TWI456678B - An automated carrier for a substrate, especially a wafer used to fabricate a germanium-based solar cell - Google Patents

An automated carrier for a substrate, especially a wafer used to fabricate a germanium-based solar cell Download PDF

Info

Publication number
TWI456678B
TWI456678B TW097106172A TW97106172A TWI456678B TW I456678 B TWI456678 B TW I456678B TW 097106172 A TW097106172 A TW 097106172A TW 97106172 A TW97106172 A TW 97106172A TW I456678 B TWI456678 B TW I456678B
Authority
TW
Taiwan
Prior art keywords
wafer
carrier
cover plate
automated
carrier according
Prior art date
Application number
TW097106172A
Other languages
Chinese (zh)
Other versions
TW200847313A (en
Inventor
Jonas Stephan
Redmann Lutz
Original Assignee
Jonas & Redmann Automationstechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas & Redmann Automationstechnik Gmbh filed Critical Jonas & Redmann Automationstechnik Gmbh
Publication of TW200847313A publication Critical patent/TW200847313A/en
Application granted granted Critical
Publication of TWI456678B publication Critical patent/TWI456678B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Claims (15)

一種用於基板之自動化載具，尤指用於製造矽基太陽能電池之晶圓，具二相互對立之壁，多個連接該壁之連接元件，一用以將晶圓保持於載具中之保持結構，該保持結構將晶圓以一與裝填及卸除方向垂直、互相平行且等距位置之方式保持於載具中，且具有一裝置用於阻擋及開放晶圓裝填及卸除，其特徵為，二壁設計成相同之U-形基板與蓋板(2或3)，以可鬆脫方式與四垂直於載具(1)裝填與卸除方向(B或E)之柱體連接，並與該四柱體(4)構成載具(1)之骨架(5)，於該載具骨架上之各縱向側邊，四柱體(4)中之二，於U-形基板與蓋板(2及3)各自相對之腿部(6)內面(7)間延伸，該柱體於平行於載具(1)裝填與卸除方向(B或E)之平面上保持等距，載具(1)中保持晶圓(10)之保持結構包含二相同、於載具骨架(5)內互相間隔、可更換之晶圓攜帶單位(11；12)，其各自具有至少一相同之梳齒板(16)，以可鬆脫方式安裝於二安裝板(13)上，垂直於載具(1)之裝填與卸除方向(B或E)，並各自於一位置上以可鬆脫方式與二U-形基板與蓋板(2或3)連接，該位置係由各預定配置給多種晶圓格式之固定位置中選出，其間，各晶圓攜帶單位(11；12)至少一梳齒板(16)之梳齒根部位於二平面之間，而該平面間之距離為所選擇預定之晶圓格式之前緣長度，於至少一晶圓攜帶單位(11；12)上，以關節式旋轉方式裝設一安全扣(20)，其延伸過晶圓攜帶單位(11)之長度，可自動於一關閉及一開放位置(S及F)間切換，用以阻擋及開放載具(1)之晶圓(10)裝填或卸除，及於載具骨架(5)之二相對U-形基板與蓋板(2或3)基部(26)之內面(27)間，設有一由二U-形鋁材(29)製成且含橡膠元件(30)之擋塊(28)， 該擋塊(28)垂直於裝填與卸除方向(B或E)延伸，載具(1)裝填時，晶圓(10)以其側邊之側緣區域被導引於相對之梳齒板(16)間，晶圓(10)面向擋塊(28)之前緣(31)以無衝撞之方式接著。 An automated carrier for a substrate, especially a wafer for manufacturing a germanium-based solar cell, having two opposing walls, a plurality of connecting components connecting the walls, and a device for holding the wafer in the carrier a retention structure that holds the wafer in the carrier in a manner perpendicular to, parallel to, and equidistant from the loading and unloading direction, and has a device for blocking and opening wafer loading and unloading, The utility model is characterized in that the two walls are designed as the same U-shaped substrate and the cover plate (2 or 3), and are connected in a releasable manner to the column body which is perpendicular to the loading and unloading direction (B or E) of the carrier (1). And the four-cylinder (4) constitutes the skeleton (5) of the carrier (1), on each longitudinal side of the carrier skeleton, two of the four cylinders (4), on the U-shaped substrate and the cover plate (2 and 3) extending between the inner faces (7) of the respective legs (6), the cylinders being equidistant in a plane parallel to the loading and unloading direction (B or E) of the carrier (1), The holding structure of the holding wafer (10) in (1) comprises two identical wafer carrier units (11; 12) which are spaced apart from each other in the carrier frame (5), each having at least one identical comb. The plate (16) is releasably mounted on the two mounting plates (13) perpendicular to the loading and unloading direction (B or E) of the carrier (1) and is releasably in a position Connected to the two U-shaped substrate and the cover