TWI456189B - Substrate inspection device, substrate inspection method, and adjustment method of the substrate inspection device - Google Patents

Substrate inspection device, substrate inspection method, and adjustment method of the substrate inspection device Download PDF

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TWI456189B
TWI456189B TW101112614A TW101112614A TWI456189B TW I456189 B TWI456189 B TW I456189B TW 101112614 A TW101112614 A TW 101112614A TW 101112614 A TW101112614 A TW 101112614A TW I456189 B TWI456189 B TW I456189B
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substrate
sensor camera
camera
strip
image
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TW201300765A (en
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Daisuke Matsushima
Makoto Muto
Yoshinori Hayashi
Hiroshi Wakaba
Yoko Ono
Hideki Mori
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Shibaura Mechatronics Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
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  • Analytical Chemistry (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Claims (19)

一種基板檢查裝置，係對可能於貼合第1基板層及第2基板層而形成之基板之前述第1基板層與前述第2基板層之界面產生的微小空洞檢查者，其包含有：照明單元，係將預定波長之檢查光照射成對前述基板之表面傾斜地入射者；線型感測器照相機，係夾著以前述檢查光形成於前述基板之帶狀照明區域且配置於與前述照明單元相反之側之預定位置者；移動設備，係使前述基板與前述線型感測器照相機及前述照明單元，在橫過前述帶狀照明區域之方向進行相對移動者；及圖像處理單元，係處理來自前述線型感測器照相機之影像信號者；該圖像處理單元具有：基板圖像資訊生成機構，係於以前述移動設備進行前述照明單元及前述線型感測器照相機與前述基板之相對移動之際，依據從前述線型感測器輸出之影像信號，生成顯示前述基板之圖像之基板圖像資訊者；及檢查結果資訊生成機構，係依據前述基板圖像資訊，生成對可能於前述基板之前述第1基板層與前述第2基板層之界面產生之微小空洞的檢查結果資訊者。A substrate inspection device for inspecting a microcavity generated at an interface between the first substrate layer and the second substrate layer of a substrate formed by bonding a first substrate layer and a second substrate layer includes illumination The unit irradiates the inspection light of a predetermined wavelength into an obliquely incident surface of the substrate; the line sensor camera has a strip-shaped illumination region formed on the substrate by the inspection light, and is disposed opposite to the illumination unit a predetermined position on the side; the mobile device is configured to move the substrate and the linear sensor camera and the illumination unit relative to each other in a direction across the strip illumination region; and the image processing unit is processed from a video signal of the linear sensor camera; the image processing unit includes: a substrate image information generating mechanism for performing the relative movement of the illumination unit and the line sensor camera and the substrate by the mobile device Generating a substrate image information showing an image of the substrate based on an image signal output from the line sensor And the inspection result information generating means generates, based on the substrate image information, inspection result information on a microcavity which may be generated at an interface between the first substrate layer and the second substrate layer of the substrate. 如申請專利範圍第1項之基板檢查裝置，其中前述線型感測器照相機設定成該線型感測器照相機之拍攝線為 從形成於前述基板之帶狀照明區域之照度分佈最大之帶狀部份往遠離前述照明單元之方向偏離預定距離的位置。The substrate inspection device of claim 1, wherein the linear sensor camera is set such that the line of the line sensor camera is The strip-shaped portion having the largest illuminance distribution formed in the strip-shaped illumination region of the substrate is displaced from the illumination unit by a predetermined distance. 如申請專利範圍第1項之基板檢查裝置，其中前述線型感測器照相機設定成該線性照相機之拍攝線為從形成於前述基板之帶狀照明區域之中心線往遠離前述照明單元之方向偏離預定距離的位置。