WO2008149727A1 - 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム - Google Patents
難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム Download PDFInfo
- Publication number
- WO2008149727A1 WO2008149727A1 PCT/JP2008/059721 JP2008059721W WO2008149727A1 WO 2008149727 A1 WO2008149727 A1 WO 2008149727A1 JP 2008059721 W JP2008059721 W JP 2008059721W WO 2008149727 A1 WO2008149727 A1 WO 2008149727A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- flame
- retardant adhesive
- adhesive resin
- cured
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
硬化前のフィルム状態においてワレ、ハガレなどがなく作業性に優れ、硬化後のピール接着力、ハンダ耐熱性、フロー性等の接着剤特性に優れ、非ハロゲン化を実現した難燃性の接着剤樹脂組成物を提供する。また、これを使用して得られるボンディングシート及びカバーレイフィルムを提供する。 この難燃性接着剤樹脂組成物は、(A)フェノキシ樹脂、(B)エポキシ樹脂、(C)硬化剤、並びに(D)硬化促進剤を必須成分として含有し、硬化剤の活性水素当量が20~30であり、難燃性接着剤樹脂組成物100重量部中に、有機リン化合物又はリン含有フェノキシ樹脂をリンとして0.5~5重量部を含有し、且つ該樹脂組成物の熱硬化後ガラス転移温度が100°C以上である。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009517809A JP5278706B2 (ja) | 2007-06-05 | 2008-05-27 | 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-149100 | 2007-06-05 | ||
JP2007149100 | 2007-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008149727A1 true WO2008149727A1 (ja) | 2008-12-11 |
Family
ID=40093548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059721 WO2008149727A1 (ja) | 2007-06-05 | 2008-05-27 | 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5278706B2 (ja) |
TW (1) | TWI437063B (ja) |
WO (1) | WO2008149727A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143252A (ja) * | 1995-11-21 | 1997-06-03 | Hitachi Chem Co Ltd | 回路用接続部材 |
JP2000219851A (ja) * | 1999-02-01 | 2000-08-08 | Hitachi Cable Ltd | Tabテープへのフィルム状接着剤の張り付け方法 |
JP2001237552A (ja) * | 2000-02-25 | 2001-08-31 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
JP2001310939A (ja) * | 2000-04-27 | 2001-11-06 | Toto Kasei Co Ltd | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
JP2003176470A (ja) * | 2001-12-12 | 2003-06-24 | Tokai Rubber Ind Ltd | フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
JP2005290229A (ja) * | 2004-03-31 | 2005-10-20 | Arisawa Mfg Co Ltd | 難燃性樹脂組成物及び当該難燃性樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板 |
JP2006232985A (ja) * | 2005-02-24 | 2006-09-07 | Shin Etsu Chem Co Ltd | 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート |
-
2008
- 2008-05-27 JP JP2009517809A patent/JP5278706B2/ja not_active Expired - Fee Related
- 2008-05-27 WO PCT/JP2008/059721 patent/WO2008149727A1/ja active Application Filing
- 2008-05-27 TW TW097119551A patent/TWI437063B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143252A (ja) * | 1995-11-21 | 1997-06-03 | Hitachi Chem Co Ltd | 回路用接続部材 |
JP2000219851A (ja) * | 1999-02-01 | 2000-08-08 | Hitachi Cable Ltd | Tabテープへのフィルム状接着剤の張り付け方法 |
JP2001237552A (ja) * | 2000-02-25 | 2001-08-31 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
JP2001310939A (ja) * | 2000-04-27 | 2001-11-06 | Toto Kasei Co Ltd | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
JP2003176470A (ja) * | 2001-12-12 | 2003-06-24 | Tokai Rubber Ind Ltd | フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
JP2005290229A (ja) * | 2004-03-31 | 2005-10-20 | Arisawa Mfg Co Ltd | 難燃性樹脂組成物及び当該難燃性樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板 |
JP2006232985A (ja) * | 2005-02-24 | 2006-09-07 | Shin Etsu Chem Co Ltd | 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート |
Also Published As
Publication number | Publication date |
---|---|
TW200911945A (en) | 2009-03-16 |
JP5278706B2 (ja) | 2013-09-04 |
JPWO2008149727A1 (ja) | 2010-08-26 |
TWI437063B (zh) | 2014-05-11 |
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