KR101503556B1 - 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 - Google Patents

웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 Download PDF

Info

Publication number
KR101503556B1
KR101503556B1 KR1020107007665A KR20107007665A KR101503556B1 KR 101503556 B1 KR101503556 B1 KR 101503556B1 KR 1020107007665 A KR1020107007665 A KR 1020107007665A KR 20107007665 A KR20107007665 A KR 20107007665A KR 101503556 B1 KR101503556 B1 KR 101503556B1
Authority
KR
South Korea
Prior art keywords
camera
coordinate system
semiconductor chip
marking
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020107007665A
Other languages
English (en)
Korean (ko)
Other versions
KR20100085027A (ko
Inventor
슈테판 벨러
파트리크 블레싱
Original Assignee
에섹 에스에이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에섹 에스에이 filed Critical 에섹 에스에이
Priority claimed from PCT/EP2008/063268 external-priority patent/WO2009047214A2/en
Publication of KR20100085027A publication Critical patent/KR20100085027A/ko
Application granted granted Critical
Publication of KR101503556B1 publication Critical patent/KR101503556B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020107007665A 2007-10-09 2008-10-03 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 Active KR101503556B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH1562/07 2007-10-09
CH01136/08A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
CH1136/08 2008-07-17
PCT/EP2008/063268 WO2009047214A2 (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Publications (2)

Publication Number Publication Date
KR20100085027A KR20100085027A (ko) 2010-07-28
KR101503556B1 true KR101503556B1 (ko) 2015-03-17

Family

ID=40908817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107007665A Active KR101503556B1 (ko) 2007-10-09 2008-10-03 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법

Country Status (7)

Country Link
JP (1) JP5258068B2 (https=)
KR (1) KR101503556B1 (https=)
CN (1) CN101861637B (https=)
CH (1) CH698334B1 (https=)
DE (1) DE112008002467B4 (https=)
MY (1) MY155097A (https=)
TW (1) TWI464820B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
KR20170030548A (ko) * 2014-06-11 2017-03-17 유니버셜 인스트루먼츠 코퍼레이션 정확도를 확립, 확인 및/또는 관리하기 위한 테스트 디바이스
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
KR102196105B1 (ko) * 2016-02-01 2020-12-30 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
CN110612258B (zh) * 2017-05-11 2021-06-15 村田机械株式会社 输送系统以及输送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置
CN116528580A (zh) * 2023-05-09 2023-08-01 深圳康桥信息科技有限责任公司 自适应高精度芯片贴片装置及其贴片方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395106A2 (en) * 2002-08-30 2004-03-03 Murata Manufacturing Co., Ltd. Parts mounting method and parts mounting apparatus
EP1581040A2 (en) * 2004-03-26 2005-09-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate
WO2008083701A1 (de) 2006-12-22 2008-07-17 Kulicke & Soffa Die Bonding Gmbh Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59813989D1 (de) 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
JP2001015992A (ja) * 1999-06-29 2001-01-19 Sony Corp 部品装着装置における校正方法
DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
DE50304286D1 (de) 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Halbleiter-Montageeinrichtung
CH696103A5 (de) 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
WO2006079617A1 (en) * 2005-01-26 2006-08-03 Abb Ab Device and method for calibrating the center point of a tool mounted on a robot by means of a camera

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395106A2 (en) * 2002-08-30 2004-03-03 Murata Manufacturing Co., Ltd. Parts mounting method and parts mounting apparatus
EP1581040A2 (en) * 2004-03-26 2005-09-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate
WO2008083701A1 (de) 2006-12-22 2008-07-17 Kulicke & Soffa Die Bonding Gmbh Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

Also Published As

Publication number Publication date
CH698334B1 (de) 2011-07-29
CN101861637B (zh) 2012-07-18
HK1144235A1 (en) 2011-02-02
DE112008002467T5 (de) 2010-08-26
MY155097A (en) 2015-09-15
TWI464820B (zh) 2014-12-11
CN101861637A (zh) 2010-10-13
CH698334A1 (de) 2009-07-15
JP2010541293A (ja) 2010-12-24
JP5258068B2 (ja) 2013-08-07
KR20100085027A (ko) 2010-07-28
TW200929425A (en) 2009-07-01
DE112008002467B4 (de) 2013-08-22

Similar Documents

Publication Publication Date Title
KR101503556B1 (ko) 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법
US8133823B2 (en) Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
US11924974B2 (en) Apparatus for mounting components on a substrate
US10751883B2 (en) Robot system with supplementary metrology position coordinates determination system
US7597234B2 (en) Method for mounting a flip chip on a substrate
US20210162601A1 (en) Supplementary metrology position coordinates determination system including an alignment sensor for use with a robot
CN119008454A (zh) 一种键合装置
JP5181383B2 (ja) ボンディング装置
KR102496826B1 (ko) 다이 홀더 모션 테이블을 구비한 다이 본드 헤드 장치
US20260096460A1 (en) Mounting apparatus, mounting method, and computer-readable recording medium
HK1144235B (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
TW202544978A (zh) 用於多平面參考的工具參考件、以及用於以工具參考件判定組件的定向及／或位置的裝置及方法
TW202605523A (zh) 用於定位構件的方法及設備
HK1256985B (zh) 用於将部件安装在基板上的设备和方法
HK1103852B (en) Method for mounting a flip chip on a substrate

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000