plate (2 or 3), the position is selected from the fixed positions of the plurality of wafer formats by each predetermined configuration, and at least one comb tooth of each wafer carrying unit (11; 12) The comb root of the plate (16) is located between the two planes, and the distance between the planes is the length of the leading edge of the selected predetermined wafer format, and is articulated on at least one wafer carrying unit (11; 12). The method is provided with a safety buckle (20) extending over the length of the wafer carrying unit (11), which can be automatically switched between a closed position and an open position (S and F) for blocking and opening the vehicle (1) The wafer (10) is filled or unloaded, and is disposed between the carrier frame (5) and the inner surface (27) of the base (26) of the cover plate (2 or 3). U-shaped aluminum (29) made of rubber (30) with a stopper (28), The stopper (28) extends perpendicular to the loading and unloading direction (B or E). When the carrier (1) is loaded, the wafer (10) is guided to the opposite comb plate with the side edge regions of the sides thereof. (16), the wafer (10) is followed by a collision-free manner toward the leading edge (31) of the stopper (28). 根據申請專利範圍第1項所述之自動化載具，其特徵為，載具骨架(5)之柱體(4)端部各具有內螺紋，且被容納於二U-形基板與蓋板(2或3)相對之腿部(6)上互相對準之孔(8)內，經由螺絲(9)將柱體(4)之端部固定於U-形基板與蓋板(2或3)上，該螺絲(9)由U-形基板與蓋板(2或3)之外面導入孔(8)中，與各內螺紋齧合。 The automated carrier according to claim 1 is characterized in that the ends of the cylinders (4) of the carrier frame (5) each have internal threads and are accommodated in the two U-shaped substrates and the cover plates ( 2 or 3) Fix the end of the cylinder (4) to the U-shaped base plate and the cover plate (2 or 3) via the screw (9) in the hole (8) aligned with each other on the leg portion (6). The screw (9) is guided into the hole (8) from the outer surface of the U-shaped base plate and the cover plate (2 or 3) to engage with the internal threads. 根據申請專利範圍第1項所述之自動化載具，其特徵為，各晶圓攜帶單位(11；12)具有二相同之梳齒板(16)，以前後排列方式安裝於兩安裝板(13)上。 The automated carrier according to claim 1 is characterized in that each wafer carrying unit (11; 12) has two identical comb plates (16), and is arranged in front and rear on two mounting plates (13). )on. 根據申請專利範圍第1項所述之自動化載具，其特徵為，各梳齒板(16)各具有51個距離為4,756公釐之梳齒(17)。 The automated carrier of claim 1 is characterized in that each comb plate (16) has 51 comb teeth (17) at a distance of 4,756 mm. 根據申請專利範圍第1項所述之自動化載具，其特徵為，各晶圓攜帶單位(11；12)之梳齒板(16)各具有73個距離為6,341公釐之梳齒(17)。 The automated carrier according to claim 1, wherein each of the wafer carrying units (11; 12) has 63 comb teeth (17) each having a distance of 6,341 mm. . 根據申請專利範圍第1項所述之自動化載具，其特徵為，於各晶圓攜帶單位(11；12)上，以關節式旋轉方式裝設一安全扣(20)。 The automated carrier according to claim 1 is characterized in that a safety buckle (20) is attached to each wafer carrying unit (11; 12) in an articulated manner. 根據申請專利範圍第1項所述之自動化載具，其特徵為，二U-形基板與蓋板(2或3)各自具有四個不同之固定位置(15)，晶圓攜帶單位(11；12)能選擇性地以其二安裝板(13)端部(14)固定且配置給125×125公釐、150×150公釐、156×156公釐及210×210公釐之晶圓格式。 The automated carrier according to claim 1, wherein the two U-shaped substrates and the cover plate (2 or 3) each have four different fixed positions (15), the wafer carrying unit (11; 12) can be selectively fixed at the ends (14) of the two mounting plates (13) and configured for wafer formats of 125 x 125 mm, 150 x 150 mm, 156 x 156 mm, and 210 x 210 mm. . 根據申請專利範圍第1項所述之自動化載具，其特徵為，於二U-形基板與蓋板(2或3)相對應之固定位置(15)上設置孔(15)，其間晶圓攜帶單位(11；12)各自之二安裝板(2)面向U-形基板(2)之端部(14)只需簡單插入U-形基板(2)之孔(15)即可，且各安裝板(13)之另端於U-形蓋板(3)相對應之孔(15)內，最終藉由螺絲(19)以可鬆脫方式固定。 