The substrate inspection device of claim 1, wherein the linear sensor camera is configured such that a line of the linear camera is deviated from a center line of the strip-shaped illumination region formed on the substrate toward a direction away from the illumination unit. The location of the distance. 如申請專利範圍第1至3項中任一項之基板檢查裝置，其中前述檢查結果資訊生成機構具有一機構，該機構係依據前述基板圖像資訊，檢測在該基板圖像資訊顯示之基板圖像中，對應於產生於前述第1基板層與前述第2基板層之界面之微小空洞的微小空洞部份者，並生成包含與所檢測出之前述微小空洞部份之形狀相關的資訊之前述檢查結果資訊。The substrate inspection device according to any one of claims 1 to 3, wherein the inspection result information generating mechanism has a mechanism for detecting a substrate image displayed on the substrate image information according to the substrate image information. In the image, the microcavity portion corresponding to the microcavity generated at the interface between the first substrate layer and the second substrate layer generates the aforementioned information including the shape of the detected microcavity portion Check the result information. 如申請專利範圍第4項之基板檢查裝置，其中前述檢查結果資訊生成機構具有算出與前述微小空洞部份之厚度相關之資訊以作為與前述微小空洞部份之形狀相關的資訊之機構，並生成包含與前述微小空洞部份之厚度相關之資訊的前述檢查結果資訊。The substrate inspection device of claim 4, wherein the inspection result information generating means has a mechanism for calculating information relating to the thickness of the minute cavity portion as information relating to the shape of the microscopic cavity portion, and generates The foregoing inspection result information including information related to the thickness of the aforementioned minute cavity portion. 如申請專利範圍第5項之基板檢查裝置，其中算出與前述微小空洞部份之厚度相關之資訊的機構具有從所檢測出之前述微小空洞部份抽出環狀圖像部份之機構，並依據所抽出之前述環狀圖像部份之干涉條紋之形狀，算出與前述微小空洞部份之厚度相關之資訊。The substrate inspection apparatus of claim 5, wherein the means for calculating the information relating to the thickness of the microscopic cavity portion has a mechanism for extracting the annular image portion from the detected microscopic cavity portion, and The shape of the interference fringe of the extracted annular image portion is calculated, and information relating to the thickness of the minute cavity portion is calculated. 一種基板檢查方法，係對可能於貼合第1基板層及第2基板層而形成之基板之前述第1基板層與前述第2基板層之界面產生的微小空洞檢查者，其包含有：基板掃瞄步驟，係在照明單元將預定波長之檢查光照射成對前述基板之表面傾斜地入射之狀態下，使前述基板，與夾著以前述檢查光形成於前述基板之帶狀照明區域且配置於與前述照明單元相反之側之預定位置的線型感測器照相機及該照明單元，在橫過前述帶狀照明區域之方向進行相對移動者；基板圖像資訊生成步驟，係於進行前述基板與前述照明單元及前述線型感測器照相機之相對移動之際，依據從前述線型感測器輸出之影像信號，生成顯示前述基板之圖像之基板圖像資訊者；及檢查結果資訊生成步驟，係依據前述基板圖像資訊，生成對可能於前述基板之前述第1基板層與前述第2基板層之界面產生之微小空洞的檢查結果資訊者。A method of inspecting a substrate, wherein a microcavity inspector is formed on an interface between the first substrate layer and the second substrate layer of a substrate formed by bonding a first substrate layer and a second substrate layer, and includes: a substrate In the scanning step, when the illumination unit irradiates the inspection light of a predetermined wavelength into obliquely incident on the surface of the substrate, the substrate is placed on the strip-shaped illumination region formed on the substrate by the inspection light. a linear sensor camera at a predetermined position on a side opposite to the illumination unit and the illumination unit are relatively moved in a direction across the strip-shaped illumination region; and the substrate image information generation step is performed on the substrate and the foregoing When the illumination unit and the linear sensor camera are relatively moved, the substrate image information for displaying the image of the substrate is generated according to the image signal outputted from the line sensor; and the step of generating the inspection result information is based on The substrate image information is generated in an interface between the first substrate layer and the second substrate layer that may be on the substrate Small voids test results information were. 