TWI456189B - 基板檢查裝置、基板檢查方法及該基板檢查裝置之調整方法 - Google Patents

基板檢查裝置、基板檢查方法及該基板檢查裝置之調整方法 Download PDF

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Publication number
TWI456189B
TWI456189B TW101112614A TW101112614A TWI456189B TW I456189 B TWI456189 B TW I456189B TW 101112614 A TW101112614 A TW 101112614A TW 101112614 A TW101112614 A TW 101112614A TW I456189 B TWI456189 B TW I456189B
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TW
Taiwan
Prior art keywords
substrate
sensor camera
camera
strip
image
Prior art date
Application number
TW101112614A
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English (en)
Chinese (zh)
Other versions
TW201300765A (zh
Inventor
Daisuke Matsushima
Makoto Muto
Yoshinori Hayashi
Hiroshi Wakaba
Yoko Ono
Hideki Mori
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201300765A publication Critical patent/TW201300765A/zh
Application granted granted Critical
Publication of TWI456189B publication Critical patent/TWI456189B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW101112614A 2011-04-19 2012-04-10 基板檢查裝置、基板檢查方法及該基板檢查裝置之調整方法 TWI456189B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011093378 2011-04-19
JP2011093377 2011-04-19
JP2012082640A JP6004517B2 (ja) 2011-04-19 2012-03-30 基板検査装置、基板検査方法及び該基板検査装置の調整方法

Publications (2)

Publication Number Publication Date
TW201300765A TW201300765A (zh) 2013-01-01
TWI456189B true TWI456189B (zh) 2014-10-11

Family

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TW101112614A TWI456189B (zh) 2011-04-19 2012-04-10 基板檢查裝置、基板檢查方法及該基板檢查裝置之調整方法

Country Status (4)

Country Link
JP (1) JP6004517B2 (enExample)
KR (1) KR101374509B1 (enExample)
CN (1) CN102749334B (enExample)
TW (1) TWI456189B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675999B (zh) * 2017-04-11 2019-11-01 德商紐豹有限責任合資公司 用於組件的接收裝置及自用於組件的接收裝置取下不良組件的方法

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DE102013003090A1 (de) * 2013-02-25 2014-08-28 Texmag Gmbh Vertriebsgesellschaft Verfahren und Vorrichtung zum Prüfen von Faltzuschnitten
JP6330211B2 (ja) * 2013-10-06 2018-05-30 株式会社山梨技術工房 平板基板の表面状態検査方法及びそれを用いた平板基板の表面状態検査装置
KR101619149B1 (ko) * 2014-01-22 2016-05-10 주식회사 브이원텍 칩온글래스 본딩 검사장치
JP6126183B2 (ja) * 2015-10-05 2017-05-10 ファナック株式会社 ターゲットマークを撮像するカメラを備えたロボットシステム
CN106248681A (zh) * 2016-07-18 2016-12-21 南通大学 基于机器视觉的立体对象多类缺陷检测装置及方法
EP3532429B1 (en) * 2016-10-26 2025-08-06 Board of Regents, The University of Texas System High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices
CN110178014B (zh) * 2016-11-14 2023-05-02 美国西门子医学诊断股份有限公司 用于使用图案照明表征样本的方法和设备
JP6884082B2 (ja) * 2017-10-11 2021-06-09 株式会社Ｓｃｒｅｅｎホールディングス 膜厚測定装置、基板検査装置、膜厚測定方法および基板検査方法
CN114258482A (zh) * 2019-08-29 2022-03-29 东京毅力科创株式会社 检查装置的自我诊断方法和检查装置
CN111272709B (zh) * 2020-02-25 2021-02-12 中国矿业大学 一种矿物与气泡或油滴间液膜薄化装置
CN112362667B (zh) * 2020-11-04 2021-07-06 广东鑫光智能系统有限公司 一种改进型板材生产用六面检测装置及其检测方法
JP2022191675A (ja) * 2021-06-16 2022-12-28 株式会社ミツトヨ 光学式プローブ及び形状測定装置
JP7709877B2 (ja) * 2021-09-15 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 端部状態確認装置
KR102766128B1 (ko) * 2024-10-23 2025-02-12 주식회사 비즈포스 2.5차원 이미지 스캔 방법

Citations (2)

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JP2003014654A (ja) * 2001-06-27 2003-01-15 Ngk Spark Plug Co Ltd 基板の検査方法及び検査装置並びに電子機器用製品の製造方法
TWI333544B (en) * 2005-10-12 2010-11-21 Olympus Corp Substrate inspection apparatus

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JPS63139237A (ja) * 1986-12-02 1988-06-11 Toshiba Corp 半導体基板の欠陥検査装置
JPH0346314A (ja) * 1989-07-14 1991-02-27 Sumitomo Metal Mining Co Ltd 半導体基板の接合時又は研磨時前の処理方法
US6411377B1 (en) * 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
JP2000121326A (ja) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd ギャップ検出方式
JP2001005964A (ja) * 1999-06-18 2001-01-12 Fuji Photo Film Co Ltd デジタル画像読取装置用形状検査装置および形状検査方法
JP2002250695A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 多層フィルム欠陥検出装置
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
KR100793182B1 (ko) * 2006-02-07 2008-01-10 주식회사 한택 라인센서 카메라를 이용한 반도체 기판의 결함검출장치 및방법
JP2008032433A (ja) * 2006-07-26 2008-02-14 Olympus Corp 基板検査装置
US8107064B2 (en) * 2006-08-10 2012-01-31 Shibaura Mechatronics Corporation Disc wafer inspecting device and inspecting method
JP5128920B2 (ja) * 2007-12-03 2013-01-23 芝浦メカトロニクス株式会社 基板表面検査装置及び基板表面検査方法
JP4358889B1 (ja) * 2008-06-27 2009-11-04 日本エレクトロセンサリデバイス株式会社 ウエーハ欠陥検査装置
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003014654A (ja) * 2001-06-27 2003-01-15 Ngk Spark Plug Co Ltd 基板の検査方法及び検査装置並びに電子機器用製品の製造方法
TWI333544B (en) * 2005-10-12 2010-11-21 Olympus Corp Substrate inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675999B (zh) * 2017-04-11 2019-11-01 德商紐豹有限責任合資公司 用於組件的接收裝置及自用於組件的接收裝置取下不良組件的方法

Also Published As

Publication number Publication date
KR101374509B1 (ko) 2014-03-13
KR20120123641A (ko) 2012-11-09
CN102749334A (zh) 2012-10-24
TW201300765A (zh) 2013-01-01
CN102749334B (zh) 2014-08-27
JP2012233880A (ja) 2012-11-29
JP6004517B2 (ja) 2016-10-12

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