CN101884098B - 电子部件的安装装置和安装方法 - Google Patents

电子部件的安装装置和安装方法 Download PDF

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Publication number
CN101884098B
CN101884098B CN2008801185239A CN200880118523A CN101884098B CN 101884098 B CN101884098 B CN 101884098B CN 2008801185239 A CN2008801185239 A CN 2008801185239A CN 200880118523 A CN200880118523 A CN 200880118523A CN 101884098 B CN101884098 B CN 101884098B
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CN
China
Prior art keywords
electronic component
substrate
adhesive tape
mentioned
positioning
Prior art date
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Active
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CN2008801185239A
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English (en)
Chinese (zh)
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CN101884098A (zh
Inventor
南浜悦郎
广濑圭刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
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Shibaura Machine Co Ltd
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Publication date
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Publication of CN101884098A publication Critical patent/CN101884098A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2008801185239A 2007-12-13 2008-11-14 电子部件的安装装置和安装方法 Active CN101884098B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-322469 2007-12-13
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法
PCT/JP2008/070816 WO2009075164A1 (ja) 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
CN101884098A CN101884098A (zh) 2010-11-10
CN101884098B true CN101884098B (zh) 2012-08-29

Family

ID=40755407

Family Applications (1)

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CN2008801185239A Active CN101884098B (zh) 2007-12-13 2008-11-14 电子部件的安装装置和安装方法

Country Status (5)

Country Link
JP (1) JP5435861B2 (enExample)
KR (1) KR101148322B1 (enExample)
CN (1) CN101884098B (enExample)
TW (1) TWI460795B (enExample)
WO (1) WO2009075164A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
CN102879395A (zh) * 2011-07-11 2013-01-16 昆山华扬电子有限公司 Pcb板件辅助对位检查装置
US10952360B2 (en) * 2015-09-30 2021-03-16 Yamaha Hatsudoki Kabushiki Kaisha Component mounter and component holder imaging method
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置
KR102748338B1 (ko) 2020-03-27 2025-01-02 삼성디스플레이 주식회사 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) * 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
CN1842908A (zh) * 2004-03-05 2006-10-04 东和株式会社 小片接合用粘接带的贴附方法和电子元件的安装方法
JP2007027560A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006058411A (ja) * 2004-08-18 2006-03-02 Takatori Corp 液晶パネルへの偏光板貼り付け方法及び装置
KR100591074B1 (ko) * 2004-12-13 2006-06-19 (주) 선양디엔티 칩 온 필름용 이방성 도전물 부착 시스템
JP4591140B2 (ja) * 2005-03-16 2010-12-01 パナソニック株式会社 表示パネルの組立装置および組立方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) * 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
CN1842908A (zh) * 2004-03-05 2006-10-04 东和株式会社 小片接合用粘接带的贴附方法和电子元件的安装方法
JP2007027560A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Also Published As

Publication number Publication date
TW200931542A (en) 2009-07-16
KR20100093592A (ko) 2010-08-25
TWI460795B (zh) 2014-11-11
JP2009147089A (ja) 2009-07-02
JP5435861B2 (ja) 2014-03-05
WO2009075164A1 (ja) 2009-06-18
KR101148322B1 (ko) 2012-05-25
CN101884098A (zh) 2010-11-10

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