CN102749334B - 基板检查装置、基板检查方法及基板检查装置的调整方法 - Google Patents

基板检查装置、基板检查方法及基板检查装置的调整方法 Download PDF

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Publication number
CN102749334B
CN102749334B CN201210115341.4A CN201210115341A CN102749334B CN 102749334 B CN102749334 B CN 102749334B CN 201210115341 A CN201210115341 A CN 201210115341A CN 102749334 B CN102749334 B CN 102749334B
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China
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substrate
sensing camera
line
area
image
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Expired - Fee Related
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CN201210115341.4A
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English (en)
Chinese (zh)
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CN102749334A (zh
Inventor
松嶋大辅
武藤真
林义典
若叶博之
小野洋子
森秀树
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Shibaura Mechatronics Corp
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Shibaura Engineering Works Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201210115341.4A 2011-04-19 2012-04-18 基板检查装置、基板检查方法及基板检查装置的调整方法 Expired - Fee Related CN102749334B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2011093377 2011-04-19
JP2011-093377 2011-04-19
JP2011093378 2011-04-19
JP2011-093378 2011-04-19
JP2012-082640 2012-03-30
JP2012082640A JP6004517B2 (ja) 2011-04-19 2012-03-30 基板検査装置、基板検査方法及び該基板検査装置の調整方法

Publications (2)

Publication Number Publication Date
CN102749334A CN102749334A (zh) 2012-10-24
CN102749334B true CN102749334B (zh) 2014-08-27

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Country Status (4)

Country Link
JP (1) JP6004517B2 (enExample)
KR (1) KR101374509B1 (enExample)
CN (1) CN102749334B (enExample)
TW (1) TWI456189B (enExample)

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DE102013003090A1 (de) * 2013-02-25 2014-08-28 Texmag Gmbh Vertriebsgesellschaft Verfahren und Vorrichtung zum Prüfen von Faltzuschnitten
JP6330211B2 (ja) * 2013-10-06 2018-05-30 株式会社山梨技術工房 平板基板の表面状態検査方法及びそれを用いた平板基板の表面状態検査装置
KR101619149B1 (ko) * 2014-01-22 2016-05-10 주식회사 브이원텍 칩온글래스 본딩 검사장치
JP6126183B2 (ja) * 2015-10-05 2017-05-10 ファナック株式会社 ターゲットマークを撮像するカメラを備えたロボットシステム
CN106248681A (zh) * 2016-07-18 2016-12-21 南通大学 基于机器视觉的立体对象多类缺陷检测装置及方法
WO2018081452A1 (en) 2016-10-26 2018-05-03 Board Of Regents, The University Of Texas System High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices
US11073472B2 (en) * 2016-11-14 2021-07-27 Siemens Healthcare Diagnostics Inc. Methods and apparatus for characterizing a specimen using pattern illumination
JP6999691B2 (ja) * 2017-04-11 2022-01-19 ミュールバウアー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト 光学センサを有するコンポーネント受け取り装置
JP6884082B2 (ja) * 2017-10-11 2021-06-09 株式会社Ｓｃｒｅｅｎホールディングス 膜厚測定装置、基板検査装置、膜厚測定方法および基板検査方法
KR20220051389A (ko) * 2019-08-29 2022-04-26 도쿄엘렉트론가부시키가이샤 검사 장치의 자기 진단 방법 및 검사 장치
CN111272709B (zh) * 2020-02-25 2021-02-12 中国矿业大学 一种矿物与气泡或油滴间液膜薄化装置
CN112362667B (zh) * 2020-11-04 2021-07-06 广东鑫光智能系统有限公司 一种改进型板材生产用六面检测装置及其检测方法
JP2022191675A (ja) * 2021-06-16 2022-12-28 株式会社ミツトヨ 光学式プローブ及び形状測定装置
JP7709877B2 (ja) * 2021-09-15 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 端部状態確認装置
JP2024129750A (ja) * 2023-03-13 2024-09-27 ファスフォードテクノロジ株式会社 半導体製造装置、検査装置および半導体装置の製造方法
KR102766128B1 (ko) * 2024-10-23 2025-02-12 주식회사 비즈포스 2.5차원 이미지 스캔 방법

