TWI442188B - 平版裝置及物品製造方法 - Google Patents
平版裝置及物品製造方法 Download PDFInfo
- Publication number
- TWI442188B TWI442188B TW100111009A TW100111009A TWI442188B TW I442188 B TWI442188 B TW I442188B TW 100111009 A TW100111009 A TW 100111009A TW 100111009 A TW100111009 A TW 100111009A TW I442188 B TWI442188 B TW I442188B
- Authority
- TW
- Taiwan
- Prior art keywords
- visor
- arc
- substrate
- light
- region
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 53
- 230000003287 optical effect Effects 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 37
- 238000005286 illumination Methods 0.000 claims description 25
- 238000012546 transfer Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 description 59
- 230000008569 process Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010104232A JP5127875B2 (ja) | 2010-04-28 | 2010-04-28 | リソグラフィ装置及び物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201200970A TW201200970A (en) | 2012-01-01 |
| TWI442188B true TWI442188B (zh) | 2014-06-21 |
Family
ID=44858017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100111009A TWI442188B (zh) | 2010-04-28 | 2011-03-30 | 平版裝置及物品製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8760627B2 (enExample) |
| JP (1) | JP5127875B2 (enExample) |
| KR (1) | KR101359080B1 (enExample) |
| CN (1) | CN102236265B (enExample) |
| TW (1) | TWI442188B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5836652B2 (ja) | 2011-06-10 | 2015-12-24 | キヤノン株式会社 | インプリント方法、インプリント装置及び物品の製造方法 |
| JP5789135B2 (ja) * | 2011-06-17 | 2015-10-07 | キヤノン株式会社 | 露光装置及びデバイスの製造方法 |
| JP5868094B2 (ja) * | 2011-09-26 | 2016-02-24 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP6012200B2 (ja) * | 2012-02-28 | 2016-10-25 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法 |
| JP6029289B2 (ja) | 2012-02-28 | 2016-11-24 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法 |
| NL2011172A (en) * | 2012-07-23 | 2014-01-27 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| JP6200135B2 (ja) * | 2012-07-24 | 2017-09-20 | キヤノン株式会社 | インプリント装置、インプリント方法、および、物品製造方法 |
| DE102012218074A1 (de) * | 2012-10-04 | 2013-08-14 | Carl Zeiss Smt Gmbh | Blenden-Vorrichtung |
| US20150277239A1 (en) * | 2012-10-05 | 2015-10-01 | Rudolph Technologies, Inc. | Multiple-Blade Device for Substrate Edge Protection during Photolithography |
| JP6288985B2 (ja) * | 2013-08-13 | 2018-03-07 | キヤノン株式会社 | リソグラフィ装置、および物品の製造方法 |
| NL2016271B1 (en) * | 2016-02-16 | 2017-08-22 | Liteq B V | Lithographic apparatus and method for preventing peripheral exposure of a substrate. |
| JP6177409B2 (ja) * | 2016-10-19 | 2017-08-09 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法 |
| JP6936672B2 (ja) * | 2017-09-19 | 2021-09-22 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
| JP7162430B2 (ja) * | 2018-02-27 | 2022-10-28 | 株式会社オーク製作所 | 投影露光装置 |
| KR102439935B1 (ko) | 2018-02-27 | 2022-09-02 | 가부시키가이샤 오크세이사쿠쇼 | 투영 노광 장치 |
| JP7145620B2 (ja) * | 2018-02-27 | 2022-10-03 | 株式会社オーク製作所 | 投影露光装置 |
| JP7179420B2 (ja) | 2019-01-29 | 2022-11-29 | 株式会社オーク製作所 | 投影露光装置及び投影露光装置に使用する遮光板 |
| JP7446069B2 (ja) * | 2019-09-03 | 2024-03-08 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
| JP7446799B2 (ja) * | 2019-12-05 | 2024-03-11 | キヤノン株式会社 | インプリント方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3056206B1 (ja) * | 1999-03-18 | 2000-06-26 | 広島日本電気株式会社 | ダミーパターン形成方法及び半導体製造方法 |
| US6830852B2 (en) | 2001-07-19 | 2004-12-14 | Nikon Corporation | Stencil reticles for use in charged-particle-beam microlithography, and pattern-determination methods for such reticles |
| US6680774B1 (en) * | 2001-10-09 | 2004-01-20 | Ultratech Stepper, Inc. | Method and apparatus for mechanically masking a workpiece |
| JP2003158067A (ja) * | 2001-11-22 | 2003-05-30 | Hitachi Ltd | 半導体装置の製造方法および露光装置 |
| TWI251116B (en) | 2002-12-19 | 2006-03-11 | Asml Netherlands Bv | Device manufacturing method, computer-readable medium and lithographic apparatus |
| JP2005045160A (ja) * | 2003-07-25 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 露光方法 |
| JP4458329B2 (ja) | 2003-12-26 | 2010-04-28 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP4481698B2 (ja) | 2004-03-29 | 2010-06-16 | キヤノン株式会社 | 加工装置 |
| JP2006040915A (ja) * | 2004-07-22 | 2006-02-09 | Seiko Epson Corp | 半導体装置の製造方法、及びその製造装置、並びに電気光学装置の製造方法 |
| US7936447B2 (en) * | 2006-05-08 | 2011-05-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7525640B2 (en) | 2006-11-07 | 2009-04-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4838698B2 (ja) | 2006-12-19 | 2011-12-14 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| US7777863B2 (en) * | 2007-05-30 | 2010-08-17 | Asml Netherlands B.V. | Lithographic apparatus with mask to prevent exposure of peripheral exposure region of substrate |
| JP2009239018A (ja) * | 2008-03-27 | 2009-10-15 | Orc Mfg Co Ltd | 投影露光装置 |
| NL2003962A (en) * | 2008-12-24 | 2010-06-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| JP5789135B2 (ja) * | 2011-06-17 | 2015-10-07 | キヤノン株式会社 | 露光装置及びデバイスの製造方法 |
| JP5868094B2 (ja) * | 2011-09-26 | 2016-02-24 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
-
2010
- 2010-04-28 JP JP2010104232A patent/JP5127875B2/ja active Active
-
2011
- 2011-03-30 TW TW100111009A patent/TWI442188B/zh active
- 2011-04-20 KR KR1020110036762A patent/KR101359080B1/ko active Active
- 2011-04-25 CN CN201110103590.7A patent/CN102236265B/zh active Active
- 2011-04-25 US US13/093,309 patent/US8760627B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110120220A (ko) | 2011-11-03 |
| CN102236265A (zh) | 2011-11-09 |
| US20110267595A1 (en) | 2011-11-03 |
| JP2011233781A (ja) | 2011-11-17 |
| TW201200970A (en) | 2012-01-01 |
| CN102236265B (zh) | 2014-01-29 |
| KR101359080B1 (ko) | 2014-02-05 |
| US8760627B2 (en) | 2014-06-24 |
| JP5127875B2 (ja) | 2013-01-23 |
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