如申請專利範圍第7項之基板檢查方法，其中前述檢查結果資訊生成步驟具有一步驟，該步驟係依據前述基板圖像資訊，檢測在該基板圖像資訊顯示之基板圖像中對應於產生於前述第1基板層與前述第2基板層之界面之微小空洞的微小空洞部份者，並生成包含與所檢測出之前述微小空洞部份之形狀相關的資訊之前述檢查結果資訊。The method for inspecting a substrate according to claim 7 , wherein the step of generating the information of the inspection result has a step of detecting, according to the image information of the substrate, a substrate image corresponding to the substrate image information The microcavity portion of the microcavity at the interface between the first substrate layer and the second substrate layer generates the inspection result information including information on the shape of the detected microcavity portion. 如申請專利範圍第8項之基板檢查方法，其中前述檢查結果資訊生成步驟具有算出與前述微小空洞部份之厚 度相關之資訊以作為與前述微小空洞部份之形狀相關的資訊之步驟，並生成包含與前述微小空洞部份之厚度相關之資訊的前述檢查結果資訊。The substrate inspection method of claim 8, wherein the inspection result information generating step has a thickness calculated from the microscopic cavity portion The degree-related information is a step of as information relating to the shape of the aforementioned minute cavity portion, and generates the aforementioned inspection result information including information on the thickness of the aforementioned minute cavity portion. 如申請專利範圍第9項之基板檢查方法，其中算出與前述微小空洞部份之厚度相關之資訊的步驟具有從所檢測出之前述微小空洞部份抽出環狀圖像部份之步驟，並依據所抽出之前述環狀圖像部份之干涉條紋之形狀，算出與前述微小空洞部份之厚度相關之資訊。The substrate inspection method of claim 9, wherein the step of calculating the information relating to the thickness of the microscopic cavity portion has a step of extracting the annular image portion from the detected microscopic cavity portion, and The shape of the interference fringe of the extracted annular image portion is calculated, and information relating to the thickness of the minute cavity portion is calculated. 一種基板檢查裝置，係對可能於貼合第1基板層及第2基板層而形成之基板之前述第1基板層與前述第2基板層之界面產生的微小空洞檢查者，其包含有：照明單元，係將預定波長之檢查光照射成帶狀且對前述基板之表面傾斜地入射者；線型感測器照相機及面型感測器照相機，係夾著以前述檢查光形成於前述基板之帶狀照明區域且於與前述照明單元相反之側以預定位置關係排列配置者；照相機調整設備，係使前述線型感測器照相機及前述面型感測器照相機一體地移動，而調整該線型感測器照相機及該面型感測器照相機對前述基板之前述帶狀照明區域之相對的位置及姿勢者；移動設備，係使前述基板與前述線型感測器照相機及前述照明單元在橫過前述帶狀照明區域之方向進行相對移動者；圖像處理單元，係處理分別來自前述面型感測器照 相機及前述線型感測器照相機之影像信號者；及顯示單元；前述圖像處理單元具有：面型圖像顯示控制機構，係依據來自前述面型感測器照相機之影像信號，使前述顯示單元顯示圖像者；基板圖像資訊生成機構，係於以前述移動設備進行前述照明單元及前述線型感測器照相機、與前述基板的相對移動之際，依據從前述線型感測器照相機輸出之影像信號而生成顯示前述基板之圖像之基板圖像資訊者，且前述線型感測器照相機係以前述照相機調整設備調整成與前述基板之前述帶狀照明區域成預定位置關係；及檢查結果資訊生成機構，係依據前述基板圖像資訊，生成對可能於前述基板之前述第1基板層與前述第2基板層之界面產生之微小空洞的檢查結果資訊者。A substrate inspection device for inspecting a microcavity generated at an interface between the first substrate layer and the second substrate layer of a substrate formed by bonding a first substrate layer and a second substrate layer includes illumination The unit is configured to irradiate inspection light of a predetermined wavelength into a strip shape and obliquely incident on a surface of the substrate; the line sensor camera and the surface sensor camera sandwich a strip formed by the inspection light on the substrate The illumination area is arranged in a predetermined positional relationship on a side opposite to the illumination unit; the camera adjustment device moves the linear sensor camera and the aforementioned surface sensor camera integrally, and adjusts the line sensor And a position of the camera and the surface sensor camera relative to the strip