The automated carrier according to claim 1, wherein the second U-shaped substrate is provided with a hole (15) at a fixed position (15) corresponding to the cover plate (2 or 3), during which the wafer is The end portions (14) of the two mounting plates (2) facing the U-shaped substrate (2) of the carrying unit (11; 12) need only be simply inserted into the holes (15) of the U-shaped substrate (2), and each The other end of the mounting plate (13) is in the corresponding hole (15) of the U-shaped cover plate (3), and finally fixed in a releasable manner by screws (19). 根據申請專利範圍第1項所述之自動化載具，其特徵為，於至少一晶圓攜帶單位(11或12)上以關節式旋轉方式裝設之安全扣(20)以旋轉搖臂形式為之，其經一操控裝置(21)切換成開放位置(F)且於載具(1)之晶圓裝填或晶圓卸除結束後，經一整合之扭轉彈簧(22)自動切換成關閉位置(S)。 The automated carrier according to claim 1, wherein the safety buckle (20) mounted on the at least one wafer carrying unit (11 or 12) in an articulated manner is in the form of a rotating rocker arm. The switch is switched to the open position (F) via a control device (21) and automatically switched to the closed position by an integrated torsion spring (22) after the wafer loading or wafer removal of the carrier (1) is completed. (S). 根據申請專利範圍第1項所述之自動化載具，其特徵為，安全扣(20)之接觸緣(23)被一由橡膠或塑膠製之彈性元件包覆，於安全扣(20)之關閉位置(S)上，以無衝撞方式與載具(1)內晶圓疊中之晶圓(10)面向卸除方向(E)之前緣(25)接著。 The automated carrier according to claim 1 is characterized in that the contact edge (23) of the safety buckle (20) is covered by a rubber or plastic elastic member and closed by the safety buckle (20). At position (S), the wafer (10) in the stack of wafers in the carrier (1) faces the front edge (25) of the removal direction (E) in a non-collision manner. 根據申請專利範圍第1項所述之自動化載具，其特徵為，於U-形基板及/或蓋板(2或3)中設置組裝孔(34)，孔中旋入射頻識別(無線電頻率識別)晶片，經由該射頻識別晶片，可於任何時間清楚識別載具(1)。 The automated carrier according to claim 1 is characterized in that an assembly hole (34) is provided in the U-shaped substrate and/or the cover plate (2 or 3), and the radio frequency identification (radio frequency identification) is screwed into the hole. The wafer, via the RFID chip, clearly identifies the carrier (1) at any time. 根據申請專利範圍第1項所述之自動化載具，其特徵為，於U-形基板與蓋板(2或3)中設置中心孔(35)，經由該中心孔，載具(1)於任何時間皆以可重現之方式被夾緊，達到自動化之目的。 The automated carrier according to claim 1, characterized in that a central hole (35) is provided in the U-shaped substrate and the cover plate (2 or 3), via which the carrier (1) is Any time is clamped in a reproducible way for automation purposes. 根據申請專利範圍第1項所述之自動化載具，其特徵為，於U-形基板(2)基部(26)之內緣(32)中間設有一突起(33)，經由該突起，可識別載具(1)之精準。 An automated carrier according to claim 1, characterized in that a protrusion (33) is provided in the middle of the inner edge (32) of the base (26) of the U-shaped substrate (2), through which the protrusion can be identified The accuracy of the vehicle (1). 根據申請專利範圍第1項所述之自動化載具，其特徵為，基板及蓋板(2或3)由硬鍍層之鋁材製成。 An automated carrier according to claim 1 of the invention, characterized in that the substrate and the cover plate (2 or 3) are made of a hard-plated aluminum material. 根據申請專利範圍第1項所述之自動化載具，其特徵為，梳齒板(16)由聚氧化甲烯製成。 An automated carrier according to claim 1 of the invention, characterized in that the comb plate (16) is made of polyoxymethylene.
TW097106172A 2007-03-04 2008-02-22 An automated carrier for a substrate, especially a wafer used to fabricate a germanium-based solar cell TWI456678B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200720003416 DE202007003416U1 (en) 2007-03-04 2007-03-04 Automation carrier for substrate e.g. wafer, has stopper, where front edges of wafer facing stopper are guided into ridge plates lying one on another with its side edge areas, during loading of carrier for arrangement