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JPS63139237A (ja) * 1986-12-02 1988-06-11 Toshiba Corp 半導体基板の欠陥検査装置
JP2001005964A (ja) * 1999-06-18 2001-01-12 Fuji Photo Film Co Ltd デジタル画像読取装置用形状検査装置および形状検査方法
CN101501831A (zh) * 2006-08-10 2009-08-05 芝浦机械电子装置股份有限公司 圆盘状基板的检查装置和检查方法
CN101883979A (zh) * 2007-12-03 2010-11-10 芝浦机械电子装置股份有限公司 基板表面检查装置以及基板表面检查方法
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统

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JPH0346314A (ja) * 1989-07-14 1991-02-27 Sumitomo Metal Mining Co Ltd 半導体基板の接合時又は研磨時前の処理方法
US6411377B1 (en) * 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
JP2000121326A (ja) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd ギャップ検出方式
JP2002250695A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 多層フィルム欠陥検出装置
JP4709432B2 (ja) * 2001-06-27 2011-06-22 日本特殊陶業株式会社 基板の検査方法及び検査装置並びに電子機器用製品の製造方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2007107945A (ja) * 2005-10-12 2007-04-26 Olympus Corp 基板検査装置
US8055058B2 (en) * 2006-02-07 2011-11-08 Hantech Co., Ltd. Apparatus and method for detecting defects in wafer using line sensor camera
JP2008032433A (ja) * 2006-07-26 2008-02-14 Olympus Corp 基板検査装置
JP4358889B1 (ja) * 2008-06-27 2009-11-04 日本エレクトロセンサリデバイス株式会社 ウエーハ欠陥検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139237A (ja) * 1986-12-02 1988-06-11 Toshiba Corp 半導体基板の欠陥検査装置
JP2001005964A (ja) * 1999-06-18 2001-01-12 Fuji Photo Film Co Ltd デジタル画像読取装置用形状検査装置および形状検査方法
CN101501831A (zh) * 2006-08-10 2009-08-05 芝浦机械电子装置股份有限公司 圆盘状基板的检查装置和检查方法
CN101883979A (zh) * 2007-12-03 2010-11-10 芝浦机械电子装置股份有限公司 基板表面检查装置以及基板表面检查方法
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统

Also Published As

Publication number Publication date
JP2012233880A (ja) 2012-11-29
TW201300765A (zh) 2013-01-01
CN102749334A (zh) 2012-10-24
KR20120123641A (ko) 2012-11-09
KR101374509B1 (ko) 2014-03-13
JP6004517B2 (ja) 2016-10-12
TWI456189B (zh) 2014-10-11

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SE01 Entry into force of request for substantive examination
CI01 Publication of corrected invention patent application

Correction item: Priority

Correct: 2011-093377 2011.04.19 JP|2011-093378 2011.04.19 JP|2012-082640 2012.03.30 JP

False: Missing"2011-093377 2011.04.19 JP"

Number: 43

Volume: 28

CI02 Correction of invention patent application

Correction item: Priority

Correct: 2011-093377 2011.04.19 JP|2011-093378 2011.04.19 JP|2012-082640 2012.03.30 JP

False: Missing"2011-093377 2011.04.19 JP"

Number: 43

Page: The title page

Volume: 28

ERR Gazette correction

Free format text: CORRECT: PRIORITY DATA; FROM: MISSING 2011-093377 2011.04.19 JP TO: 2011-093377 2011.04.19 JP;2011-093378 2011.04.19 JP;2012-082640 2012.03.30 JP

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20140827

Termination date: 20190418