TWI435864B - 鹽起始劑 - Google Patents

鹽起始劑 Download PDF

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Publication number
TWI435864B
TWI435864B TW096137050A TW96137050A TWI435864B TW I435864 B TWI435864 B TW I435864B TW 096137050 A TW096137050 A TW 096137050A TW 96137050 A TW96137050 A TW 96137050A TW I435864 B TWI435864 B TW I435864B
Authority
TW
Taiwan
Prior art keywords
group
compound
acid
alkyl
substituted
Prior art date
Application number
TW096137050A
Other languages
English (en)
Chinese (zh)
Other versions
TW200831452A (en
Inventor
Pascal Hayoz
Jean-Luc Birbaum
Stephan Ilg
Original Assignee
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Sc Holding Ag filed Critical Ciba Sc Holding Ag
Publication of TW200831452A publication Critical patent/TW200831452A/zh
Application granted granted Critical
Publication of TWI435864B publication Critical patent/TWI435864B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
    • C07C381/12—Sulfonium compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/14—The ring being saturated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
TW096137050A 2006-10-04 2007-10-03 鹽起始劑 TWI435864B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06121699 2006-10-04

Publications (2)

Publication Number Publication Date
TW200831452A TW200831452A (en) 2008-08-01
TWI435864B true TWI435864B (zh) 2014-05-01

Family

ID=37865787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137050A TWI435864B (zh) 2006-10-04 2007-10-03 鹽起始劑

Country Status (7)

Country Link
US (1) US8012672B2 (enExample)
EP (1) EP2125713B1 (enExample)
JP (1) JP5290183B2 (enExample)
CN (1) CN101522613B (enExample)
AT (1) ATE554065T1 (enExample)
TW (1) TWI435864B (enExample)
WO (1) WO2008040648A1 (enExample)

