TWI460795B - Installation device and installation method of electronic parts - Google Patents
Installation device and installation method of electronic parts Download PDFInfo
- Publication number
- TWI460795B TWI460795B TW097144848A TW97144848A TWI460795B TW I460795 B TWI460795 B TW I460795B TW 097144848 A TW097144848 A TW 097144848A TW 97144848 A TW97144848 A TW 97144848A TW I460795 B TWI460795 B TW I460795B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- adhesive tape
- adhesive
- tcp
- mounting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 21
- 238000009434 installation Methods 0.000 title description 9
- 239000002390 adhesive tape Substances 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 35
- 238000003384 imaging method Methods 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 230000007246 mechanism Effects 0.000 claims description 12
- 230000007723 transport mechanism Effects 0.000 claims description 9
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 21
- 238000003825 pressing Methods 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 101100206196 Arabidopsis thaliana TCP3 gene Proteins 0.000 description 5
- 101100260060 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CCT3 gene Proteins 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007322469A JP5435861B2 (ja) | 2007-12-13 | 2007-12-13 | 電子部品の実装装置及び実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200931542A TW200931542A (en) | 2009-07-16 |
| TWI460795B true TWI460795B (zh) | 2014-11-11 |
Family
ID=40755407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097144848A TWI460795B (zh) | 2007-12-13 | 2008-11-20 | Installation device and installation method of electronic parts |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5435861B2 (enExample) |
| KR (1) | KR101148322B1 (enExample) |
| CN (1) | CN101884098B (enExample) |
| TW (1) | TWI460795B (enExample) |
| WO (1) | WO2009075164A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5572575B2 (ja) * | 2010-05-12 | 2014-08-13 | 東京エレクトロン株式会社 | 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 |
| CN102879395A (zh) * | 2011-07-11 | 2013-01-16 | 昆山华扬电子有限公司 | Pcb板件辅助对位检查装置 |
| US10952360B2 (en) * | 2015-09-30 | 2021-03-16 | Yamaha Hatsudoki Kabushiki Kaisha | Component mounter and component holder imaging method |
| JP6767333B2 (ja) * | 2017-09-28 | 2020-10-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| KR102748338B1 (ko) | 2020-03-27 | 2025-01-02 | 삼성디스플레이 주식회사 | 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006058411A (ja) * | 2004-08-18 | 2006-03-02 | Takatori Corp | 液晶パネルへの偏光板貼り付け方法及び装置 |
| KR20060066210A (ko) * | 2004-12-13 | 2006-06-16 | (주) 선양디엔티 | 칩 온 필름용 이방성 도전물 부착 시스템 |
| JP2007027560A (ja) * | 2005-07-20 | 2007-02-01 | Shibaura Mechatronics Corp | 粘着性テープの貼着装置及び貼着方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3939159B2 (ja) * | 2002-02-05 | 2007-07-04 | 芝浦メカトロニクス株式会社 | テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置 |
| JP2004021051A (ja) * | 2002-06-19 | 2004-01-22 | Takatori Corp | フレキシブル基板を液晶パネルに圧着する方法及び装置 |
| JP4538843B2 (ja) * | 2004-03-05 | 2010-09-08 | 澁谷工業株式会社 | ダイボンド用粘着テープの貼付方法 |
| JP4591140B2 (ja) * | 2005-03-16 | 2010-12-01 | パナソニック株式会社 | 表示パネルの組立装置および組立方法 |
-
2007
- 2007-12-13 JP JP2007322469A patent/JP5435861B2/ja active Active
-
2008
- 2008-11-14 KR KR1020107015375A patent/KR101148322B1/ko active Active
- 2008-11-14 CN CN2008801185239A patent/CN101884098B/zh active Active
- 2008-11-14 WO PCT/JP2008/070816 patent/WO2009075164A1/ja not_active Ceased
- 2008-11-20 TW TW097144848A patent/TWI460795B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006058411A (ja) * | 2004-08-18 | 2006-03-02 | Takatori Corp | 液晶パネルへの偏光板貼り付け方法及び装置 |
| KR20060066210A (ko) * | 2004-12-13 | 2006-06-16 | (주) 선양디엔티 | 칩 온 필름용 이방성 도전물 부착 시스템 |
| JP2007027560A (ja) * | 2005-07-20 | 2007-02-01 | Shibaura Mechatronics Corp | 粘着性テープの貼着装置及び貼着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200931542A (en) | 2009-07-16 |
| CN101884098B (zh) | 2012-08-29 |
| KR20100093592A (ko) | 2010-08-25 |
| JP2009147089A (ja) | 2009-07-02 |
| JP5435861B2 (ja) | 2014-03-05 |
| WO2009075164A1 (ja) | 2009-06-18 |
| KR101148322B1 (ko) | 2012-05-25 |
| CN101884098A (zh) | 2010-11-10 |
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