TWI456678B - 用於基板之自動化載具，尤指用於製造矽基太陽能電池之晶圓 - Google Patents

用於基板之自動化載具，尤指用於製造矽基太陽能電池之晶圓 Download PDF

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Publication number
TWI456678B
TWI456678B TW097106172A TW97106172A TWI456678B TW I456678 B TWI456678 B TW I456678B TW 097106172 A TW097106172 A TW 097106172A TW 97106172 A TW97106172 A TW 97106172A TW I456678 B TWI456678 B TW I456678B
Authority
TW
Taiwan
Prior art keywords
wafer
carrier
cover plate
automated
carrier according
Prior art date
Application number
TW097106172A
Other languages
English (en)
Chinese (zh)
Other versions
TW200847313A (en
Inventor
Jonas Stephan
Redmann Lutz
Original Assignee
Jonas & Redmann Automationstechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas & Redmann Automationstechnik Gmbh filed Critical Jonas & Redmann Automationstechnik Gmbh
Publication of TW200847313A publication Critical patent/TW200847313A/zh
Application granted granted Critical
Publication of TWI456678B publication Critical patent/TWI456678B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
TW097106172A 2007-03-04 2008-02-22 用於基板之自動化載具，尤指用於製造矽基太陽能電池之晶圓 TWI456678B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200720003416 DE202007003416U1 (de) 2007-03-04 2007-03-04 Automatisierungscarrier für Substrate, insbesondere für Wafer zur Herstellung siliziumbasierter Solarzellen

Publications (2)

Publication Number Publication Date
TW200847313A TW200847313A (en) 2008-12-01
TWI456678B true TWI456678B (zh) 2014-10-11

Family

ID=38136193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097106172A TWI456678B (zh) 2007-03-04 2008-02-22 用於基板之自動化載具，尤指用於製造矽基太陽能電池之晶圓

Country Status (3)

Country Link
DE (1) DE202007003416U1 (de)
TW (1) TWI456678B (de)
WO (1) WO2008106913A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062123A1 (de) 2008-12-16 2010-06-17 Q-Cells Se Modularer Carrier
DE102009024239A1 (de) 2009-05-29 2010-12-02 Schmid Technology Systems Gmbh Vorrichtung und Verfahren zum Stapeln bzw. Transport einer Vielzahl von flachen Substraten
DE102013008100A1 (de) 2012-05-15 2013-11-21 Jonas & Redmann Automationstechnik Gmbh Vorrichtung zur Veränderung von Abständen zwischen einzelnen Substraten
EP2711979A1 (de) * 2012-09-24 2014-03-26 Meyer Burger AG Wafer-Schneidsystem
EP2711978A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Verfahren zur Herstellung von Wafern
EP2720258A1 (de) 2012-10-12 2014-04-16 Meyer Burger AG System zur Handhabung von Wafern
EP2944444A1 (de) 2014-05-16 2015-11-18 Meyer Burger AG Waferverarbeitungsverfahren
FR3114437B1 (fr) 2020-09-21 2023-03-31 Commissariat Energie Atomique Dispositif de maintien de plaquette, ensemble de traitement de plaquette et procédé de traitement de plaquette associés

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0579099A1 (de) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Behälter für scheibenähnliche Gegenstände
JPH0853187A (ja) * 1994-08-09 1996-02-27 Sony Corp 板状物品収納用キャリア

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0100539A3 (de) * 1982-07-30 1985-05-22 Tecnisco Ltd. Zusammengefügte Anordnung zur Halterung von Halbleiterscheiben oder ähnlichem
JP3148832B2 (ja) * 1993-01-11 2001-03-26 株式会社ダイフク 物品収納容器
JPH09107026A (ja) * 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd ウェーハ収納容器のウェーハカセット
JPH09129718A (ja) * 1995-11-02 1997-05-16 Kawasaki Steel Corp 板状部品収容器
JPH11302481A (ja) * 1998-04-22 1999-11-02 Idemitsu Petrochem Co Ltd スチレン系樹脂組成物及び半導体搬送用治具
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
DE10215283B4 (de) * 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Vorrichtung zur Aufnahme von Substraten
JP2004095942A (ja) * 2002-09-02 2004-03-25 Kokusai Electric Semiconductor Service Inc ウェーハカセット
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0579099A1 (de) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Behälter für scheibenähnliche Gegenstände
JPH0853187A (ja) * 1994-08-09 1996-02-27 Sony Corp 板状物品収納用キャリア

Also Published As

Publication number Publication date
WO2008106913A2 (de) 2008-09-12
TW200847313A (en) 2008-12-01
DE202007003416U1 (de) 2007-05-31
WO2008106913A4 (de) 2009-01-15
WO2008106913A3 (de) 2008-11-13

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MM4A Annulment or lapse of patent due to non-payment of fees