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CN101952248B (zh) 2007-10-10 2014-04-16 巴斯夫欧洲公司 锍盐引发剂
US8652752B2 (en) 2007-10-10 2014-02-18 Basf Se Sulphonium salt initiators
US20100297541A1 (en) * 2007-10-10 2010-11-25 Basf Se Sulphonium salt initiators
KR20110025211A (ko) * 2008-06-12 2011-03-09 바스프 에스이 술포늄 유도체 및 잠재성 산으로서의 그의 용도
EP2291872A1 (en) 2008-06-27 2011-03-09 Universal Display Corporation Cross linkable ionic dopants
JP5398246B2 (ja) * 2008-12-10 2014-01-29 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法
EP2199856B1 (en) * 2008-12-18 2013-08-07 Agfa Graphics N.V. Cationic radiation curable compositions
WO2010141594A1 (en) * 2009-06-02 2010-12-09 Massachusetts Institute Of Technology Coatings
JP5387181B2 (ja) * 2009-07-08 2014-01-15 信越化学工業株式会社 スルホニウム塩、レジスト材料及びパターン形成方法
WO2011104127A1 (en) 2010-02-24 2011-09-01 Basf Se Latent acids and their use
CN102566277B (zh) * 2010-12-21 2013-11-06 北京师范大学 一种用于高感度光聚合版材的阳离子聚合成像组合物
US8816211B2 (en) * 2011-02-14 2014-08-26 Eastman Kodak Company Articles with photocurable and photocured compositions
JP5993626B2 (ja) * 2011-06-24 2016-09-14 住友化学株式会社 塩及び着色硬化性組成物
KR101263673B1 (ko) * 2011-08-03 2013-05-22 금호석유화학 주식회사 술포늄 화합물, 광산발생제 및 레지스트 조성물
TW201335295A (zh) 2011-11-30 2013-09-01 西克帕控股公司 經標記之塗層組成物及其認證之方法
JP6120574B2 (ja) * 2012-01-31 2017-04-26 キヤノン株式会社 感光性ネガ型樹脂組成物、微細構造体、微細構造体の製造方法及び液体吐出ヘッド
WO2014019163A1 (en) 2012-08-01 2014-02-06 Sicpa Holding Sa Optically variable security threads and stripes
BR112015006556B1 (pt) 2012-10-29 2022-01-18 Sicpa Holding Sa Verniz de proteção curável por radiação e uso do mesmo, documento de segurança, processo para fazer o mesmo, método para conferir resistência à sujeira a um documento de segurança e uso dos um ou mais compostos de perfluoropoliéter de terminação dihidroxil
JP5638106B2 (ja) * 2013-05-08 2014-12-10 東京応化工業株式会社 新規な化合物および酸発生剤
JP6621271B2 (ja) * 2014-09-26 2019-12-18 東京応化工業株式会社 ビニル基含有化合物を含有する硬化性組成物
TW201703879A (zh) 2015-06-02 2017-02-01 西克帕控股有限公司 用於生產光學效應層之製程
CN107850848B (zh) * 2015-07-23 2021-06-04 三菱瓦斯化学株式会社 化合物及其制造方法
EP3185655B8 (de) * 2015-12-22 2024-01-03 Heraeus Electronics GmbH & Co. KG Verfahren zur individuellen codierung von metall-keramik-substraten
CN105712917B (zh) * 2016-03-29 2017-12-26 同济大学 具有光引发剂与光敏化剂双重功能的共轭型硫鎓盐光引发剂、制备方法及其应用
CN107698477B (zh) 2016-08-08 2020-05-12 常州强力电子新材料股份有限公司 一种新型阳离子型光引发剂及其制备方法和应用
CN109456242B (zh) 2017-09-06 2021-02-12 常州强力电子新材料股份有限公司 硫鎓盐光引发剂、其制备方法、包含其的光固化组合物及其应用
US11369682B2 (en) * 2018-04-25 2022-06-28 Noxsano Inc. Light activated gasotransmitter generating compositions
DK3794083T3 (da) 2018-05-15 2022-09-12 Sicpa Holding Sa Maskinlæsbare sikkerhedsfunktioner
JP7407524B2 (ja) * 2018-05-28 2024-01-04 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、化合物、酸発生剤及び化合物の製造方法
CN111978228B (zh) * 2019-05-22 2021-10-12 中国科学院理化技术研究所 基于硫鎓盐的单分子树脂产酸剂及其光刻胶组合物
CN111978224B (zh) * 2019-05-22 2022-10-28 中国科学院理化技术研究所 含硫单分子树脂及其光刻胶组合物
TWI829917B (zh) 2019-05-28 2024-01-21 瑞士商西克帕控股有限公司 安全性墨水以及機器可讀式安全性特徵
CN112794649B (zh) * 2021-02-11 2022-07-05 福州大学 一种防雾薄膜及其制备方法
JP2022123840A (ja) * 2021-02-12 2022-08-24 住友化学株式会社 カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法
JP7790991B2 (ja) * 2021-02-12 2025-12-23 住友化学株式会社 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法
CN112961085B (zh) * 2021-02-18 2022-02-01 同济大学 Led可激发分子内敏化型硫鎓盐类化合物及制备方法和应用
AR130228A1 (es) 2022-08-23 2024-11-20 Sicpa Holding Sa Composición de tinta de seguridad y característica de seguridad legible por máquina derivada de la misma
CN117658882A (zh) * 2022-08-26 2024-03-08 中国科学院理化技术研究所 基于多硫鎓盐的单分子树脂及其光刻胶组合物
KR20250042818A (ko) * 2022-08-31 2025-03-27 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
JP2024151731A (ja) 2023-04-13 2024-10-25 信越化学工業株式会社 分子レジスト組成物及びパターン形成方法
CN117326999B (zh) * 2023-09-12 2025-11-18 辽宁靖帆新材料有限公司 一种二苯基[4-(苯硫基)苯基]全氟丁基磺酸锍盐的合成方法
WO2026063444A1 (ja) * 2024-09-18 2026-03-26 富士フイルム和光純薬株式会社 トリアリールスルホニウム化合物の製造方法

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Also Published As

Publication number Publication date
JP5290183B2 (ja) 2013-09-18
US20100087563A1 (en) 2010-04-08
US8012672B2 (en) 2011-09-06
JP2010505787A (ja) 2010-02-25
EP2125713A1 (en) 2009-12-02
TW200831452A (en) 2008-08-01
WO2008040648A1 (en) 2008-04-10
EP2125713B1 (en) 2012-04-18
ATE554065T1 (de) 2012-05-15
CN101522613A (zh) 2009-09-02
CN101522613B (zh) 2013-03-06

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MM4A Annulment or lapse of patent due to non-payment of fees