illumination area of the substrate; and the moving device is configured to traverse the strip between the substrate and the line sensor camera and the illumination unit The direction of the illumination area is relatively moved; the image processing unit is processed from the aforementioned surface sensor a camera and the image sensor of the linear sensor camera; and a display unit; the image processing unit has: a surface image display control mechanism, and the display unit is configured according to an image signal from the surface sensor camera a substrate image information generating means for outputting images according to the line sensor camera when the illumination unit and the line sensor camera are moved relative to the substrate by the mobile device And generating a substrate image information indicating an image of the substrate, wherein the line sensor camera is adjusted to have a predetermined positional relationship with the strip illumination region of the substrate by the camera adjustment device; and the inspection result information is generated. The mechanism generates, based on the substrate image information, an inspection result information on a microcavity generated at an interface between the first substrate layer and the second substrate layer of the substrate. 如申請專利範圍第11項之基板檢查裝置，其中前述面型感測器照相機與前述線型感測器照相機以拍攝方向相同之位置關係排列配置。The substrate inspection device according to claim 11, wherein the surface sensor camera and the line sensor camera are arranged in the same positional relationship in the photographing direction. 如申請專利範圍第12項之基板檢查裝置，其中前述面型感測器照相機與前述線型感測器照相機以前述面型感測器照相機之拍攝中心與前述線型感測器照相機之拍攝中心在同一線上之位置關係排列配置。The substrate inspection device of claim 12, wherein the front surface sensor camera and the linear sensor camera are in the same shooting center as the front sensor camera and the shooting center of the linear sensor camera The positional relationship on the line is arranged. 如申請專利範圍第13項之基板檢查裝置，其中前述照相機調整設備具有使前述線型感測器照相機及前述面型 感測器照相機一體地於前述基板之前述帶狀照明區域延伸之方向滑動之滑動設備。The substrate inspection device of claim 13, wherein the camera adjustment device has the aforementioned line sensor camera and the aforementioned surface type The sensor camera integrally slides the slide device in a direction in which the aforementioned strip-shaped illumination region of the substrate extends. 如申請專利範圍第1至4項中任一項之基板檢查裝置，其中前述線型感測器照相機之對前述基板之前述帶狀照明區域之相對的位置，藉由前述照相機調整設備，調整成前述線型感測器照相機在前述基板之表面之拍攝線為從前述基板之前述帶狀照明區域之照度分佈最大的帶狀部份往遠離前述照明單元之方向偏離預定距離之位置。The substrate inspection device according to any one of claims 1 to 4, wherein a position of the linear sensor camera opposite to the strip illumination region of the substrate is adjusted by the camera adjustment device The line of the line sensor on the surface of the substrate is a position at which the strip portion having the largest illuminance distribution of the strip-shaped illumination region of the substrate deviates from the illumination unit by a predetermined distance. 如申請專利範圍第1至4項中任一項之基板檢查裝置，其中前述線型感測器照相機之對前述基板之前述帶狀照明區域之相對的位置，藉由前述照相機調整設備，調整成前述線型感測器照相機在前述基板之表面之拍攝線為從前述基板之前述帶狀照明區域之中心線往遠離前述照明單元之方向偏離預定距離的位置。The substrate inspection device according to any one of claims 1 to 4, wherein a position of the linear sensor camera opposite to the strip illumination region of the substrate is adjusted by the camera adjustment device The line of the line sensor camera on the surface of the substrate is a position deviated from the center line of the strip-shaped illumination region of the substrate by a predetermined distance away from the illumination unit. 一種前述基板檢查裝置之調整方法，係如申請專利範圍第11至16項中任一項之基板檢查裝置之調整方法，其包含有：面型感測器照相機調整步驟，係一面使顯示單元顯示依據來自前述面型感測器照相機之影像信號之圖像，一面藉由前述照相機調整設備使前述面型感測器照相機及前述線型感測器照相機一體地移動，而調整該面型感測器照相機與該線型感測器照相機之對前述基板之前述帶狀照明區域的相對位置及姿勢，以使形成於前 述基板之帶狀照明區域之影像在前述顯示單元之畫面上之預定位置者；及線型感測器照相機調整步驟，係藉由前述照相機調整設備使前述線型感測器照相機及前述面型感測器照相機一體地移動，而使前述線型感測器照相機之對前述基板之前述帶狀照明區域的相對位置關係，與由前述面型照相機調整步驟所調整之前述面型感測器照相機對前述基板之前述帶狀照明區域的相對位置關係相同者。The method for adjusting the substrate inspection device according to any one of the preceding claims, wherein the method of adjusting the substrate inspection device comprises: a surface sensor sensor adjustment step, and the display unit is displayed on one side. Adjusting the face sensor by integrally moving the face sensor camera and the line sensor camera by the camera adjustment device according to an image of the image signal from the surface sensor camera The relative position and posture of the camera and the line sensor camera to the aforementioned strip-shaped illumination region of the substrate so as to be formed before a predetermined position on the screen of the display unit of the substrate; and a linear sensor camera adjustment step for sensing the line sensor camera and the surface sensor by the camera adjustment device The camera is integrally moved, and the relative positional relationship of the linear sensor camera to the strip-shaped illumination region of the substrate is compared with the surface sensor camera adjusted by the surface camera adjustment step to the substrate The relative positional relationship of the aforementioned strip-shaped illumination regions is the same. 如申請專利範圍第7項之基板檢查裝置之調整方法，其中應調整之基板檢查裝置係如申請專利範圍第14項之基板檢查裝置，前述線型感測器照相機調整步驟係以前述滑動設備使前述線型感測器照相機及前述面型感測器照相機一體地滑動，而使前述線型感測器照相機之對前述基板之前述帶狀照明區域之相對位置關係，與由前述面型照相機調整步驟所調整之前述面型感測器照相機對前述基板之前述帶狀照明區域之相對位置關係相同。The method for adjusting a substrate inspection device according to the seventh aspect of the invention, wherein the substrate inspection device to be adjusted is the substrate inspection device of claim 14, wherein the linear sensor camera adjustment step is performed by the sliding device The line sensor camera and the surface sensor camera are integrally slid, and the relative positional relationship of the line sensor camera to the strip illumination region of the substrate is adjusted by the surface camera adjustment step The aforementioned surface sensor camera has the same relative positional relationship with respect to the aforementioned strip-shaped illumination region of the substrate. 如申請專利範圍第17或18項之基板檢查裝置之調整方法，其中前述面型感測器照相機調整步驟具有：第1步驟，係以前述照相機調整設備使前述面型感測器照相機及前述線型感測器照相機一體地移動，以使前述面型感測器照相機之拍攝中心為前述基板之前述帶狀照明區域之照度分佈為最大之帶狀部份的位置者；及 第2步驟，係以前述照相機調整設備使前述面型照相機感測器及前述線型感測器照相機一體地移動，以使前述面型感測器照相機之拍攝中心為往遠離前述照明單元之方向偏離預定距離之位置者。The method of adjusting a substrate inspection device according to claim 17 or 18, wherein the surface sensor camera adjustment step has a first step of: using the camera adjustment device to make the surface sensor camera and the line type The sensor camera is integrally moved such that the photographing center of the front-surface sensor camera is the position where the illumination distribution of the strip-shaped illumination region of the substrate is the largest strip portion; and In the second step, the front camera sensor and the line sensor camera are integrally moved by the camera adjustment device to shift the shooting center of the face sensor camera away from the illumination unit. The location of the predetermined distance.
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