KR101148322B1 - 전자 부품 실장 장치 및 실장 방법 - Google Patents

전자 부품 실장 장치 및 실장 방법 Download PDF

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Publication number
KR101148322B1
KR101148322B1 KR1020107015375A KR20107015375A KR101148322B1 KR 101148322 B1 KR101148322 B1 KR 101148322B1 KR 1020107015375 A KR1020107015375 A KR 1020107015375A KR 20107015375 A KR20107015375 A KR 20107015375A KR 101148322 B1 KR101148322 B1 KR 101148322B1
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South Korea
Prior art keywords
electronic component
adhesive tape
tcp
mounting
adhesive
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English (en)
Korean (ko)
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KR20100093592A (ko
Inventor
에츠오 미나미하마
게이고우 히로세
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20100093592A publication Critical patent/KR20100093592A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020107015375A 2007-12-13 2008-11-14 전자 부품 실장 장치 및 실장 방법 Active KR101148322B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-322469 2007-12-13
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法
PCT/JP2008/070816 WO2009075164A1 (ja) 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
KR20100093592A KR20100093592A (ko) 2010-08-25
KR101148322B1 true KR101148322B1 (ko) 2012-05-25

Family

ID=40755407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107015375A Active KR101148322B1 (ko) 2007-12-13 2008-11-14 전자 부품 실장 장치 및 실장 방법

Country Status (5)

Country Link
JP (1) JP5435861B2 (enExample)
KR (1) KR101148322B1 (enExample)
CN (1) CN101884098B (enExample)
TW (1) TWI460795B (enExample)
WO (1) WO2009075164A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11798912B2 (en) 2020-03-27 2023-10-24 Samsung Display Co., Ltd. Bonding apparatus and method of fabricating display device using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
CN102879395A (zh) * 2011-07-11 2013-01-16 昆山华扬电子有限公司 Pcb板件辅助对位检查装置
US10952360B2 (en) * 2015-09-30 2021-03-16 Yamaha Hatsudoki Kabushiki Kaisha Component mounter and component holder imaging method
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP2006259060A (ja) 2005-03-16 2006-09-28 Matsushita Electric Ind Co Ltd 表示パネルの組立装置および組立方法
JP2007027560A (ja) 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006058411A (ja) * 2004-08-18 2006-03-02 Takatori Corp 液晶パネルへの偏光板貼り付け方法及び装置
KR100591074B1 (ko) * 2004-12-13 2006-06-19 (주) 선양디엔티 칩 온 필름용 이방성 도전물 부착 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229453A (ja) 2002-02-05 2003-08-15 Shibaura Mechatronics Corp テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP2006259060A (ja) 2005-03-16 2006-09-28 Matsushita Electric Ind Co Ltd 表示パネルの組立装置および組立方法
JP2007027560A (ja) 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11798912B2 (en) 2020-03-27 2023-10-24 Samsung Display Co., Ltd. Bonding apparatus and method of fabricating display device using the same

Also Published As

Publication number Publication date
TW200931542A (en) 2009-07-16
CN101884098B (zh) 2012-08-29
KR20100093592A (ko) 2010-08-25
TWI460795B (zh) 2014-11-11
JP2009147089A (ja) 2009-07-02
JP5435861B2 (ja) 2014-03-05
WO2009075164A1 (ja) 2009-06-18
CN101884098A (zh) 2010-11-10

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