh) 半導體裝置的製造裝置以及半導體裝置的製造方法
KR101793366B1 (ko) 본딩 장치 및 본딩 방법
KR101968807B1 (ko) 얼라인먼트 방법 및 얼라인먼트 장치
US20010055069A1 (en) One camera system for component to substrate registration
TWI639366B (zh) 電子零件之安裝方法
TW202004931A (zh) 用於校準組件安裝設備的方法
KR101237056B1 (ko) 반도체 패키지 집합체 정렬방법
TWI543294B (zh) 半導體晶圓之對準方法
JP2003318599A (ja) 部品実装方法及び部品実装装置
JP5181383B2 (ja) ボンディング装置
TW202507883A (zh) 用於判定可拾取組件的定位誤差的方法和設備
HK1144235B (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
WO2023188500A1 (ja) 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
HK1256985B (zh) 用於将部件安装在基板上的设备和方法