TWI439168B - 發光裝置之製造方法 - Google Patents

發光裝置之製造方法 Download PDF

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Publication number
TWI439168B
TWI439168B TW099125232A TW99125232A TWI439168B TW I439168 B TWI439168 B TW I439168B TW 099125232 A TW099125232 A TW 099125232A TW 99125232 A TW99125232 A TW 99125232A TW I439168 B TWI439168 B TW I439168B
Authority
TW
Taiwan
Prior art keywords
partition wall
light
plasma
partition
substrate
Prior art date
Application number
TW099125232A
Other languages
English (en)
Chinese (zh)
Other versions
TW201117639A (en
Inventor
Takashi Kidu
Satoru Shimoda
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of TW201117639A publication Critical patent/TW201117639A/zh
Application granted granted Critical
Publication of TWI439168B publication Critical patent/TWI439168B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
TW099125232A 2009-07-31 2010-07-30 發光裝置之製造方法 TWI439168B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009180187A JP2011034814A (ja) 2009-07-31 2009-07-31 発光装置、表示装置、及び、発光装置の製造方法

Publications (2)

Publication Number Publication Date
TW201117639A TW201117639A (en) 2011-05-16
TWI439168B true TWI439168B (zh) 2014-05-21

Family

ID=43526320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099125232A TWI439168B (zh) 2009-07-31 2010-07-30 發光裝置之製造方法

Country Status (5)

Country Link
US (1) US8282436B2 (cg-RX-API-DMAC7.html)
JP (1) JP2011034814A (cg-RX-API-DMAC7.html)
KR (1) KR20110013289A (cg-RX-API-DMAC7.html)
CN (1) CN101989648B (cg-RX-API-DMAC7.html)
TW (1) TWI439168B (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103164791B (zh) * 2011-12-13 2016-04-06 阿里巴巴集团控股有限公司 一种通过电子终端实现安全支付的方法和装置
WO2013111300A1 (ja) * 2012-01-26 2013-08-01 パイオニア株式会社 有機elパネル及びその製造方法
WO2013116779A1 (en) * 2012-02-01 2013-08-08 Futurewei Technologies, Inc. System and method for organizing multimedia content
KR101924606B1 (ko) * 2012-04-27 2018-12-04 삼성디스플레이 주식회사 유기 발광 표시 장치와, 이의 제조 방법
US20130346301A1 (en) * 2012-06-22 2013-12-26 Paychief Llc. Systems and methods for billing via a symbology
JP2014222642A (ja) * 2013-05-14 2014-11-27 三星ディスプレイ株式會社Samsung Display Co.,Ltd. 有機el表示装置の製造方法及び製造装置
CN104599121B (zh) * 2013-10-30 2017-04-12 腾讯科技(深圳)有限公司 一种信息传输方法、装置和系统
WO2015133086A1 (ja) * 2014-03-04 2015-09-11 株式会社Joled 有機el表示パネル及び有機el表示装置
CN108251846A (zh) * 2018-01-12 2018-07-06 大连理工大学 一种无掩膜制备图案化润湿性表面的方法
KR102689217B1 (ko) * 2018-12-14 2024-07-26 엘지디스플레이 주식회사 전계발광 표시장치
KR102268603B1 (ko) * 2019-07-10 2021-06-22 세메스 주식회사 기판, 디스플레이 패널 및 기판 제조 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1793650B1 (en) 1998-03-17 2014-03-05 Seiko Epson Corporation Method for manufacturing a flat panel display
JP2002075640A (ja) 2000-08-30 2002-03-15 Dainippon Screen Mfg Co Ltd 有機el表示装置の製造方法およびその製造装置
US6852524B2 (en) * 2001-04-27 2005-02-08 Canon Kabushiki Kaisha Probe carrier, probe fixing carrier and method of manufacturing the same
JP5304417B2 (ja) * 2001-12-18 2013-10-02 セイコーエプソン株式会社 表示装置
US7910271B2 (en) * 2004-10-13 2011-03-22 Sharp Kabushiki Kaisha Functional substrate
EP1666258B1 (en) * 2004-12-01 2011-10-05 FUJIFILM Corporation Repellency increasing structure and method of producing the same, liquid ejection head and method of producing the same, and stain-resistant film
JP2006286309A (ja) * 2005-03-31 2006-10-19 Toppan Printing Co Ltd 有機el表示装置とその製造方法
JP4872288B2 (ja) * 2005-09-22 2012-02-08 凸版印刷株式会社 有機el素子及びその製造方法
JP4175397B2 (ja) * 2006-06-28 2008-11-05 セイコーエプソン株式会社 有機エレクトロルミネセンス装置の製造方法
JP4878228B2 (ja) * 2006-06-28 2012-02-15 大日本スクリーン製造株式会社 テープ剥離装置、塗布システムおよびテープ剥離方法
JP4888268B2 (ja) * 2007-07-23 2012-02-29 セイコーエプソン株式会社 電気光学装置及び電子機器
JP2009026671A (ja) * 2007-07-23 2009-02-05 Seiko Epson Corp 電気光学装置、電子機器、電気光学装置の製造方法
JP2009070899A (ja) * 2007-09-11 2009-04-02 Sharp Corp プラズマ処理装置およびプラズマ処理方法
JP4497185B2 (ja) * 2007-09-18 2010-07-07 カシオ計算機株式会社 表示装置の製造方法
JP5131446B2 (ja) * 2007-09-19 2013-01-30 カシオ計算機株式会社 表示パネル及びその製造方法
JP2010080086A (ja) * 2008-09-24 2010-04-08 Sumitomo Chemical Co Ltd パターン塗布用基板および有機el素子
JP2010176938A (ja) * 2009-01-28 2010-08-12 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法、及び電子機器

Also Published As

Publication number Publication date
KR20110013289A (ko) 2011-02-09
US20110025189A1 (en) 2011-02-03
TW201117639A (en) 2011-05-16
US8282436B2 (en) 2012-10-09
CN101989648A (zh) 2011-03-23
JP2011034814A (ja) 2011-02-17
CN101989648B (zh) 2014-10-01

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