WO2009075164A1 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
WO2009075164A1
WO2009075164A1 PCT/JP2008/070816 JP2008070816W WO2009075164A1 WO 2009075164 A1 WO2009075164 A1 WO 2009075164A1 JP 2008070816 W JP2008070816 W JP 2008070816W WO 2009075164 A1 WO2009075164 A1 WO 2009075164A1
Authority
WO
WIPO (PCT)
Prior art keywords
tcp
panel
electronic component
mounting
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070816
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Etsuo Minamihama
Keigou Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to CN2008801185239A priority Critical patent/CN101884098B/zh
Priority to KR1020107015375A priority patent/KR101148322B1/ko
Publication of WO2009075164A1 publication Critical patent/WO2009075164A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP2008/070816 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法 Ceased WO2009075164A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801185239A CN101884098B (zh) 2007-12-13 2008-11-14 电子部件的安装装置和安装方法
KR1020107015375A KR101148322B1 (ko) 2007-12-13 2008-11-14 전자 부품 실장 장치 및 실장 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-322469 2007-12-13
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法

Publications (1)

Publication Number Publication Date
WO2009075164A1 true WO2009075164A1 (ja) 2009-06-18

Family

ID=40755407

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070816 Ceased WO2009075164A1 (ja) 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5435861B2 (enExample)
KR (1) KR101148322B1 (enExample)
CN (1) CN101884098B (enExample)
TW (1) TWI460795B (enExample)
WO (1) WO2009075164A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244026A (zh) * 2010-05-12 2011-11-16 东京毅力科创株式会社 基板定位装置、基板处理装置和基板定位方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879395A (zh) * 2011-07-11 2013-01-16 昆山华扬电子有限公司 Pcb板件辅助对位检查装置
US10952360B2 (en) * 2015-09-30 2021-03-16 Yamaha Hatsudoki Kabushiki Kaisha Component mounter and component holder imaging method
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置
KR102748338B1 (ko) 2020-03-27 2025-01-02 삼성디스플레이 주식회사 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) * 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP2006259060A (ja) * 2005-03-16 2006-09-28 Matsushita Electric Ind Co Ltd 表示パネルの組立装置および組立方法
JP2007027560A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006058411A (ja) * 2004-08-18 2006-03-02 Takatori Corp 液晶パネルへの偏光板貼り付け方法及び装置
KR100591074B1 (ko) * 2004-12-13 2006-06-19 (주) 선양디엔티 칩 온 필름용 이방성 도전물 부착 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) * 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP2006259060A (ja) * 2005-03-16 2006-09-28 Matsushita Electric Ind Co Ltd 表示パネルの組立装置および組立方法
JP2007027560A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244026A (zh) * 2010-05-12 2011-11-16 东京毅力科创株式会社 基板定位装置、基板处理装置和基板定位方法

Also Published As

Publication number Publication date
TW200931542A (en) 2009-07-16
CN101884098B (zh) 2012-08-29
KR20100093592A (ko) 2010-08-25
TWI460795B (zh) 2014-11-11
JP2009147089A (ja) 2009-07-02
JP5435861B2 (ja) 2014-03-05
KR101148322B1 (ko) 2012-05-25
CN101884098A (zh) 2010-11-10

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