Publications (2)

Publication Number Publication Date
TW200847313A TW200847313A (en) 2008-12-01
TWI456678B true TWI456678B (en) 2014-10-11

Family

ID=38136193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097106172A TWI456678B (en) 2007-03-04 2008-02-22 An automated carrier for a substrate, especially a wafer used to fabricate a germanium-based solar cell

Country Status (3)

Country Link
DE (1) DE202007003416U1 (en)
TW (1) TWI456678B (en)
WO (1) WO2008106913A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062123A1 (en) 2008-12-16 2010-06-17 Q-Cells Se Modular carrier
DE102009024239A1 (en) * 2009-05-29 2010-12-02 Schmid Technology Systems Gmbh Apparatus and method for stacking a plurality of flat substrates
DE102013008100A1 (en) 2012-05-15 2013-11-21 Jonas & Redmann Automationstechnik Gmbh Device for changing distances between individual substrates
EP2711978A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2711979A1 (en) * 2012-09-24 2014-03-26 Meyer Burger AG Wafer cutting system
EP2720258A1 (en) 2012-10-12 2014-04-16 Meyer Burger AG Wafer handling system
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method
FR3114437B1 (en) 2020-09-21 2023-03-31 Commissariat Energie Atomique Wafer holding device, wafer processing assembly and related wafer processing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0579099A1 (en) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Container for plate-like objects
JPH0853187A (en) * 1994-08-09 1996-02-27 Sony Corp Carrier for storing plate-like article

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0100539A3 (en) * 1982-07-30 1985-05-22 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
JP3148832B2 (en) * 1993-01-11 2001-03-26 株式会社ダイフク Goods storage container
JPH09107026A (en) * 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd Wafer cassette for wafer receiving container
JPH09129718A (en) * 1995-11-02 1997-05-16 Kawasaki Steel Corp Flat parts housing box
JPH11302481A (en) * 1998-04-22 1999-11-02 Idemitsu Petrochem Co Ltd Styrenic resin composition and semiconductor conveyor jig
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
DE10215283B4 (en) * 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Device for receiving substrates
JP2004095942A (en) * 2002-09-02 2004-03-25 Kokusai Electric Semiconductor Service Inc Wafer cassette
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
JP4667769B2 (en) * 2004-06-11 2011-04-13 信越ポリマー株式会社 Substrate storage container

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0579099A1 (en) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Container for plate-like objects
JPH0853187A (en) * 1994-08-09 1996-02-27 Sony Corp Carrier for storing plate-like article

Also Published As

Publication number Publication date
DE202007003416U1 (en) 2007-05-31
TW200847313A (en) 2008-12-01
WO2008106913A3 (en) 2008-11-13
WO2008106913A4 (en) 2009-01-15
WO2008106913A2 (en) 2008-09-12

Similar Documents

Publication Publication Date Title
TWI456678B (en) An automated carrier for a substrate, especially a wafer used to fabricate a germanium-based solar cell
CA2843507C (en) Device and method to accurately and easily assemble glass slides
WO2009050675A3 (en) Displacement device with precision position measurement
JP5219181B2 (en) Pallet for fixing workpiece and liquid application apparatus having the same
EP2563555A1 (en) Grasping apparatus having bag members filled by a granular substance
JP2013535821A5 (en)
US20070138466A1 (en) Apparatus for testing a semiconductor module
RU2015109720A (en) FLEXIBLE MOUNT FOR SENSOR FOR TIRE INSPECTION
KR101761166B1 (en) Vacuum gripper assembly stabilized by springs
ITPD20020054U1 (en) DISPOSABLE SUPPORT FOR TREATMENT CONTAINERS OF BIOLOGICAL SAMPLES IN CITOCENTRIFUGES
US7768284B2 (en) Test apparatus for testing a semiconductor device, and method for testing the semiconductor device
JPH0298576A (en) Holding jig of chip-type electronic part and method for handling
TW201501949A (en) Screen printing system for printing flat substrates, in particular solar cells, and method for printing substrates
CN100408447C (en) Device for receiving a commodity in a fixed position
RU2019118487A (en) HOLDER FOR PLACING AND PROTECTING THE SIDE OF THE PHOTO TEMPLATE OR PHOTO TEMPLATE WITH A MEMBRANE RELATING TO THE CLEANING MEDIUM, A METHOD FOR CLEANING THE PHOTO TEMPLATE OR PHOTO TEMPLATE WITH A MEMBRANE AND A DEVICE FOR OPENING AND CLOSING
WO2004096412A8 (en) Filter element-removing jig
US7524199B2 (en) Pick-and-place cap for socket assembly
ES2677849T3 (en) One-piece press clamp for painting for a manipulator robot
CN109466463A (en) A kind of gravitational support
JPH1164197A (en) Specimen piece grasping device for viscoelasticity measuring device and method and device for transporting testpiece to grasping device thereof
WO2007040799A3 (en) Test fixture for collecting particulate material
JP6312421B2 (en) Cover for transport line
JPH11309637A (en) Parallel moving chuck device
CN216710775U (en) Carrier tool
CN214740965U (en) Door plant that can dehumidify

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees