TWI455883B - 矽石以及環氧樹脂 - Google Patents
矽石以及環氧樹脂 Download PDFInfo
- Publication number
- TWI455883B TWI455883B TW098106468A TW98106468A TWI455883B TW I455883 B TWI455883 B TW I455883B TW 098106468 A TW098106468 A TW 098106468A TW 98106468 A TW98106468 A TW 98106468A TW I455883 B TWI455883 B TW I455883B
- Authority
- TW
- Taiwan
- Prior art keywords
- surface area
- fuel gas
- air
- average
- oxide powder
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims 4
- 229920000647 polyepoxide Polymers 0.000 title claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
- 238000000034 method Methods 0.000 claims 6
- 239000002737 fuel gas Substances 0.000 claims 5
- 230000002209 hydrophobic effect Effects 0.000 claims 5
- 229910052902 vermiculite Inorganic materials 0.000 claims 5
- 235000019354 vermiculite Nutrition 0.000 claims 5
- 239000010455 vermiculite Substances 0.000 claims 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 4
- 239000000843 powder Substances 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 2
- 229910003910 SiCl4 Inorganic materials 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000012159 carrier gas Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- 230000008719 thickening Effects 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 1
- 150000001622 bismuth compounds Chemical class 0.000 claims 1
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 claims 1
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 1
- 239000001569 carbon dioxide Substances 0.000 claims 1
- 150000001785 cerium compounds Chemical class 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 150000002372 helium compounds Chemical class 0.000 claims 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000012299 nitrogen atmosphere Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910001868 water Inorganic materials 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
- Y02P20/129—Energy recovery, e.g. by cogeneration, H2recovery or pressure recovery turbines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2995—Silane, siloxane or silicone coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008000499A DE102008000499A1 (de) | 2008-03-04 | 2008-03-04 | Kieselsäure sowie Epoxidharze |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201000400A TW201000400A (en) | 2010-01-01 |
| TWI455883B true TWI455883B (zh) | 2014-10-11 |
Family
ID=40740192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098106468A TWI455883B (zh) | 2008-03-04 | 2009-02-27 | 矽石以及環氧樹脂 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8480846B2 (enExample) |
| EP (2) | EP2268575B1 (enExample) |
| JP (1) | JP5583032B2 (enExample) |
| CN (2) | CN103435056B (enExample) |
| DE (1) | DE102008000499A1 (enExample) |
| TW (1) | TWI455883B (enExample) |
| WO (1) | WO2009109442A2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102040804B (zh) * | 2010-11-19 | 2013-02-13 | 明基材料有限公司 | 环氧树脂组成物 |
| JP5643623B2 (ja) * | 2010-12-02 | 2014-12-17 | デクセリアルズ株式会社 | 異方性導電材料及びその製造方法 |
| JP6443041B2 (ja) * | 2014-12-26 | 2018-12-26 | 三菱マテリアル株式会社 | シリカゾル分散液及びシリカ多孔質膜形成用組成物 |
| CN104830259B (zh) * | 2015-04-21 | 2018-05-15 | 长兴铁鹰电气有限公司 | 一种铅酸蓄电池极柱密封胶及其制备方法 |
| JP6796253B2 (ja) * | 2016-04-04 | 2020-12-09 | 日立金属株式会社 | 接着フィルム及びフラット配線材 |
| DE102017203998A1 (de) | 2017-03-10 | 2017-06-01 | Wacker Chemie Ag | Verfahren zur Herstellung von pyrogener Kieselsäure |
| CN106978103A (zh) * | 2017-04-07 | 2017-07-25 | 德山化工（浙江）有限公司 | 硅油处理热解法二氧化硅、其制备方法及应用 |
| CN111655802B (zh) * | 2018-01-25 | 2023-02-21 | 卡博特公司 | 含水的疏水性二氧化硅分散体 |
| CN112638490B (zh) | 2018-06-15 | 2023-01-03 | 格雷斯公司 | 消泡剂活性物质、其制造方法和消泡制剂 |
| JP7527770B2 (ja) * | 2018-11-29 | 2024-08-05 | キヤノン株式会社 | 硬化性シリコーンゴム混合物、電子写真用部材、および電子写真画像形成装置 |
| WO2021035383A1 (en) * | 2019-08-23 | 2021-03-04 | Evonik Specialty Chemicals (Shanghai) Co., Ltd. | Thermal conductive filler and preparation method thereof |
| EP4050122A4 (en) * | 2019-10-21 | 2022-12-28 | JFE Steel Corporation | Electromagnetic steel sheet with insulation coating film |
| EP3954743A1 (de) | 2020-08-12 | 2022-02-16 | Evonik Operations GmbH | Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen |
| JP2022185978A (ja) * | 2021-06-03 | 2022-12-15 | 日本アエロジル株式会社 | 表面改質無機酸化物粉末及びその製造方法 |
| JP2022185980A (ja) * | 2021-06-03 | 2022-12-15 | 日本アエロジル株式会社 | 表面改質無機酸化物粉末及びその製造方法 |
| CN116285475A (zh) * | 2023-02-13 | 2023-06-23 | 青岛中邦新材料科技有限公司 | 一种疏水二氧化硅及其制备方法 |
| CN115974089B (zh) * | 2023-02-17 | 2023-10-20 | 江苏海格新材料有限公司 | 一种活性硅微粉的生产方法 |
| WO2024236144A1 (en) * | 2023-05-18 | 2024-11-21 | Ams-Osram International Gmbh | Modified siloxanes, method for modifying siloxanes and their use |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200502170A (en) * | 2003-05-06 | 2005-01-16 | Tokuyama Corp | Hydrophobic fumed silica |
| CN1803603A (zh) * | 2005-01-12 | 2006-07-19 | 德古萨股份公司 | 热解法制造的二氧化硅粉末以及含有该粉末的硅树脂密封组合物 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB932753A (en) * | 1959-10-12 | 1963-07-31 | Ici Ltd | Improvements in or relating to fillers and pigments by treatment with dihydrocarbyl polysiloxane |
| DE1567454A1 (de) * | 1966-03-10 | 1970-08-06 | Degussa | Verfahren zur Herstellung stabiler hochprozentiger Dispersionen von pyrogen gewonnener Kieselsaeure |
| US3592679A (en) * | 1969-05-29 | 1971-07-13 | Cabot Corp | Surface treatment of polymeric materials |
| JPS6136338A (ja) * | 1984-07-27 | 1986-02-21 | Mitsubishi Chem Ind Ltd | 疎水性の酸化物微粉体及び該酸化物から成る揺変付与剤 |
| US4852965A (en) * | 1987-02-27 | 1989-08-01 | American Telephone And Telegraph Company At&T Bell Laboratories | Composite service and distribution communications media |
| US5285513A (en) * | 1992-11-30 | 1994-02-08 | At&T Bell Laboratories | Optical fiber cable provided with stabilized waterblocking material |
| US5543487A (en) * | 1994-01-19 | 1996-08-06 | The United States Of America As Represented By The Secretary Of Agriculture | Hydroxymethylated resorcinol coupling agent and method for bonding wood |
| DE4402370A1 (de) | 1994-01-27 | 1995-08-03 | Degussa | Silanisierte Kieselsäuren |
| DE10138490A1 (de) * | 2001-08-04 | 2003-02-13 | Degussa | Hydrophobe Fällungskieselsäure mit hohem Weißgrad und extrem niedriger Feuchtigkeitsaufnahme |
| DE10145162A1 (de) * | 2001-09-13 | 2003-04-10 | Wacker Chemie Gmbh | Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen |
| DE10222153B4 (de) * | 2002-05-17 | 2018-11-22 | Evonik Degussa Gmbh | 2-Komponenten-Mischsysteme |
| US6645341B1 (en) * | 2002-08-06 | 2003-11-11 | National Starch And Chemical Investment Holding Corporation | Two part epoxide adhesive with improved strength |
| DE10239424A1 (de) | 2002-08-28 | 2004-03-11 | Degussa Ag | Kieselsäuren |
| KR100954073B1 (ko) * | 2002-12-18 | 2010-04-23 | 에보닉 데구사 게엠베하 | 구조적으로 피복된 실리카 |
| WO2004055105A1 (en) * | 2002-12-18 | 2004-07-01 | Degussa Ag | Texture-coated silica |
| DE10260323A1 (de) * | 2002-12-20 | 2004-07-08 | Wacker-Chemie Gmbh | Wasserbenetzbare silylierte Metalloxide |
| DE10326049A1 (de) * | 2003-06-10 | 2004-12-30 | Degussa Ag | Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung |
| JP2005154222A (ja) * | 2003-11-27 | 2005-06-16 | Tokuyama Corp | 微粒子状シリカ |
| DE102005001408A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver |
| JP4756040B2 (ja) * | 2005-05-19 | 2011-08-24 | 株式会社トクヤマ | 微粒子状シリカ |
| DE102005035442A1 (de) * | 2005-07-28 | 2007-05-16 | Wacker Chemie Ag | Stabilisierte HDK-Suspensionen zur Verstärkung von Reaktivharzen |
-
2008
- 2008-03-04 DE DE102008000499A patent/DE102008000499A1/de not_active Ceased
-
2009
- 2009-02-10 EP EP09716530A patent/EP2268575B1/en active Active
- 2009-02-10 EP EP11189483.8A patent/EP2433905B1/en active Active
- 2009-02-10 CN CN201310331814.9A patent/CN103435056B/zh active Active
- 2009-02-10 JP JP2010549070A patent/JP5583032B2/ja not_active Expired - Fee Related
- 2009-02-10 US US12/812,554 patent/US8480846B2/en active Active
- 2009-02-10 WO PCT/EP2009/051475 patent/WO2009109442A2/en not_active Ceased
- 2009-02-10 CN CN2009801073736A patent/CN101959796B/zh active Active
- 2009-02-27 TW TW098106468A patent/TWI455883B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200502170A (en) * | 2003-05-06 | 2005-01-16 | Tokuyama Corp | Hydrophobic fumed silica |
| CN1803603A (zh) * | 2005-01-12 | 2006-07-19 | 德古萨股份公司 | 热解法制造的二氧化硅粉末以及含有该粉末的硅树脂密封组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101959796B (zh) | 2013-09-04 |
| WO2009109442A3 (en) | 2010-08-05 |
| CN103435056A (zh) | 2013-12-11 |
| CN103435056B (zh) | 2015-12-02 |
| EP2433905A2 (en) | 2012-03-28 |
| EP2268575A2 (en) | 2011-01-05 |
| US20100286311A1 (en) | 2010-11-11 |
| JP2011516373A (ja) | 2011-05-26 |
| TW201000400A (en) | 2010-01-01 |
| EP2433905B1 (en) | 2016-08-17 |
| EP2268575B1 (en) | 2013-04-03 |
| JP5583032B2 (ja) | 2014-09-03 |
| CN101959796A (zh) | 2011-01-26 |
| DE102008000499A1 (de) | 2009-09-10 |
| EP2433905A3 (en) | 2012-05-30 |
| US8480846B2 (en) | 2013-07-09 |
| WO2009109442A2 (en) | 2009-09-11 |
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