TWI437063B - A flame retardant adhesive resin composition and an adhesive film using the same - Google Patents

A flame retardant adhesive resin composition and an adhesive film using the same Download PDF

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Publication number
TWI437063B
TWI437063B TW097119551A TW97119551A TWI437063B TW I437063 B TWI437063 B TW I437063B TW 097119551 A TW097119551 A TW 097119551A TW 97119551 A TW97119551 A TW 97119551A TW I437063 B TWI437063 B TW I437063B
Authority
TW
Taiwan
Prior art keywords
film
resin composition
flame retardant
component
weight
Prior art date
Application number
TW097119551A
Other languages
English (en)
Chinese (zh)
Other versions
TW200911945A (en
Inventor
Shigeaki Tauchi
Tetsunori Satou
Katsuyuki Aida
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW200911945A publication Critical patent/TW200911945A/zh
Application granted granted Critical
Publication of TWI437063B publication Critical patent/TWI437063B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW097119551A 2007-06-05 2008-05-27 A flame retardant adhesive resin composition and an adhesive film using the same TWI437063B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007149100 2007-06-05

Publications (2)

Publication Number Publication Date
TW200911945A TW200911945A (en) 2009-03-16
TWI437063B true TWI437063B (zh) 2014-05-11

Family

ID=40093548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097119551A TWI437063B (zh) 2007-06-05 2008-05-27 A flame retardant adhesive resin composition and an adhesive film using the same

Country Status (3)

Country Link
JP (1) JP5278706B2 (ja)
TW (1) TWI437063B (ja)
WO (1) WO2008149727A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3651624B2 (ja) * 1995-11-21 2005-05-25 日立化成工業株式会社 回路用接続部材
JP2000219851A (ja) * 1999-02-01 2000-08-08 Hitachi Cable Ltd Ｔａｂテープへのフィルム状接着剤の張り付け方法
JP2001237552A (ja) * 2000-02-25 2001-08-31 Kyocera Corp 接着材およびこれを用いた電子部品
JP4434427B2 (ja) * 2000-04-27 2010-03-17 東都化成株式会社 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム
JP4109863B2 (ja) * 2001-12-12 2008-07-02 東海ゴム工業株式会社 フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板
JP4238172B2 (ja) * 2004-03-31 2009-03-11 株式会社有沢製作所 難燃性樹脂組成物及び当該難燃性樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板
JP2006232985A (ja) * 2005-02-24 2006-09-07 Shin Etsu Chem Co Ltd 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート

Also Published As

Publication number Publication date
TW200911945A (en) 2009-03-16
JP5278706B2 (ja) 2013-09-04
JPWO2008149727A1 (ja) 2010-08-26
WO2008149727A1 (ja) 2008-12-11

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MM4A Annulment or lapse of patent due to non-payment of fees